6504 results about "Bis epoxide" patented technology

The invention discloses a toughened epoxy resin and a curing method thereof, and relates to the technical field of epoxy resins, the toughened epoxy resin comprises the following components: 100 parts of an epoxy resin matrix, specifically a mixture of bisphenol A epoxy resin and alicyclic epoxy resin, 5-35 parts of a composite amine curing agent, and 5-20 parts of a nano toughening agent, in particular to core-shell rubber particles grafted with epoxy groups on the surfaces, the core layer of each core-shell rubber particle is cross-linked polybutadiene, the shell layer of each core-shell rubber particle is polymethyl methacrylate, 0.5-3 parts of an accelerant comprising a bi-component synergistic accelerant, 1-5 parts of an interface enhancer, and a mixture of gamma-glycidyl ether oxypropyl trimethoxy silane and a titanate coupling agent, a bisphenol A type epoxy resin and a specific proportion of alicyclic epoxy resin are combined to construct an epoxy resin matrix according to a mass ratio of 2: 1, the epoxy resin matrix is matched with a composite amine curing agent prepared by carrying out a special three-step reaction on long-chain polyether diamine, aromatic diamine and anhydride, and key parameters such as molecular weight, functionality and molar ratio of the components are accurately regulated and controlled.

The invention relates to the field of membrane materials, and discloses an epoxy modified starch-based degradable membrane and a preparation method thereof, the epoxy modified starch-based degradable membrane comprises epoxidized starch, modified nanocellulose and a plasticizer; the modified nano cellulose is prepared by mixing a modified composite filler, a nano cellulose dispersion liquid and a zinc acetate dihydrate aqueous solution; the nano-cellulose dispersion liquid is prepared by adhering polytannic acid formed by oxidation and self-polymerization of tannic acid to the surface of nano-cellulose; the modified composite filler is prepared by performing carboxylation modification on nano titanium dioxide coated fumed silica nanoparticles by using succinic anhydride and gamma-aminopropyltriethoxysilane, then reacting with polyethyleneimine to obtain an aminated composite filler, and finally grafting glycidyl dodecyl dimethyl ammonium chloride to the surface of the aminated composite filler. The prepared film material is high in tensile strength, has certain hydrophobicity, and has good heat resistance, antibacterial property and flame retardant property.

The invention relates to an insulating weather-resistant powder coating and a preparation method thereof, and belongs to the technical field of coatings, and the powder coating comprises composite modified resin, a dual curing agent, a functional filler, a polyacrylate leveling agent, fumed silica, a benzotriazole ultraviolet light absorber, polytetrafluoroethylene wax powder and the like. A core-shell structure of the composite modified resin is designed, high insulativity is kept through a silane modified epoxy core layer, a weather-proof barrier is provided through an acrylic acid shell layer, and the phase separation problem is solved through interface chemical bonding; a dual-curing mechanism is designed, and isocyanate and acrylic hydroxyl react to form an interpenetrating network while an epoxy core layer is cured by anhydride; a filler synergistic effect is designed, silane coupling agent modified nano boron nitride forms a three-dimensional heat-conducting insulating network, and rutile type titanium dioxide is coated with silicon dioxide, so that ultraviolet aging is resisted. All the components cooperate with one another, so that the coating has excellent insulativity, weather resistance, adhesiveness and the like at the same time.

The invention discloses a method for preparing a heat-expanding epoxy foam with electromagnetic shielding properties. In the process of processing the heat-expanding epoxy foam with epoxy resin as a substrate, before curing and foaming treatment, a conductive filler with heat-expanding microspheres grafted on the surface is added to the system. After the processing is completed, the heat-expanding epoxy foam with electromagnetic shielding properties is obtained; the minimum foaming temperature of the heat-expanding microspheres is 110-120°C, and the maximum foaming temperature is 140-150°C; the temperature of the curing and foaming treatment is 15-25°C higher than the minimum foaming temperature of the heat-expanding microspheres; during the curing and foaming treatment, the viscosity of the epoxy resin is less than 1Pa·s. The method of the invention solves the problem that the conductive filler is difficult to disperse in the resin matrix innovatively by introducing heat-expanding microspheres on the surface of the conductive filler. The obtained heat-expanding epoxy foam with electromagnetic shielding properties has good electromagnetic shielding performance and high use value and economic benefits.

The invention relates to the technical field of metal surface protection, and discloses a corrosion-resistant self-repairing metal fastener and a preparation method thereof.The corrosion-resistant self-repairing metal fastener comprises a zinc alloy matrix, a nanometer passivation layer, a slow-release corrosion-resistant layer and a self-repairing functional layer, and the nanometer passivation layer, the slow-release corrosion-resistant layer and the self-repairing functional layer sequentially wrap the zinc alloy matrix; the zinc alloy matrix consists of Al, Cu, Mg, Ce and Zn; the nano passivation layer adopts zinc phosphate / silane composite sol to construct a Si-O-P covalent bond network, and plasma is combined to graft epoxy groups to enhance the interface bonding strength; the slow-release anti-corrosion layer is used for loading a pH response type benzotriazole derivative through gradient aperture mesoporous silica, so that the dynamic controlled release of a corrosion inhibitor is realized; the self-repairing functional layer adopts a synergistic effect of a mechanical triggering type sulfydryl siloxane microcapsule and a pH triggering type EDTA chelating agent microcapsule to form a physical plugging-chemical passivation dual-mode repairing mechanism. Through four-stage cooperation of matrix modification, interface strengthening, slow-release regulation and control and intelligent repair, the corrosion resistance of the corrosion-resistant self-repairing metal fastener in a complex environment is remarkably enhanced.

The invention relates to the technical field of heavy anti-corrosion coatings, in particular to a graphene enhanced epoxy modified organic silicon resin heavy anti-corrosion powder coating. The coating is prepared from the following components in parts by weight: 42 to 58 parts of epoxidized epoxy modified organic silicon resin, 0.8 to 2.5 parts of hydroxylated graphene, 6 to 11 parts of nano zirconium dioxide coated boron nitride, 2.5 to 5.5 parts of lanthanum iso-octoate-titanate composite coupling agent, 1.5 to 3.5 parts of bis (3-triethoxysilylpropyl) disulfide, 4 to 7 parts of polyhedral oligomeric silsesquioxane, 5 to 8 parts of curing agent, 0.8 to 1.8 parts of flatting agent and 0.4 to 0.9 part of defoaming agent. 2.5 to 4.5 parts of polyether-ether-ketone micro powder and 1.2 to 2.8 parts of fluorine-containing phosphate ester. According to the invention, the resin is modified through chemical bridging, the modified graphene and the nano-coated powder are matched to construct a synergistic enhancement system, and the interface bonding is optimized by the composite coupling agent. The coating is excellent in adhesive force, corrosion resistance and mechanical property, good in processing fluidity and high in aging resistance and thermal stability, solves the problem that a traditional product is short in performance, and meets the industrial requirement.

The invention belongs to the technical field of flame-retardant macromolecules, and particularly relates to intrinsic heat-conducting flame-retardant recycled epoxy resin and a preparation method thereof. The preparation method comprises the following steps: (1) carrying out a reaction on diethanol amine and 9, 10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO) to obtain an intermediate A; and (2) carrying out condensation polymerization on the intermediate A and phenylphosphonic acid to prepare the phosphate-terminated polyester flame retardant (PEF). And (3) carrying out epoxidation on 4, 4 '-biphenol to prepare the liquid crystal epoxy precursor LEP. And (4) mixing PEF, LEP and 3, 3 '-dithiodipropionic acid, and heating and curing to prepare the epoxy resin. The prepared epoxy resin has intrinsic heat conduction, flame retardance and efficient recoverability, and is a high polymer material with great potential.

The invention provides a low-warpage and high-stability film sealing adhesive, a preparation method thereof and a chip packaging method. The film sealing adhesive comprises the following components in percentage by mass: 80%-84% of epoxy modified silicon dioxide, 7%-9% of alicyclic epoxy resin, 8%-10% of an anhydride curing agent, 0.1%-0.2% of a dispersing agent, 0.4%-0.6% of a core-shell structure additive, 0.2%-0.3% of a flatting agent and 0.1%-0.2% of carbon black. The proportion of the epoxy modified silicon dioxide, the alicyclic epoxy resin and the anhydride curing agent is adjusted, and the dispersing agent, the core-shell structure additive and the flatting agent are combined, so that the sedimentation of the filler is reduced, and the internal stress of the film sealing adhesive is alleviated, so that the storage stability of the film sealing adhesive is improved, and the warping of the cured film sealing adhesive is reduced; the surface of the film sealing adhesive has good leveling performance after being printed, and the chip packaging yield can be improved.

The embodiment of the invention discloses an epoxy molding compound, an epoxy molding film and an electronic component, the epoxy molding compound comprises epoxy resin and a zeolite imidazole framework material, and the zeolite imidazole framework material comprises imidazole ligands and metal ions. The zeolite imidazole framework material is used as a curing agent and a nano reinforced phase, imidazole groups on the surface of the zeolite imidazole framework material can be subjected to a ring-opening reaction with epoxy resin to form covalent bonds, the zeolite imidazole framework material can induce the epoxy resin to generate a microcrack deflection mechanism, and the zeolite imidazole framework material can promote curing of the epoxy resin, so that the epoxy resin is cured, and the curing effect is improved. Therefore, the thermal expansion coefficient of the epoxy molding compound is reduced, the fracture toughness of the epoxy resin is improved, and the thermal stability of the epoxy molding compound is improved.

The invention relates to the field of adhesives, in particular to a structural adhesive epoxy composition and a preparation method thereof. The structural adhesive epoxy composition is prepared from the following raw materials: epoxy resin, a toughening agent, a reinforcing agent, filler, a latent curing agent, a latent accelerant, a chemical foaming agent, a physical foaming agent and the like. Finally, the epoxy composition prepared by the invention can be used as a structural adhesive raw material, has ultrahigh expansion rate, low-temperature rapid curing capacity and structural adhesive property, and also has good mechanical properties and excellent comprehensive application effect, so that the complex requirements of the application field of the prior art on the structural adhesive raw material are met.

The invention discloses an epoxy resin-based NTC (Negative Temperature Coefficient) composite material containing ionic liquid and carbon black as well as a preparation method and application of the epoxy resin-based NTC composite material. The preparation method of the material comprises the following steps: mixing the ionic liquid and the epoxy curing agent, heating on a heating table, stirring and mixing at the same time, then adding the epoxy resin, the carbon black, the surfactant and the solvent, mechanically stirring and uniformly mixing, and heating in a vacuum oven to remove the solvent to obtain the material. And then carrying out hot pressing for a certain time through a press vulcanizer at a certain temperature to obtain the epoxy resin-based NTC composite material containing the ionic liquid and the carbon black. The epoxy resin-based NTC composite material containing the ionic liquid and the carbon black has the advantages of high B value, good mechanical strength, high heat conductivity coefficient, high crosslinking density and the like, and the preparation method is simple to operate, mild in reaction condition, low in raw material cost and suitable for large-scale industrial production and application.

The invention discloses a water-based multi-layer degradable self-polishing ship antifouling coating system and a preparation method thereof, and belongs to the field of marine anticorrosion and antifouling materials. The system is composed of a zinc-rich primer, a modified epoxy intermediate paint and a functionalized finish paint. The finish paint takes polyhydroxyalkanoate as a matrix, and integrates a self-stratification modifier capable of forming a silicon-rich top layer during curing and a latent dual-curing system capable of realizing normal-temperature curing through a synergistic effect. According to the present invention, the mixing mechanism of dynamic self-polishing and static fouling release is adopted, and the innovative curing technology is combined, such that the long working life, the excellent mechanical property and the long-acting antifouling ability are achieved. The drawing adhesive force of the system is not lower than 7.9 MPa, and the environment-friendly requirements that the content of volatile organic compounds is smaller than or equal to 50 g / L, and the content of free diisocyanate monomers is smaller than or equal to 0.1 wt% are met.

The invention belongs to the technical field of protective coatings, and discloses an anti-corrosion, wear-resistant and high-temperature-resistant coating as well as a preparation method and application thereof. The coating comprises a primer, a middle transition layer and a finish; the raw materials of the primer comprise a primer material and a primer curing agent component; the primer material comprises modified epoxy phenolic resin, a primer functional filler, a first mixed solvent, a high-temperature-resistant coupling agent and an anti-settling agent; the raw materials of the middle transition layer comprise a middle transition layer material and a middle curing agent component; the materials of the middle transition layer comprise polyimide modified epoxy resin, a wear-resistant filler, a reactive diluent, a carbon nanotube, a first dispersant and a compatilizer; the raw materials of the finishing paint comprise a finishing paint material and a finishing paint curing agent component; the finishing paint material comprises organic silicon modified fluorocarbon resin, finishing paint functional filler, a second mixed solvent, a second dispersing agent and a flatting agent. According to the invention, a resin-based composite coating system is synergistically designed through multi-phase materials, so that optimal balance of corrosion resistance, wear resistance, toughness and high temperature resistance of the coating is realized.

The invention provides a diepoxy alkoxy anthracene photosensitizer, and relates to the field of photopolymerization. The invention further comprises a light-cured resin composition containing the diepoxy alkoxy anthracene photosensitizer, a light-sensitive dry film containing the diepoxy alkoxy anthracene photosensitizer and application of the light-cured resin composition and the light-sensitive dry film. The photosensitizer provided by the invention has the characteristics of low migration before curing and low precipitation after curing, and is excellent in photosensitive property and high in photobleaching efficiency; the polymer can be widely applied to the fields of photopolymerization and photocuring of dry films, paints, coatings, printing ink, forming materials and the like; in a photosensitive dry film, the photosensitizer cannot migrate to a polyethylene film, and when an electroplating process is carried out after exposure and development, fragments cannot be separated out to pollute electroplating liquid, so that undesirable phenomena of short circuit, open circuit and the like of an anti-corrosion pattern are avoided, and the yield of a product is remarkably improved.

The invention discloses a glue solution for a copper-clad plate and a preparation method of the glue solution, and relates to the technical field of copper-clad plates. According to the prepared glue solution for the copper-clad plate, the composite epoxy resin, the curing agent, the accelerant, the solvent, the flexibilizer and the inorganic filler, the composite epoxy resin comprises bisphenol A epoxy resin, epoxy phenyl polysiloxane, itaconic acid polyaryletherketone and hydroxyl-terminated fluorine-containing vinyl polysiloxane, so that the interface bonding force with the copper plate is enhanced; the dielectric constant and the dielectric loss are effectively reduced, the peel strength and the toughness of the material are also remarkably improved, and the toughening agent is modified polyether sulfone microspheres; the modified polyethersulfone microspheres are prepared by coating polyethersulfone microspheres with hexamethylenediamine tetrapropionamide diamine, the hexamethylenediamine tetrapropionamide diamine is prepared by carrying out acylation condensation reaction on hexamethylenediamine tetramethyl propionate and ethylenediamine, and the polyethersulfone microspheres are prepared by carrying out electrostatic spinning on a spinning solution of polyethersulfone and vinylpyridine, so that the peel strength of the glue solution is remarkably improved.

The invention discloses a water-borne epoxy resin coating which comprises a component A and a component B, the component A is prepared from 60 to 80 parts of 50 percent modified water-borne epoxy resin emulsion, 5 to 15 parts of deionized water, 0.5 to 1 part of wetting dispersant, 0.2 to 0.8 part of defoaming agent, 5 to 10 parts of modified zinc phosphate, 3 to 5 parts of ion exchange antirust pigment, 4 to 6 parts of sericite powder, 3 to 5 parts of glass flake, 5 to 10 parts of precipitated barium sulphate, 1 to 5 parts of nano silicon dioxide and 0.5 to 1 part of rheological additive; 1 to 2 parts of modified organic bentonite slurry; 0.1 to 0.3 part of a pH conditioning agent; and 0.2 to 0.8 part of a flash rust inhibitor. The component B is prepared from 40 to 50 parts of waterborne epoxy-amine adduct, 20 to 30 parts of 50 percent modified polyamide curing agent, 5 to 15 parts of 60 percent Mannich base phenolic aldehyde amine curing agent, 0.5 to 1.5 parts of epoxy silane coupling agent, 1 to 2 parts of nonionic surfactant and 15 to 20 parts of deionized water. The emulsion stability of the waterborne epoxy resin coating is improved through a bisphenol A / F mixed epoxy emulsion and a grafted polyethylene glycol hydrophilic chain segment.

The embodiment of the invention provides an epoxy molding compound testing method and system based on production state monitoring, and belongs to the technical field of material mechanics detection. The method comprises the steps that whether sampling is triggered or not is judged based on a state vector S; feeding the powder sample into a micro cylinder test cavity; performing isothermal locking on the powder sample in the micro cylinder test cavity to obtain a corresponding force-displacement curve, a dead load relaxation curve and an unloading recovery curve; and determining a corresponding mechanical property index based on a force-displacement curve, a dead load relaxation curve and an unloading recovery curve, and combining the mechanical property index with the state vector S to execute threshold adaptive regression so as to generate a detection result of the current batch of epoxy molding compound. According to the scheme, the production state monitoring data and the mechanical test result are combined, so that the accurate judgment of the batch quality of the epoxy molding compound and the self-adaptive optimization of the process parameters are realized.

The invention relates to the technical field of corrosion resistance, in particular to a corrosion-resistant and wear-resistant copper insert and a preparation method thereof.The copper insert is subjected to plating treatment in an ionic liquid electroplating mode, then the surface of a plating layer is subjected to hole sealing treatment, and a nickel-copper-composite halloysite nanotube layer is electrically deposited on the surface of the formed copper insert; the preparation method comprises the following steps: taking a halloysite nanotube as a nano loader of a corrosion inhibitor, and coating with dopamine to obtain a composite halloysite nanotube; in the hole sealing liquid, the composite halloysite nanotube is used as a filler, silane modified polyurethane is used as a base material, the silane modified polyurethane is a prepolymer synthesized by using isophorone diisocyanate and polytetramethylene ether glycol as raw materials, octylamine ring-opened 3-(2, 3-epoxypropoxy) propyltrimethoxysilane is used as a chain extender, and the silane modified polyurethane is used as the base material. And 2-(perfluorodecyl) ethanol and aminopropyltriethoxysilane are used as end-capping reagents, so as to prepare the high-temperature-resistant coating.

The invention belongs to the technical field of polymer insulating materials, and particularly discloses a high-toughness and high-insulating-strength epoxy insulating material and a preparation method thereof. Single-end amine-terminated straight-chain alkyl groups with different chain lengths in a specific molar ratio are grafted to fluorine-containing epoxy resin to construct a side chain structure, and then a step curing process is adopted to form a three-dimensional cross-linked network with a curing agent under the action of an accelerant. The fracture toughness is remarkably improved by utilizing an epoxy body chain extension effect in a side chain grafting process and a uniform microphase separation structure formed by self-assembly of a long alkyl side chain in a curing process; meanwhile, through the synergistic effect of steric hindrance of a short alkyl side chain and a fluorine atom charge trap, delocalized electron transmission of a benzene ring conjugated structure is inhibited, and the insulating property is synchronously enhanced. Compared with a traditional toughening technology, insulation deterioration caused by toughening modification is effectively avoided, and an epoxy resin material with mechanical reliability and insulation stability is provided for high-voltage electrical equipment.

The invention belongs to the technical field of high polymer chemical materials, and particularly relates to a self-repairing composite waterproof board and a preparation method thereof. The invention relates to a high-temperature-resistant graphene coating which is prepared from the following raw materials: bisphenol A diglycidyl ether, fluorosilane modified nano SiO2, graphene slurry, polydimethylsiloxane, epoxy-terminated polydimethylsiloxane, a urea-formaldehyde prepolymer, a silane coupling agent, sodium dodecyl benzene sulfonate, an FSO-100 fluorocarbon surfactant, a CTBN adhesive, a curing agent, an epoxy accelerator DMP-30 and a diluent. Through the collaborative design of the gradient structure of the hard framework and the soft coating, low-surface-energy filler chemical anchoring, microcapsule local material supplementing and thermal triggering dynamic bond rearrangement, the board obtains balance among the bearing strength, long-term hydrophobicity, weather-proof barrier and repeatable thermal self-repairing; and meanwhile, the common defects that room-temperature self-repairing is difficult to realize, hydrophobic particles are easy to agglomerate, a coating is easy to layer and the like are avoided.

The invention relates to a heat-resistant, water-resistant and flame-retardant backboard composite material as well as a preparation method and application thereof. The heat-resistant, water-resistant and flame-retardant backboard composite material comprises a phosphorus-containing epoxy acrylate oligomer, common epoxy resin, toughened epoxy resin, phosphorus-containing epoxy resin, a filler, an additive flame retardant, a dicyandiamide curing agent, an accelerant, nitrogen-containing phenolic resin, a latent curing agent, a UV absorbent and an antioxidant. The phosphorus content in the material is improved by synthesizing the phosphorus-containing epoxy acrylate oligomer, so that the flame retardant property of the product is improved, and the problem of low flame retardant efficiency caused by direct addition of a phosphorus flame retardant is solved.

The preparation method comprises the following steps: mixing 20-40 parts by mass of substituted hydroxymethyl glycoluril, 45-85 parts by mass of mercaptocarboxylic acid and 0.5-3 parts by mass of an acidic catalyst, stirring and reacting for 1-10 hours at the temperature of 50-150 DEG C under the pressure condition of-0.01 to-0.1 MPa, adding 300-800 parts by mass of an organic solvent for diluting after the reaction is finished, washing and purifying with deionized water, and collecting an organic layer, thereby obtaining the mercaptan curing agent. Concentrating and drying to obtain the mercaptan curing agent. According to the thiol curing agent, the rigid glycoluril group is introduced, so that the rigidity of a cured product structure is improved, and the mechanical property, the adhesive property, the heat resistance and the damp-heat aging resistance of a cured product are improved; four tertiary amine groups in the substituted glycoluril have a certain self-promotion effect on a thiol curing epoxy reaction, and the curing reaction temperature is reduced under the condition that an accelerant is not added; the glycoluril-containing thiol epoxy resin curing agent disclosed by the invention has good application value and development prospect.

The invention discloses a high-toughness seawater low-temperature environment self-repairing epoxy coating as well as a preparation method and application thereof. The preparation method comprises the following steps: providing a modified epoxy adaptive network material; the modified epoxy adaptive network material is prepared from epoxy resin, polyol, diisocyanate and a monomer containing dynamic chemical bonds through a reaction. Providing a modified Ti < 3 > C < 2 > T < x > two-dimensional nanosheet; the modified Ti < 3 > C < 2 > T < x > two-dimensional nanosheet is obtained by modifying Ti < 3 > C < 2 > T < x >-MXene by using dopamine and a modifier containing a quadruple hydrogen bond motif; and mixing the modified epoxy adaptive network material with the modified Ti < 3 > C < 2 > T < x > two-dimensional nanosheets, and carrying out an interface ordered cross-linking reaction, so as to prepare the high-toughness seawater low-temperature environment self-repairing epoxy coating. The high-toughness seawater low-temperature environment self-repairing epoxy coating provided by the invention has multiple types of dynamic chemical bonds, has excellent properties of thermosetting resin and thermoplastic resin, and shows high toughness and self-repairing characteristics.

The invention discloses a preparation method of a crown ether functionalized anti-pollution nanofiltration membrane, which comprises the following steps: soaking a membrane of a commercial nanofiltration membrane in pure water, and coating the surface with a double-end epoxy compound ethanol solution; uniformly coating the surface of the membrane with an aza 12-crown-4 methanol solution; and drying the membrane in an atmosphere of 40-90 DEG C to obtain the crown ether functionalized anti-pollution nanofiltration membrane. The nano-filtration membrane is realized by chemically grafting aza 12-crown-4 on the membrane surface of a commercial nano-filtration membrane by utilizing a double-end epoxy compound; compared with a traditional nanofiltration membrane, the crown ether functionalized nanofiltration membrane provided by the invention has the advantages that the electronegativity of the surface is reduced, and the surface is similar to an aquatic plant molecular brush structure, so that the deposition of pollutants on the surface of the membrane can be effectively improved, and the anti-pollution performance of the membrane is enhanced; meanwhile, due to the complexing effect of 12-crown-4 molecules on lithium ions, the lithium ions can be effectively captured, concentration polarization of the lithium ions on the surface of the diaphragm is improved, and then the magnesium-lithium separation efficiency of the diaphragm is improved.

The invention discloses an interface covalently bonded core-shell structure boron nitride polypropylene composite dielectric material and a method. The interface covalently bonded core-shell structure boron nitride polypropylene composite dielectric material comprises a maleic anhydride grafted polypropylene matrix and a core-shell structure filler dispersed in the maleic anhydride grafted polypropylene matrix, the core-shell structure filler comprises hydroxylated boron nitride nanoparticles covalently grafted on a polymer shell layer on the surface of the core-shell structure filler; the polymer shell layer is polyglycidyl methacrylate; the epoxy group of the polymer shell layer reacts with the anhydride group of the maleic anhydride grafted polypropylene matrix to form a covalent bond. The invention has the characteristics of strong interface bonding force, uniform filler dispersion, and excellent comprehensive electrical properties and processability.

The present invention discloses a low-temperature conductive adhesive, which is prepared by weight using raw materials including 70-80 parts of silver powder, 20-30 parts of resin matrix, 1-10 parts of curing agent, 0.1-0.5 parts of silane coupling agent, 0.1-0.5 parts of stabilizer, and 0.1-0.5 parts of metal salt. The present invention introduces an organic metal salt into the resin matrix to reduce the contact resistance of the colloid, and after wet heat aging, maintains a lower contact resistance increase rate. The present invention adopts a combination of epoxy resin, acrylate and modified epoxy acrylic resin, and the weight of epoxy resin and acrylate is less than or equal to the weight of modified epoxy acrylic resin, so that low-temperature curing can be achieved. The present invention can achieve 60-80 ° C, 20-40 min curing, and the conductive adhesive elongation at break obtained can reach more than 8%, and before and after wet heat aging, there is a more stable and relatively small contact resistance, which is particularly suitable for the electronic field with high requirements for contact resistance.

The invention belongs to the technical field of coatings, and relates to a polysiloxane epoxy hybrid environment-friendly coating and a preparation method thereof. The coating belongs to an environment-friendly solvent type coating with low VOC content, modified epoxy resin is adopted as a base, auxiliaries such as a film-forming agent and a dispersing agent are added, and benzophenone and tertiary amine composite photoinitiator is supplemented, so that the prepared coating has good corrosion resistance, high temperature resistance and the like, and the coating can quickly form a film at normal temperature and under the UV illumination condition, shortens the curing period, and is suitable for large-scale popularization and application. The emission of VOC (volatile organic compounds) is reduced.

The invention relates to a two-component composition as well as a preparation method and application thereof, and belongs to the technical field of woodware seal primers. The double-component composition provided by the invention comprises a component A and a component B, the component A comprises epoxy resin (1a) containing an aromatic ring structure and more than two epoxy groups and silane (1b) containing one epoxy group; in the component A, the weight of the silane (1b) accounts for 18-60 wt% of the total weight of the epoxy resin (1a) and the silane (1b); the component B comprises silane (1c) containing one amino group and substituted phenol (1d) with a specific structure; and in the component B, the weight of the substituted phenol (1d) accounts for 0.3-10 wt% of the total weight of the silane (1c) and the substituted phenol (1d). The double-component composition disclosed by the invention can realize dual curing, is high in crosslinking density, has the advantages of excellent surface effect, sanding property, flexibility, sealing property and wood warming effect, does not contain a solvent or only has low solvent content, and is particularly suitable for woodware seal primer.

The invention discloses a low-warpage damp-heat-resistant liquid epoxy molding compound as well as a preparation method and application thereof. The liquid epoxy molding compound is prepared from the following raw material components in parts by mass: 85 to 90 parts of modified silicon dioxide, 5 to 8 parts of naphthalene type epoxy resin monomer, 5 to 8 parts of anhydride curing agent, 0.1 to 0.3 part of coupling agent, 0.1 to 0.3 part of adhesion promoter and 0.2 to 0.5 part of temperature response type amine catalyst. The modified silicon dioxide is obtained by carrying out surface modification on micron-sized silicon dioxide by adopting a silane coupling agent containing an epoxy group, and the mass of the silane coupling agent containing the epoxy group is 0.3-0.8% of the mass of silicon dioxide. The liquid epoxy molding compound provided by the invention has excellent flowability, adhesive force and heat and humidity resistance, can significantly relieve and reduce the warping of a silicon wafer, and is suitable for integrated circuit packaging.

The invention relates to the technical field of electronic materials, in particular to a preparation method of low-halogen alkali-soluble photosensitive resin and solder resist ink. Comprising the following steps: adding amino resin, alcohol olefin and a catalyst A into a solvent, mixing, and carrying out an ether exchange reaction to obtain an initial etherified product; adding peroxide into the initial etherification product, and carrying out epoxidation reaction to obtain an epoxy resin intermediate; adding an olefine acid compound, a catalyst B and a polymerization inhibitor into the epoxy resin intermediate, and carrying out ring-opening esterification reaction to obtain an epoxy acrylate intermediate; and adding acid anhydride into the epoxy acrylate intermediate, and carrying out carboxylation reaction to obtain the low-halogen alkali-soluble photosensitive resin. The problem of high halogen content of the existing alkali-soluble photosensitive resin is solved, and the solder resist ink prepared from the alkali-soluble photosensitive resin has high sensitivity, high resolution, high heat resistance, high acid and alkali resistance and high electrical insulation property.