Electronic pouring sealant with high sealing performance, high temperature resistance, high toughness and high flame retardance

A technology with high temperature resistance and high toughness, which is applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., and can solve problems such as poor sealing and moisture resistance, high colloidal hardness, and poor heat resistance.

Inactive Publication Date: 2021-05-18
江苏天康电子合成材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing epoxy resin electronic potting glue has poor heat resistance, poor sealing performance and moisture-proof ability. After curing, the colloid has high hardness and brittleness, which is easy to damage electronic components, increases the defective rate of electronic components after potting, and reduces electronic components. service life

Method used

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Examples

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Embodiment Construction

[0011] In view of the deficiencies in the prior art, this case can propose the technical scheme of the present invention through long-term research and a large amount of practice.

[0012] The high-sealing, high-temperature-resistant, high-toughness, and high-flame-retardancy electronic potting compound provided in the examples of the present invention is formed by mixing component A and a fumed silica curing agent at a weight ratio of 95:5. The component A It consists of the following raw materials in weight ratio: 30-40 parts of epoxy resin, 30-50 parts of aluminum hydroxide, 10-20 parts of toughening agent and 0.2-1.5 parts of defoamer. Surface active treatment, fumed silica curing agent can shorten the curing time of epoxy resin, and the curing temperature can be cured at room temperature or heated, which can significantly improve the sealing performance of electronic components and increase the service life of electronic components. Fumed silica can reduce the internal st...

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Abstract

The invention discloses an electronic pouring sealant with high sealing performance, high temperature resistance, high toughness and high flame retardance. The electronic pouring sealant is formed by mixing a component A and a fumed silica curing agent according to a weight ratio of 95:5, wherein the component A is prepared from the following raw materials in parts by weight: 30-40 parts of an epoxy resin, 30-50 parts of aluminum hydroxide, 10-20 parts of a toughening agent and 0.2-1.5 parts of a defoaming agent, wherein the epoxy resin is one or a mixture of several of bisphenol A type epoxy resin, alicyclic epoxy resin, phenol formaldehyde epoxy resin, bisphenol F type epoxy resin and glycidyl amine type epoxy resin, and the toughening agent is low-molecular-weight polyethylene glycol ether, polynonyl dianhydride, carboxyl-terminated liquid nitrile rubber or hydroxyl-terminated liquid nitrile rubber. The electronic pouring sealant is good in heat resistance, high in sealing performance, waterproof and oil-proof capacity and low in volume shrinkage rate, has toughness after curing, cannot damage electronic components, improves the yield of the electronic components after potting, and prolongs the service life of the electronic components.

Description

technical field [0001] The invention relates to the technical field of electronic potting glue, in particular to an electronic potting glue with high sealing performance, high temperature resistance, high toughness and high flame retardancy. Background technique [0002] In recent years, with the development of electronic and electrical materials in the direction of miniaturization, integration, ultra-thinning, high performance and high reliability, people have higher and higher performance requirements for electronic potting adhesives. Waterproof, moistureproof, dustproof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance, and shockproof. There are many types of electronic potting adhesives, mainly including: thermal conductive potting adhesives, epoxy resin potting adhesives, silicone potting adhesives, polyurethane potting adhesives, and LED potting adhesives. The existing epoxy resin electronic potting glue has poor heat resistan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08
CPCC09J163/00C09J11/04C09J11/08C08L2201/02C08L2201/22C08L2201/08C08L2203/206C08K2003/2227C08L71/02C08L13/00C08L15/00C08K3/22C08K7/26
Inventor 李康李松林
Owner 江苏天康电子合成材料有限公司
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