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Low temperature leadless welding material for electronic component

A technology for electronic components and lead-free soldering, which is applied in the field of lead-free solder paste, soldering process, and electronic products in the reflow soldering process. High thermal conductivity and cost reduction effect

Inactive Publication Date: 2009-02-11
BEIJING COMPO ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the welding of many electronic components, it is required that the temperature should not be too high during welding, and the welding material should have high electrical conductivity and thermal conductivity, but the electrical conductivity of pure tin-based alloy solder is poor.

Method used

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  • Low temperature leadless welding material for electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Example 1: Weigh 94g of SnBi58 powder with a particle size distribution of 25 μm to 75 μm and 6g of pure Cu powder, mix thoroughly, and then add rosin-type flux with a weight percentage of 12% of the solder material to make a solder paste. Apply solder paste on the surface of electronic components to be soldered, then place it in a reflow oven, adjust the heating curve, the peak temperature during the heating process is 200°C, and realize the connection between components.

Embodiment 2

[0018] Example 2: Weigh 95g of SnAg3.5 powder with a particle size distribution of 20μm-38μm and 5g of pure Cu powder, mix thoroughly, and then add rosin-type flux with a weight percentage of 12% of the solder material to make a solder paste. Apply solder paste on the surface of electronic components to be soldered, then place it in a reflow oven, adjust the heating curve, the peak temperature during the heating process is 250°C, and realize the connection between components.

Embodiment 3

[0019] Example 3: Weigh 80 g of SnAg3.0Cu0.5 powder with a particle size distribution of 25 μm to 45 μm and 20 g of pure Ti powder, mix thoroughly, and then add rosin-type flux with a weight percentage of 12% of the solder material to make a solder paste. Apply solder paste on the surface of the electronic components to be soldered, then place it in a reflow oven, adjust the heating curve, the peak temperature during the heating process is 240°C, and realize the connection between components.

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Abstract

The invention relates to an electronic packaging braze welding material and a technology thereof, in particular to a low temperature lead-free welding material used for electronic elements, which belongs to the technical field of metallic material engineering. The invention can replace high temperature welding, and ensure the welding spot to have good electrical conductivity, high temperature resistance and impact resistance. For the welding material, kaiserzinn welding powder or pure tin powder and high melting point metal powder Ag, Cu, Ti and Ni are mixed according to certain proportion, and solder paste is prepared by adding appropriate flux; or kaiserzinn welding powder and metal powder Ag, Cu, Ti and Ni are mixed according to certain proportion to prepare solder paste, so as to weld high melting point weld layer through lead-free solder paste at low temperature.

Description

technical field [0001] The invention belongs to the technical field of metal materials, and relates to lead-free solder paste and welding technology used in the surface mount (SMT) process of electronic products, in particular to electronic components used for welding many parts, especially for welding semiconductor devices Electronic products in the reflow soldering process such as mechanical parts. Background technique [0002] In the electronic packaging industry, the connection between components is mainly based on soldering materials. The traditional solder is mainly tin-lead solder. Lead itself is highly toxic and will cause long-term pollution. It is self-evident that it is harmful to the environment and human body. In order to meet environmental protection requirements, tin-lead solder will be gradually replaced by lead-free solder. [0003] The currently researched lead-free solder systems mainly include SnAg, SnCu, SnZn, SnBi and other systems, the melting tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/26
Inventor 徐骏贺会军胡强张品赵朝辉
Owner BEIJING COMPO ADVANCED TECH
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