The invention relates to the technical field of
soldering paste production, in particular to no-clean low-residue
soldering paste and a preparation method thereof.The no-clean low-residue
soldering paste is prepared from, by weight, 93-99 parts of soldering
powder alloy, 11-17 parts of scaling
powder and 2-4 parts of additives, the solder
powder alloy is one or a composition of more of a SnB i
alloy, a SnB iAg alloy, a SnAgCu alloy, a SnPb alloy, a SnCu I n alloy, a SnAgCuSb alloy, a SnAgSb alloy, a SnPbB i alloy or a SnPbAg alloy; the soldering flux comprises the following components in parts by weight: 60-80 parts of a homogeneous
solvent, 15-20 parts of at least one thixotropic agent, 13-28 parts of at least one activating agent and 12-15 parts of
rosin. According to the invention, under the condition of ensuring the stability, wettability and
bonding strength of the soldering paste, the use of
rosin can be reduced, so that the overall residual quantity after soldering is reduced, the requirement that the residual quantity of soldering flux after
reflow soldering is up to 2% is met, and the purpose of no cleaning is achieved.