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33results about How to "Excellent bonding strength" patented technology

Medium temperature curing high temperature resistant phenolic adhesive

A medium temperature curing high temperature resistant phenolic adhesive relates to an adhesive. The invention solves technical problems of phenolic high curing temperature and weak temperature tolerance of adhesive. The adhesive of the present invention consists of modified phenolic resin solution, toughening agent, curing agent, heat-resistant reinforced resin and filler. The adhesive of the invention has a low curing temperature, can be cured at 100 DEG C and obtain good adhesive strength. Curing at 100 DEG C for 6 hours, the adhesive can reach shear strength of 13.5MP and still have shear strength of 2.3MPa at 1000 DEG C. The adhesive further conducts complex reaction in high temperature usage environment and generates product with better heat resistance, thereby realizing the echelon curing and echelon temperature resistance, which are difficult for other type of high temperature resistant glue to achieve.
Owner:INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI

Battery and ultrasonic bonding method for battery

The present invention provides a battery including a container, an electrode group including a positive electrode and a negative electrode, multiple current collecting tabs being extended from any one of the positive electrode and the negative electrode of the electrode group, and overlapped with one another; a lead bonded to at least one of the current collecting tabs by ultrasonic bonding, a lid configured to close an opening portion of the container, and an external terminal provided on the lid and connected to the at least one current collecting tab via the lead, in which the lead has a cross-sectional area that is increased in a middle of extension of the lead from an ultrasonic-bonded portion to the at least one of the current collecting tabs to the external terminal.
Owner:KK TOSHIBA

Starch adhesive for adhering cartons

The invention discloses a starch adhesive for adhering cartons, which belongs to the technical field of adhesives. The starch adhesive is prepared from the following raw material in part by weight: 100 parts of starch, 3 to 8 parts of hydrogen peroxide, 5 to 12 parts of aqueous solution of sodium hydroxide, 0.2 to 0.8 part of crosslinking agent, 0.01 to 0.05 parts of ferrous sulfate, 10 to 20 parts of catalyst, 0.05 to o.1 part of preservative, 0.2 to 1.2 parts of tackifier, 0.5 to 1 part of tributyl phosphate, 9 to 16 parts of water-proofing agent, 15 to 18 parts of quick drying agent and 450 to 600 parts of water. The starch adhesive has the advantages that: the raw materials are readily available, and the cost is low; the drying speed is high; the waterproof performance is high; stability in storage is ensured; organic solvent and environment pollution are avoided; and the adhesive strength is very high.
Owner:CHANGSHU KAILIDA HONEYCOMB PACKING MATERIALS

High-performance building adhesive

The invention provides a high-performance building adhesive which comprises the following materials by weight: 20-80 parts of polyvinyl alcohol, 5-20 parts of epoxy resin, 0.1-2 parts of polyamide, 4-12 parts of polyacrylamide, 6-12 parts of epoxy diacrylate, 1-5 parts of nonylphenol polyoxyethylene ether, 20-60 parts of ethylene-vinyl acetate emulsion, 0.1-3 parts of initiator, 1-5 parts of octyltrimethoxysilane, 2-4 parts of gamma-methacryloxypropyltrimethoxysilane, 5-10 parts of hydroquinone, 5-10 parts of gypsum powder, 1-5 parts of bentonite, and 400-800 parts of deionized water. The building adhesive has good adhesion performance, high bonding strength, high drying speed, good waterproof performance, mildew resistance, no toxicity and harm, and no environment pollution. Compared with conventional building adhesive, the high-performance building adhesive has good bonding performance, stripping strength above 12 MPa, and tensile shearing strength above 20 MPa.
Owner:广州市百庄复合材料有限公司

Loudspeaker diaphragm and loudspeaker including the loudspeaker diaphragm

A loudspeaker diaphragm according to an embodiment of the present invention includes: a diaphragm portion; and an edge portion, which is molded integrally with the diaphragm portion and made of a material different from a material for the diaphragm portion, wherein: the diaphragm portion includes, at an outer peripheral end thereof, an outer wall portion provided upright in a direction substantially parallel to a vibrating direction of the diaphragm portion; an inner peripheral surface of the edge portion is bonded onto an outer peripheral surface of the outer wall portion; and the outer wall portion has a height larger than a thickness of the diaphragm portion.
Owner:ONKYO KK

Copolymer resin of chloroethylene-isobutyl vinyl ether-glycidyl acrylate and preparation method thereof

The invention discloses a copolymer resin of chloroethylene-isobutyl vinyl ether-glycidyl acrylate and a preparation method thereof. The copolymer resin is obtained by copolymerization of 65-85 mass parts of chloroethylene, 15-30 mass parts of isobutyl vinyl ether and 0.5-5.0% (corresponding to the total mass of chloroethylene and isobutyl vinyl ether) of glycidyl acrylate. The preparation method comprises the following steps: adding the chloroethylene, isobutyl vinyl ether and glycidyl acrylate into aqueous phase containing emulsifier, a water-soluble redox initiation system and pH regulator, and carrying out emulsion polymerization for 3-10 hours at the temperature of 35-60 DEG C. The invention adds glycidyl acrylate into chloric ether resin to improve the heat stability of chloric ether resin and adhesion with metal; and meanwhile, copolymer has uniform composition and has high dissolving speed in solvent, such as sundex and the like.
Owner:HANGZHOU ELECTROCHEM GROUP +1

Formula of putty for inner wall of building

The invention discloses a formula of putty for an inner wall of a building. The formula includes desulfurized gypsum, quartz powder, a modifier, an inorganic gel, a retarder, an anti-cracking agent, and redispersible gelatine powder. The modifier is hydroxypropyl methyl cellulose, the inorganic gel is sodium bentonite, the retarder is polyphosphate, the anti-cracking agent is lignocellulose, and the redispersible gelatine powder is polyvinyl acetate or ethenoid resin. The putty for the inner wall of the building has favorable water resistance and bonding strength and convenient construction, as well as no hollowness, cracking and duslting on a scraped basal plane; and meanwhile, the scraped putty layer has compact structure, ventilation maintaining and natural film forming, therefore, the wall surface is smoother, and the consumption of emulsion paint is saved.
Owner:童捷

Conductive paste and solar cell

An electrically conductive paste which can be formed into an electrode by being fired at relatively low temperatures, which exhibits excellent adhesion strength between a light-receiving surface electrode and a semiconductor substrate, and which can satisfactorily reduce the contact resistance between the two, is provided. The electrically conductive paste used as a material for a light-receiving surface electrode of a solar cell, includes a Ag powder, an organic vehicle, and glass frit, wherein the softening point of the above-described glass frit is 570 DEG C. 760 DEG C., and the glass frit contains B2O3 and SiO2 in such a way that the ratio, B2O3 / SiO2, becomes 0.3 or less on a molar ratio basis and the first contains 0 to less than 20.0 percent by mole of Bi2O3.
Owner:MURATA MFG CO LTD

Welding device

A welding device includes a lower tip and an upper tip, as welding tips, and pressuring members. The pressuring members are supported by a support member disposed in the upper tip. The pressuring members are displaced by the action of pressuring member displacement mechanisms and, together with the upper tip, come into contact with a metal plate arranged on the outermost part of a laminated body.
Owner:HONDA MOTOR CO LTD

Organosilicon polyimide insulation adhesive for LED

The invention discloses an organosilicon polyimide insulation adhesive for an LED. The adhesive includes, by weight, 10 to 40 parts of amino-terminated silicone oil, 10 to 40 parts of anhydride-terminated silicone oil, 5 to 10 parts of polyamino silicone oil, 2 to 5 parts of a silica filling material, 2 to 5 parts of a titanium dioxide filling material and 0.3 to 1.2 parts of an interfacial strengthening agent-silane coupling agent. According to the invention, the advantages of both an organosilicon resin and a polyimide resin are combined together, and an organosilicon polyamide acid prepolymer is synthesized at first and is finally cured to obtain the organosilicon polyimide insulation adhesive; high temperature resistance of the polyimide resin and light transmittance performance of a polysilicone resin are retained, and the insulation adhesive also has excellent high temperature adhesive properties.
Owner:上海本诺电子材料有限公司

Modified waterborne polyaniline epoxy resin coating and preparation method thereof

The invention relates to a modified waterborne polyaniline epoxy resin coating. The modified waterborne polyaniline epoxy resin coating comprises 36-45 parts of epoxy resin, 12-20 parts of hydrochloric acid, 6-15 parts of aniline, 18-30 parts of ammonium persulfate, 9-26 parts of acrylic acid, 2-11 parts of dodecylbenzene sulfonic acid, 6-17 parts of polyamide resin, 25-45 parts of N-allylmethylamine and 22-40 parts of diethanol amine. The modified waterborne polyaniline epoxy resin coating has the advantages that a water-soluble redox system is used for initiating double-bond curing, so that the problems of system emulsion breaking and layering are avoided effectively; the coating is excellent in anti-corrosion performance and highly resistant to scratch and pitting; the coating with excellent physical and chemical performance is excellent in bonding strength for the surfaces of metal and non-metal materials, good in dielectric performance and small in setting shrinkage ratio.
Owner:GUANGXI UNIV

Graphene conductive paste and preparation method thereof

The application relates to the field of conductive pastes, in particular to a graphene conductive paste. The graphene conductive paste comprises the following components, by weight: 1 to 10 parts of epoxy-functionalized graphene, 4 to 15 parts of epoxy resin, 2 to 6 parts of epoxy-modified siloxane, 2 to 6 parts of epoxy reactive diluents, and 0.1 to 0.8 parts of latent curing agents. Furthermore,the graphene conductive paste also includes 5 to 20 pars, by weight, of conductive black modified with a silane coupling agent. In addition, the application also provides a method for preparing the graphene conductive paste. The method includes: carrying out epoxy functionalization of graphene powder; carrying out epoxy modification of siloxane; carrying out mixing and stirring of all components;and carrying out conductive black modification. According to the graphene conductive paste provided by the application, the high dispersibility of graphene and good adhesion of the conductive paste are realized; and with the conductive black, the amount of graphene is reduced and the cost is lowered.
Owner:SHENZHEN HOVERBIRD ELECTRONICS TECH CO LTD

Electroless gold plating liquid for forming gold plating film for wire bonding

Disclosed is an electroless gold plating liquid for forming a gold plating film for wire bonding which is characterized by containing a gold cyanide compound and oxalic acid and / or a salt thereof, but not containing a foundation metal dissolution inhibitor. The gold cyanide compound is preferably contained in an amount of 0.5-10 g / L in terms of gold ion concentration, and the oxalic acid and / or a salt thereof is preferably contained in an amount of 5-50 g / L. Preferably, the electroless gold plating liquid also contains a masking agent for dissolved foundation metal, and the masking agent is preferably composed of ethylenediaminetetraacetic acid and / or a salt thereof.
Owner:恩伊凯慕凯特股份有限公司

Resin Composition

The objective of the invention is to provide a resin composition capable of obtaining excellent heat conduction coefficient and excellent peeling strength on a metal layer, a resin sheet using the resin composition, a circuit substrate and a semiconductor chip package. The solution of the invention is a resin composition which contains: (A) a high-molecular compound with a molecular structure selected from the group consisting of polybutadiene structure, a polysiloxane structure and a poly (methyl ) acrylic ester structure, a polyalkylene structure, a polyalkylene oxide structure and a polyisoprene structure, a polyisobutylene structure and polycarbonate structure, (B) an epoxy resin, (C) a heat-conducting filler, AND (D) an active ester curing agent.
Owner:AJINOMOTO CO INC

Method for producing terminal for electronic component, and terminal for electronic component produced by the production method

The present invention provides a method for producing a terminal for an electronic component, which enables the production of a terminal for an electronic component wherein a lead-free tin-plated lead terminal part and an electrode terminal part that is formed from aluminum are bonded together with excellent bonding strength. Specifically disclosed is a method for producing a terminal for an electronic component, said terminal being obtained by bonding a lead-free tin-plated lead terminal part with an electrode terminal part that is formed from aluminum. In the method, the lead terminal part and the electrode terminal part are arranged at a distance, and a voltage is applied between the lead terminal part and the electrode terminal part, thereby generating a plasma. Then, while melting orsemi-melting the lead-free tin plating by the plasma, one end of the lead terminal part and the axial core of the electrode terminal part are pressed together and percussion welded.
Owner:KOHOKU KOGYO CO LTD

Gas barrier adhesive, film and gas barrier film

A gas barrier adhesive that contains a base material containing a polyester polyol (A), which is a reaction product of a polyol component (D) and an acid component (E1) containing an ortho-directing aromatic dicarboxylic acid or an acid anhydride thereof, and a diluent (C) that is composed of a bi- or higher functional liquid alcohol, and a curing agent containing a polyisocyanate compound (B), and wherein the base material has a viscosity of 10,000 mPa.s or less at 60 DEG C; a film to which this gas barrier adhesive is applied; and a gas barrier film which uses this film.
Owner:DIC CORP

Easy-to-adhere nylon film and preparation method thereof, and nylon-based composite film and preparation method thereof

The invention provides an easy-to-adhere nylon film and a preparation method thereof, and a nylon-based composite film and a preparation method thereof, and belongs to the technical field of packagingmaterials. The easy-to-adhere nylon film comprises a nylon base material layer and an easy-to-adhere layer arranged on at least one surface of the nylon base material layer, wherein the nylon base material layer consists of three layers of co-extrusion biaxially oriented nylon films, namely a first surface layer, a core layer and a second surface layer in sequence from top to bottom; the first surface layer and the second surface layer independently comprise nylon resin, a slipping agent, an anti-blocking agent, an easily-bonded functional material and an antistatic agent; the core layer comprises nylon resin; the easy-to-adhere layer is prepared from the following raw materials through a cross-linking reaction: modified water-based hydroxyl acrylic resin, a nano-silica grafted hyperbranched polymer, an ethylene-maleic anhydride copolymer, a solvent, a cross-linking agent and a slipping agent. The easy-to-adhere nylon film provided by the invention has excellent adhesion and is not easy to adhere.
Owner:HUNAN UNIV OF TECH

Liquid crystal sealing agent, and liquid crystal display cell using same

Provided is a thermosetting liquid crystal sealing agent which offers excellent coating workability, contact performance against an opposing substrate, and even viscosity stability after preliminary heating, and also offers extremely excellent adhesive strength and flexibility after curing. This liquid crystal sealing agent contains a solid phenol novolac resin (a) having a softening point of 75 DEG C or less, an acrylic polymer (b) having a core / shell structure, an epoxy resin (c), and an organic solvent (d), the gel time at 150 DEG C being 50-200 seconds.
Owner:NIPPON KAYAKU CO LTD

Composition for preparing three-dimensional greening cultivation container and preparation method

The invention discloses a composition for preparing a three-dimensional greening cultivation container and a preparation method. The composition comprises an aluminate cementing material, fly ash, silica fume, mineral powder, an organic material, an additive, fibers and water. The method for preparing the cultivation container by adopting the composition comprises the steps of carrying out stirring, carrying out mold forming, carrying out curing and the like. The three-dimensional greening cultivation container prepared by the technical scheme provided by the invention has the advantages of greenness, environment protection, energy conservation and easy maintenance, and the problem that a conventional cultivation container is poor in durability, insufficient in ornamental value, too largein dead weight and insufficient in breaking and compressive strength is solved.
Owner:SHENZHEN CUILU TECH GREENING ENG CO LTD

Method for improving paint firmness

The present invention relates to a method for increasing the firmness of paint, which comprises the following steps: Step 1: Prepare materials, take 50-60 parts of epoxy resin, 80-90 parts of paint, 20-40 parts of polyamide resin, and 15 parts of phenolic resin ‑20 parts, 12‑18 parts of alumina, 15‑18 parts of magnetic powder, 8‑15 parts of quartz powder; step 2: drying, epoxy resin, polyamide resin, phenolic resin, alumina, magnetic powder, quartz powder respectively Put it in a microwave dryer with tin foil, turn on the power, and dry for 30-40 minutes; Step 3: Cool, take out the placed materials from the microwave dryer, and let it stand for 10-20 minutes in a natural environment at room temperature Minutes until fully cooled; Step 4: Mix and stir, place the cooled material in a ball mill and stir until uniform, and invert the stirred material in a curved glass container; Step 6: Stand still, put the filled paint Stand still for 40-60 minutes. In a word, the present invention has the advantages of easy operation, significantly increased paint firmness, low operating cost, and easy-to-achieve increased paint firmness.
Owner:南阳格瑞科技有限公司

Low-odor polyethylene foam material with thermal bonding performance and preparation method thereof

The invention provides a low-odor polyethylene foam material with thermal bonding performance and a preparation method thereof, and belongs to the field of polyethylene foam materials. The density of the material is 0.05-0.18 g / cm<3>, and the hardness of the material is represented as 30-70 according to Shore C. The low-odor polyethylene foam material has uniform thermal bonding performance from inside to outside. After the low-odor polyethylene foam material is bonded with an external fabric, the peel strength is 1.5-2.6 N / mm. The odor grade of the low-odor polyethylene foam material is not greater than 2.5. The polyethylene foam material has no adhesive property at the temperature of 100-130 DEG C and has adhesive property at the temperature of higher than 180 DEG C. The polyethylene resin is resin obtained by polymerizing polyethylene monomers or polymerizing a polyethylene monomer with other monomers. The invention also provides a method for preparing the polyethylene foam material. The material provided by the invention has the advantages of thermal bonding performance, good processing technology and no pungent smell, and can be well compounded with fabrics made of other materials.
Owner:HUBEI XIANGYUAN NEW MATERIAL TECH INC

Thermoelectric module and package thereof

A thermoelectric transducer module and its package, the thermoelectric transducer module has a support substrate, a plurality of thermoelectric transducer elements arranged on the support substrate, wiring conductors electrically connecting the thermoelectric transducer elements, and the The external connection terminal to which the wiring conductor is electrically connected, wherein the cross-sectional shape of the wiring conductor is a rectangle or a trapezoidal shape in which the upper side on the element bonding surface side is longer than the lower side on the supporting substrate side. Accordingly, reliability can be improved.
Owner:KYOCERA CORP

Chip structure with bonding wire

The invention discloses a chip structure with a bonding wire. The chip structure comprises a chip, a first metal layer, a second metal layer and a bonding wire. The first metal layer is disposed on the chip, and the material of the first metal layer includes nickel or nickel alloy. The second metal layer is disposed on the first metal layer, and the material of the second metal layer includes copper, copper alloy, aluminum, aluminum alloy, palladium or palladium alloy. The wire is connected to the second metal layer, and the material of the bonding wire comprises copper or copper alloy.
Owner:IND TECH RES INST

Adhesive composition, circuit connection structure, semiconductor device, and solar cell module

The invention provides an adhesive composition, a circuit connection structure, a semiconductor device and a solar cell module. The adhesive composition comprises acrylic rubber, urethane acrylate and free radical polymerization initiators from 5-18 weight percentages of structural units of acrylonitrile.
Owner:HITACHI CHEM CO LTD

Wood adhesive

The invention relates to a wood adhesive and belongs to the field of polymer chemistry. Its main components: ordinary polyvinyl alcohol, acetylated polyvinyl alcohol, compound emulsifier, mixed monomer, initiator ammonium persulfate, talcum powder, carboxylated styrene-butadiene latex, isocyanate and water. The wood adhesive of the present invention has excellent bonding strength, good water resistance, does not contain any organic solvents, formaldehyde, phenol and other harmful substances, broadens the application environment, and solves the long-term problem that has plagued the practical application of wood adhesives.
Owner:张森

Prepreg, laminate, and integrated molded article

The present invention addresses the problem of providing: a prepreg for producing a laminate suitable as a structural material, said prepreg having excellent reactivity as a prepreg, having excellent compressive strength and interlayer fracture toughness values for obtaining a laminate, and being capable of being firmly integrated with another structural member by means of welding; and a laminate. The present invention is a prepreg comprising the following constituent elements [A], [B], and [C], [C] being present on the surface of the prepreg, [B] comprising a first curing agent [b1] and a second curing agent [b2], and [A] reinforcing fibers being present in contact with both resin regions across the boundary surface between the resin region comprising [B] and the resin region comprising [C]. [A] reinforcing fibers, [B] thermosetting resin, and [C] thermoplastic resin.
Owner:TORAY IND INC

Removable glue and preparation method thereof

The invention discloses removable glue and a preparation method thereof. The removable glue comprises the following components in parts by weight: 50-65 parts of a high-molecular polymer, 4-6 parts of a curing agent, 3-5 parts of a plasticizer and 20-30 parts of an organic solvent. The glue can be applied to process manufacturing of acousto-optic devices, has excellent bonding strength and is easy to operate, when a bonded element becomes a failure element due to dislocation, a bonded substance can be peeled off by removing the glue without damaging the element, so that the dislocated element can be repaired, and the peeled element can be used again.
Owner:SHANGHAI QINGJIN PHOTOELECTRON TECH CO LTD

Composite tarpaulin with high peel strength and production method thereof

The invention provides a composite tarpaulin with high peel strength and a production method thereof, the composite tarpaulin comprises a woven gridding cloth and two layers of TPU films, both sides of the woven gridding cloth are coated with a layer of PUR glue layer I, the inner side of each TPU film is coated with a layer of PUR glue layer II, and the PUR glue layers I and the PUR glue layers II are connected together through hot roller pressing. The woven gridding cloth and the TPU film are both coated with the PUR glue layers, and the two PUR glue layers can be perfectly fused and bonded together during bonding, so that the whole composite tarpaulin has high peel strength and is not easy to tear and separate.
Owner:海宁市龙都纺织有限公司

Flame-retardant heat shrinkable film and manufacturing method thereof

The invention provides a flame-retardant heat-shrinkable film comprising the following materials by weight: 55-65% of PET resin, 4-7% of a plasticizer, 1-5% of a light stabilizer, 1-2% of an antioxidant, 5 to 6% of a lubricant, 5 to 10% of a bromine-based flame retardant, 5 to 10% of flame retardant epoxy resin, and 1 to 3% of an antistatic agent. The flame-retardant heat-shrinkable film uses twoflame retardants as raw materials which are respectively the bromine-based flame retardant and the flame-retardant epoxy resin, and the prepared flame-retardant heat-shrinkable film has good the flame-retardant effect due to excellent performance.
Owner:NINGGUO QIANHONG ELECTRONIC CO LTD

Timepiece face and timepiece

The application concerns a timepiece face and a timepiece. The timepiece face is created by bonding a plurality of substrates configured primarily from polycarbonate, is excellent in bonding strength and prevents the forming generation in the bond layer effectively. The timepiece face used in the timepiece includes a first substrate configured primarily from polycarbonate, a second substrate configured primarily from polycarbonate and a bond layer for bonding the first substrate and the second substrate. The bond layer is configured from an adhesive elastic body composition obtained by directing UV light on a UV-crosslinking acrylic resin material in an oxygen-blocked state so that crosslinking occurs, the UV-crosslinking acrylic resin material having as a main agent an acrylic acid monomer and / or oligomer; and the bond layer has a thickness of 50 [mu]m to 200 [mu]m, an elongation of 50% to 350%, and a light transmittance of 80% or higher in the thickness direction.
Owner:SEIKO EPSON CORP
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