Epoxy resin composition, and prepreg and copper foil-clad laminated sheet prepared by using epoxy resin composition

A technology of epoxy resin and prepreg, which is applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., and can solve the problems of low glass transition temperature, low dielectric loss tangent, reduced water absorption, and low water absorption. , to achieve excellent dielectric properties, low water absorption, good heat and humidity resistance

Active Publication Date: 2013-01-02
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In the above existing patent technologies, although it is proposed that the use of active ester as epoxy resin can improve the moisture resistance of the cured product, reduce the water absorption rate, and reduce the dielectric constant and dielectric loss value of the cured product, but its disadvantage is that it is difficult to resist A good balance is achieved between thermal and dielectric properties, so that the cured product has a high glass transition temperature and a low dielectric loss tangent at the same time, and its dielectric properties are relatively stable with frequency changes, and the water absorption rate is higher. Low
At the same time, no research has been done on how to realize the halogen-free flame retardancy of cured products

Method used

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  • Epoxy resin composition, and prepreg and copper foil-clad laminated sheet prepared by using epoxy resin composition
  • Epoxy resin composition, and prepreg and copper foil-clad laminated sheet prepared by using epoxy resin composition
  • Epoxy resin composition, and prepreg and copper foil-clad laminated sheet prepared by using epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] Take a container, add 100 parts by weight of naphthol type novolac epoxy resin NC-7300L (Nippon Kayaku Corporation, EEW is 214g / eq), and then add 105 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC , solid content 65%) and stir evenly, then add 30 parts by weight of flame retardant aluminum phosphate (Clariant company, phosphorus content is 23%), then add 0.075 parts by weight of curing accelerator DMAP, and solvent toluene, continue to stir evenly Serve as glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to prepare a prepreg. Use several prepared prepregs to stack each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper-clad laminate. The curing temperature is 150-250 ° C, and the curing pressure is 25-60Kg / cm 2 , The curing time is 90min.

Embodiment 2

[0090] Take a container, add 100 parts by weight of naphthol type novolac epoxy resin NC-7000L (Nippon Kayaku Corporation, EEW is 232g / eq), and then add 95 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC , solid content 65%) and stir evenly, then add 30 parts by weight of flame retardant aluminum phosphate (Clariant company, phosphorus content is 23%), then add 0.075 parts by weight of curing accelerator DMAP, and solvent toluene, continue to stir evenly Serve as glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to prepare a prepreg. Use several prepared prepregs to stack each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper-clad laminate. The curing temperature is 150-250 ° C, and the curing pressure is 25-60Kg / cm 2 , The curing time is 90min.

Embodiment 3

[0092]Take a container, add 100 parts by weight of naphthol type novolak epoxy resin HP-5000 (Japan DIC company, EEW is 250g / eq), and then add 90 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC company, solid content 65%) and stir evenly, then add 35 parts by weight of flame retardant phosphate aluminum salt (Clariant company, phosphorus content is 23%), then add 0.075 parts by weight of curing accelerator DMAP, and solvent toluene, continue to stir evenly into glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to prepare a prepreg. Use several prepared prepregs to stack each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper-clad laminate. The curing temperature is 150-250 ° C, and the curing pressure is 25-60Kg / cm 2 , The curing time is 90min.

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Abstract

The present invention relates to an epoxy resin composition, and a prepreg and a copper foil-clad laminated sheet prepared by using the epoxy resin composition. The epoxy resin composition comprises the following components: (A) an epoxy resin containing two or more than two epoxy groups, (B) an active ester curing agent, and (C) a phosphate compound. According to the epoxy resin composition of the present invention, the epoxy resin having a specific molecular structure is adopted, and functionality is high, such that the resulting cured product has characteristics of high glass transition temperature and low moisture absorption; the active ester is adopted as a curing agent, such that the advantage of the active ester is completely provided, wherein the advantage comprises that no polar group is produced when the active ester reacts with the epoxy resin so as to provide excellent dielectric property and good moisture heat resistance; with application of the active ester as the curing agent, water absorption of the phosphorous-containing component can be further improved, a water absorption rate and a dielectric loss value of the cured resin material can be reduced, and purposes of no halogen, fire retardation and good moisture heat resistance can be concurrently achieved; and the prepreg and the copper foil-clad laminated sheet in the present invention have characteristics of no halogen, fire retardation, excellent dielectric property and excellent moisture heat resistance.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition and a prepreg and a copper-clad laminate made of the epoxy resin composition. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. In addition to maintaining higher requirements for the heat resistance of laminate materials, their dielectric constant and dielectric The loss value requirement will be lower and lower. The existing traditional FR-4 is difficult to meet the high-frequency and high-speed development needs of electronic products. At the same time, the substrate material no longer plays the role of mechanical support in the traditional sense, but will become the designer of PCB and terminal manufacturers together with electronic components. An important way to improve product performance. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/42B32B15/092B32B27/04
CPCC08G59/42C08L63/00C08K5/5313C08G59/3218H05K1/0326H05K2201/012H05K2201/0209B32B15/14B32B15/20B32B2260/021B32B2260/046B32B2307/204B32B2307/306Y10T428/31678H05K1/0373
Inventor 曾宪平任娜娜周彪
Owner GUANGDONG SHENGYI SCI TECH
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