Low temperature leadless welding material for electronic component
A technology for electronic components and lead-free soldering, which is applied in the field of lead-free solder paste, soldering process, and electronic products in the reflow soldering process. High thermal conductivity and cost reduction effect
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Embodiment 1
[0017] Example 1: Weigh 94g of SnBi58 powder with a particle size distribution of 25 μm to 75 μm and 6g of pure Cu powder, mix thoroughly, and then add rosin-type flux with a weight percentage of 12% of the solder material to make a solder paste. Apply solder paste on the surface of electronic components to be soldered, then place it in a reflow oven, adjust the heating curve, the peak temperature during the heating process is 200°C, and realize the connection between components.
Embodiment 2
[0018] Example 2: Weigh 95g of SnAg3.5 powder with a particle size distribution of 20μm-38μm and 5g of pure Cu powder, mix thoroughly, and then add rosin-type flux with a weight percentage of 12% of the solder material to make a solder paste. Apply solder paste on the surface of electronic components to be soldered, then place it in a reflow oven, adjust the heating curve, the peak temperature during the heating process is 250°C, and realize the connection between components.
Embodiment 3
[0019] Example 3: Weigh 80 g of SnAg3.0Cu0.5 powder with a particle size distribution of 25 μm to 45 μm and 20 g of pure Ti powder, mix thoroughly, and then add rosin-type flux with a weight percentage of 12% of the solder material to make a solder paste. Apply solder paste on the surface of the electronic components to be soldered, then place it in a reflow oven, adjust the heating curve, the peak temperature during the heating process is 240°C, and realize the connection between components.
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