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2651 results about "Phenolic aldehyde" patented technology

Phenolic aldehydes are derivatives of phenol. Phenolic aldehydes can be found in wines and cognacs.

Novel fast-set anticorrosion and wear-resistant epoxy powder coating and preparation process thereof

The invention relates to the field of chemical coating, in particular to epoxy powder coating applied to material conveying steel belts in oilfield oil pumping pipelines or coal transportation in the oil industry. In a formula, the coating comprises the following components in percentage by weight: 32-56% of epoxy resin, 8-14% of curing agent, 30-50% of pigments and fillers, 2-10% of resin modifier and 2-6% of assistant, wherein the epoxy resin in the formula is bisphenol A type epoxy resin, a mixture of the bisphenol A type epoxy resin and phenolic aldehyde modified epoxy resin, and phenolic aldehyde modified epoxy resin, and the curing agent is phenolic hydroxyl resin. The epoxy powder coating disclosed by the invention belongs to fast-set anticorrosion and wear-resistant epoxy powder coating, has the granularity being 10-125 mu m, is applied under general curing conditions that the curing temperature is 180-200 DEG C and the curing time is 3-10min, can be regulated according to user needs and is superior to like products in anticorrosion performance, coating film mechanical performance and wear resistance, a preparation process is simple, the labour productivity can be obviously increased, and the epoxy powder coating is suitable for industrialized production.
Owner:JIANGSU LANLING POLYMER MATERIAL CO LTD

Alkylphenol modified phenolic amide curing agent and preparation method thereof

The invention discloses an alkylphenol modified phenolic amide curing agent and a preparation method thereof. The alkylphenol modified phenolic amide curing agent comprises the raw components including phenol or phenol derivatives, methanal or paraformaldehyde, polyamine and fatty acid or fatty acid polymer. The preparation method comprises the following steps of: uniformly mixing the fatty acid or the fatty acid polymer and the polyamine, heating the mixture, cooling the mixture, adding the phenol or the phenol derivatives in the mixture, uniformly mixing the methanal or the paraformaldehyde with the mixture, heating the new mixture, and performing dehydration on the new mixture to obtain the product; or the preparation method comprises the following steps of: uniformly mixing the phenol or the phenol derivatives, the polyamine and the methanal or the paraformaldehyde, heating the mixture, adding the fatty acid or the fatty acid polymer into the mixture, heating the new mixture, and performing the dehydration on the new mixture to obtain the product. The curing agent disclosed by the invention is very strong in salt spray corrosion resistance, is superior to polyamide curing agent and curing agent products of modified phenolic aldehyde amide resin and mixtures of the modified phenolic aldehyde amide resin, and has good impact strength and flexibility as well as excellent water tolerance.
Owner:CARDOLITE CHEM ZHUHAI

Method for preparing polyurethane/phenolic aldehyde foam thermal insulation material

InactiveCN101565541ASolve the shortcoming of crispnessImprove flammability disadvantagesThermal insulationRaw material
The invention provides a method for preparing a polyurethane/phenolic aldehyde foam thermal insulation material and belongs to the field of the foam thermal insulation material. The invention aims to solve the problems of poor fire resistant property and strong brittleness in the prior polyurethane foam and phenolic aldehyde foam respectively. The method comprises the following steps that: a prepolymer of alkali phenolic resin, isocyanate and polyether glycol are used as raw materials, and the prepolymer is added with a surfactant and a foaming agent for free foaming at room temperature to prepare the polyurethane/phenolic aldehyde foam thermal insulation material, wherein the weight ratio of the isocyanate to the alkali phenolic resin is 3-1:1, the consumption of the polyether glycol is 20 to 50 percent of the weight of the isocyanate, the consumption of the surface active agent is 4 to 10 percent of the weight of the alkali phenolic resin, and the consumption of the foaming agent is 1 to 10 percent of the weight of the alkali phenolic resin. The method has the advantages of the suitability for places where the foaming-in-place insulation is necessary, stable process reaction, good operability and easily bought raw materials; and the foam thermal insulation material prepared by the method has the advantages of little surface pulverization, good toughness, good fire resistant property, and the like.
Owner:BEIJING UNIV OF CHEM TECH

Manufacturing method for improving accuracy of PCB (printed circuit board) back drilling hole

The invention discloses a manufacturing method for improving accuracy of a PCB back drilling hole. The manufacturing method comprises the steps as follows: A), a circuit board substrate is subjected to front procedure processing, through-hole drilling, copper deposition, board electroplating, outer circuit pattern transferring, pattern electroplating and the like; B), back drilling is performed on a PCB 4, and whether the depth of the back drilling hole is qualified is detected; and C), a well drilled back drilling hole is subjected to alkaline etching and photosensitive welding resistance, and finally a finished product is manufactured. The technical scheme is characterized in that drill file coefficients used in a through-hole drilling procedure are correspondingly corrected according to expansion and contraction data obtained in a technological process from the through-hole drilling procedure to the drilling procedure of the PCB 4 during back drilling, and the drill file data is maintained to be consistent with actual expansion and contraction; a drilling-in surface in the through-hole drilling procedure is consistent with that during the back drilling; and a phenolic aldehyde base plate 6 is additionally paved on the top surface of the PCB 4. With the adoption of the manufacturing method, the depth accuracy and the position accuracy of a back drilling hole of a conventional PCB 4 can be effectively improved, so that the completeness of signal transmission of the PCB 4 is guaranteed.
Owner:广东依顿电子科技股份有限公司

Phosphorus-containing cardanol-base polyurethane prepolymer modified phenolic foam plastic and preparation method thereof

The invention relates to a phosphorus-containing cardanol-base polyurethane prepolymer modified phenolic foam plastic and a preparation method thereof. The preparation method comprises the following steps: synthesizing cardanol glycidol ether from cardanol and epoxy chloropropane under alkaline conditions, and hydrolyzing under acidic conditions to generate cardanol-base dibasic alcohol; by using the cardanol-base dibasic alcohol as the raw material, dropwisely adding oxydol to react under acidic conditions to obtain the epoxy cardanol-base dibasic alcohol, carrying out reaction on the epoxy cardanol-base dibasic alcohol and a phosphorus-containing flame retardant to obtain phosphorus-containing cardanol-base polylol; carrying out reaction on the phosphorus-containing cardanol-base polylol and isocyanate to obtain a phosphorus-containing cardanol-base polyurethane prepolymer; and mixing the phosphorus-containing cardanol-base polyurethane prepolymer with a phenolic resin, and sequentially adding a surfactant, a foaming agent and a curing agent, thereby obtaining the phosphorus-containing cardanol-base polyurethane prepolymer modified phenolic foam thermal-insulation material. The mechanical properties of the phenolic foam thermal-insulation material are obviously enhanced. The flame-retardant element phosphorus is introduced into the polyurethane prepolymer, thereby solving the problem of degradation of foam flame retardancy due to the carbamate introduced into the phenolic foam.
Owner:INST OF CHEM IND OF FOREST PROD CHINESE ACAD OF FORESTRY

Halogen-free resin composition, prepreg prepared from halogen-free resin composition and laminated board prepared from halogen-free resin composition and used for printed circuit

The invention discloses a halogen-free resin composition, a prepreg prepared from the halogen-free resin composition and a laminated board prepared from the halogen-free resin composition and used for a printed circuit. The halogen-free resin composition comprises alkylphenol epoxy resin, benzoxazine resin, an alkylphenol aldehyde curing agent and a phosphorus-contained flame retardant. The molecular structure of alkylphenol epoxy resin adopted in the halogen-free resin composition contains more branched alkyls, so that the halogen-free resin composition is relatively high in glass transition temperature, low in water absorption rate, favorable in heat resistance and excellent in dielectric performance; benzoxazine resin is mixed, so that the dielectric constant, dielectric loss value and water absorption rate of a solid can be further reduced; alkylphenol aldehyde is used as a curing agent, so that the advantages of excellent dielectric performance and low water absorption rate generated by more alkyls in the structure are sufficiently exerted. The prepreg prepared from the halogen-free resin composition and the laminated board prepared from the halogen-free resin composition and used for the printed circuit have the advantages of low dielectric constant, low dielectric loss factor, low water absorption rate, high size stability, high heat resistance, and favorable flame retardance, processability and chemical resistance.
Owner:江西生益科技有限公司

Method for preparing high phase ratio electric leakage resistant tracking index leadless compatible CEM-3 copper-clad laminate

The invention discloses a method for preparing a high phase ratio electric leakage resistant tracking index leadless compatible composite base copper-clad laminate CEM-3, which comprises the following process steps: using low brominated epoxy resin / phenolic aldehyde as a main curing agent, adding a filling material to prepare core material glue impregnated glass fiber paper, and preparing a core material by making the glass fiber paper in a semi-solidified state at a temperature of between 130 and 210 DEG C; adding aluminum hydroxide or magnesium hydroxide as the filling material into the epoxy resin / phenolic aldehyde to prepare a plus material glue impregnated glass fiber cloth, and preparing the plus material by making the glass fiber cloth in a semi-solidified state at a temperature of between 130 and 210 DEG C; and superposing 1 to 20 sheets of the core material, pasting the plus material on the surface of the core material, cladding a copper foil on the plus material, and performing hot press molding at a temperature of between 80 and 200 DEG C, a pressure of between 10 and 60 Kg / cm and a vacuum degree of -60 mmHg. The CEM-3 copper-clad laminate prepared by the method simultaneously has CT1 more than or equal to 600V, higher heat resistance and excellent CAF resistance, and overcomes the defects that a CEM-3 plate prepared by the prior art has the CT1 between 175 and 249 V and poor heat resistance and CAF resistance, thus the CEM-3 copper-clad laminate is more adaptive to long-term operations under wet conditions and has high heat resistance and electric reliability.
Owner:SHAANXI SHENGYI TECH

Non-methanal environment-friendly type plant protein modified adhesion agent

InactiveCN101319131AMeet emission testing standardsSolve the hazardProtein adhesivesGlue/gelatin preparationFiberRapeseed
The invention relates to a formaldehyde-free environment-friendly vegetable protein modified adhesive, which aims to solve the problem that the prior urea-formaldehyde adhesive, phenolic aldehyde adhesive and melamine aldehyde adhesive release formaldehyde and cause environmental hazard and pollution, etc. The compositions in portion by weight of the modified adhesive are: 30 to 50 portions of natural plant dregs, 5 to 12 portions of basic material, 5 to 10 portions of calcium hydroxide emulsion, 6 to 15 portions of urea, 4 to 10 portions of alkyl sodium sulfate, 2 to 5 portions of 10 to 20 percent of inorganic acid and 90 to 120 portions of deionized water. The invention takes macromolecular proteins in natural plant soybean dregs, peanut dregs, rapeseed dregs, cottonseed dregs, linseed dregs and sunflower seed dregs as raw materials so as to synthesize a new-generation formaldehyde-free environment-friendly vegetable protein modified adhesive through chemical modification. The formaldehyde-free environment-friendly vegetable protein modified adhesive has the characteristics of uniform and stable product, high adhesion strength, hydrolysis resistance and nontoxicity, etc.; moreover, the performance and the price of the modified adhesive are suitable for wood adhesion and for making artificial fiber boards such as plywood, shaving board and fiber board.
Owner:上海世鹏聚氨酯科技发展有限公司
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