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Graphene conductive paste and preparation method thereof

A conductive paste, graphene technology, applied in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve problems affecting the electrical performance and stability of electronic devices, and achieve good flexibility and photothermal degradation resistance, improving mechanical properties, reducing the amount of use

Active Publication Date: 2018-07-06
SHENZHEN HOVERBIRD ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for conductive pastes, surfactants and dispersants themselves do not participate in conduction, which will affect the electrical properties and stability of electronic devices during use

Method used

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  • Graphene conductive paste and preparation method thereof
  • Graphene conductive paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] In this embodiment, the epoxy resin carrying out epoxy functionalization to graphene, the epoxy resin carrying out epoxy modification to siloxane and the epoxy resin as one of the main components of graphene conductive paste all adopt Bisphenol A type epoxy resin. The bisphenol A epoxy resin was purchased from Shenzhen Jiadida Chemical Co., Ltd., and the model was NPEL-128E.

[0040] Add 2g of graphene powder (highly conductive graphene powder prepared by Shenzhen Shiwang New Material Technology Co., Ltd.), 3.5g of bisphenol A epoxy resin and 200g of absolute ethanol into the medium and high-speed rotating chamber testing machine middle. The high-speed rotating cavity testing machine is equipped with an ultrasonic generator and a heating constant temperature device. The mixture is rotated at 20-120°C, 1600rpm at high speed and 2000W, frequency 80KHz ultrasonic waves are shaken for 1-8h for 1-8 hours, then vacuum filtered and dried at a temperature lower than 50°C, and...

Embodiment 2

[0044] In this embodiment, the epoxy resin carrying out epoxy functionalization to graphene, the epoxy resin carrying out epoxy modification to siloxane and the epoxy resin as one of the main components of graphene conductive paste all adopt Bisphenol F type epoxy resin replaces the bisphenol A type epoxy resin in embodiment 1, and the rest are the same as embodiment 1. The bisphenol F epoxy resin was purchased from Shenzhen Jiadida Chemical Co., Ltd., and the model was NPEF-170.

Embodiment 3

[0046] In the present embodiment, the epoxy resin carrying out epoxy functionalization to graphene and the epoxy resin carrying out epoxy modification to siloxane all adopt the bisphenol A type epoxy resin in embodiment 1, as graphene conductive The epoxy resin of one of the main components of the slurry is the bisphenol F epoxy resin in Example 2, and the rest are the same as in Example 1.

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Abstract

The application relates to the field of conductive pastes, in particular to a graphene conductive paste. The graphene conductive paste comprises the following components, by weight: 1 to 10 parts of epoxy-functionalized graphene, 4 to 15 parts of epoxy resin, 2 to 6 parts of epoxy-modified siloxane, 2 to 6 parts of epoxy reactive diluents, and 0.1 to 0.8 parts of latent curing agents. Furthermore,the graphene conductive paste also includes 5 to 20 pars, by weight, of conductive black modified with a silane coupling agent. In addition, the application also provides a method for preparing the graphene conductive paste. The method includes: carrying out epoxy functionalization of graphene powder; carrying out epoxy modification of siloxane; carrying out mixing and stirring of all components;and carrying out conductive black modification. According to the graphene conductive paste provided by the application, the high dispersibility of graphene and good adhesion of the conductive paste are realized; and with the conductive black, the amount of graphene is reduced and the cost is lowered.

Description

technical field [0001] The present application relates to the technical field of conductive paste, in particular to a graphene conductive paste and a preparation method thereof. Background technique [0002] In recent years, as a basic electronic material with specific functions, conductive paste has been used in printed circuit boards (PCBs), printed circuit board assemblies (PCBAs), solar cells, RFID radio frequency antennas, touch screen circuits, flexible printed circuits (FPC), Electrothermal film and other electronic circuits are widely used. At present, the conductive paste mainly uses metal powder as the conductive agent, especially the conductive paste with silver powder as the conductive agent is currently the most important conductive paste. In order to ensure the high conductivity of the slurry, it is necessary to increase the filling amount of the conductive agent, but with the increase of the metal powder, the bonding performance of the slurry decreases, and t...

Claims

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Application Information

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IPC IPC(8): H01B1/24H01B13/00
CPCH01B1/24H01B13/00
Inventor 王田军刘斌郑诗雨吴菲罗平
Owner SHENZHEN HOVERBIRD ELECTRONICS TECH CO LTD
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