Removable glue and preparation method thereof

A technology of glue and epoxy resin, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of low mechanical strength and easy cracks in the bonding layer, and overcome the problems of low mechanical strength, easy peeling, The effect of excellent adhesive strength

Active Publication Date: 2021-05-25
SHANGHAI QINGJIN PHOTOELECTRON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a kind of removable glue, which is applied in the process of acousto-optic devices, and can overcome the problem that the prior art bonding layer is prone to appear due to low

Method used

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  • Removable glue and preparation method thereof
  • Removable glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0044]Another aspect of the present invention also provides a method of removing the preparation of glue, including the steps of:

[0045](1) The polymer polymer is slowly added to the organic solvent while stirring to uniform dispersion;

[0046](2) Add curing agents and plasticizers, antifoaming agents, and coupling agents are uniform, and they are sealed for 3-6 h;

[0047](3) The opening of the cover is stirred to the mixture is sufficiently dissolved in a transparent, sealing 2-36 h.

[0048]When the ingredients of the glue are free of antifoaming agents, when the coupling agent, the operation is also saved in the preparation step.

Example Embodiment

[0050]Example 1

[0051]On the one hand, in the aspect of this embodiment, a removable glue, according to a weight gauge, including the following ingredient:

[0052]30 parts of the bisphenol A epoxy resin, 15 parts of polyvinyl butyral resin, 15 parts of hydroxypropylene methacrylate, 5 parts of 2-methylimidazole, 4 parts of citrate, EX-1710 defoamer 1 part, 5 parts of vinyl triethoxysilane, 15 methacannesin, 10 of isopropanol.

[0053]The bisphenol A epoxy resin is purchased from Changsha City.

[0054]The polyvinyl butyldis resin is purchased from the Tianyuan New Material Company.

[0055]Another aspect of the present embodiment provides a method of removing the preparation of glue, including the steps of:

[0056](1) The bisphenol A epoxy resin, polyvinyl butyral resin, and hydroxypropyl methacrylate, hydroxypropyl methacrylate is slowly added to the organic solvent methylcyclohexane and isopropyl alcohol mixed, while stirring to uniform dispersion;

[0057](2) 2-methylimidazole and citrate tributy...

Example Embodiment

[0059]Example 2

[0060]On the one hand, in the aspect of this embodiment, a removable glue, according to a weight gauge, including the following ingredient:

[0061]32 parts of bisphenol F epoxy resin, 16 parts of polyvinyl butylade resin, 16 parts of methacrylate, 2-imidazole 4 parts, 5 serial acid tributyl, EX-1710 defoamer 1 6 parts of the vinyl trimethoxysilane, 12 servocyclohexanes, 8 parts of propanol.

[0062]The bisphenol F epoxy resin is purchased from the ripedis of Henan water, the model is NPEF-170.

[0063]The polyvinyl butyldis resin is purchased from the Tianyuan New Material Company.

[0064]Another aspect of the present embodiment provides a method of removing the preparation of glue, including the steps of:

[0065](1) The bisphenol F epoxy resin, polyvinyl butyral resin, hydroxypropyl methacrylate, and hydroxypropyl methacrylate, and the mixture of organic solvent ethylcyclaxane and propanol, while stirring to uniform dispersion;

[0066](2) Imidazole and acetyl citrate tributyl, EX-...

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PUM

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Abstract

The invention discloses removable glue and a preparation method thereof. The removable glue comprises the following components in parts by weight: 50-65 parts of a high-molecular polymer, 4-6 parts of a curing agent, 3-5 parts of a plasticizer and 20-30 parts of an organic solvent. The glue can be applied to process manufacturing of acousto-optic devices, has excellent bonding strength and is easy to operate, when a bonded element becomes a failure element due to dislocation, a bonded substance can be peeled off by removing the glue without damaging the element, so that the dislocated element can be repaired, and the peeled element can be used again.

Description

technical field [0001] The invention relates to the field of chemical industry, in particular to a removable glue and a preparation method thereof, which can be applied to the technological manufacture of acousto-optic devices. Background technique [0002] In the acousto-optic device, the acousto-optic crystal and the transducer are bonded together by a bonding process after the bonding layer is respectively plated. The bonding layer of common acousto-optic devices is generally composed of a primer layer, an electrode layer, and a soldering layer. The soldering layer Choose a relatively soft metal (such as In), align the acousto-optic crystal coated with a bonding layer with the transducer, pressurize mechanically and maintain a constant pressure, and the metal atoms in the welding layer diffuse each other, so that the acousto-optic crystal and transducer energy devices bonded together, [0003] In high-frequency acousto-optic devices, the bonding layer is required to have...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J129/14C09J133/14C09J11/06
CPCC09J163/00C09J11/06C08L2203/20C08L29/14C08L33/14C08K5/5425
Inventor 钟能能谢尧寰许晓程
Owner SHANGHAI QINGJIN PHOTOELECTRON TECH CO LTD
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