Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof

A wireless binding, hot melt adhesive technology, applied in the direction of adhesives, adhesive types, mineral oil hydrocarbon copolymer adhesives, etc., can solve the problem of increasing equipment maintenance and repair costs, aging and decomposition of tackifying resin, consumption of electricity, heat energy and other problems, to achieve the effect of reducing equipment maintenance and repair costs, stable glue performance, and ensuring bond strength

Inactive Publication Date: 2013-02-13
WUXI WANLI ADHESION MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the EVA hot melt adhesive used in book binding is generally designed to be used at a temperature between 160°C and 180°C, and high temperature use will cause two problems: 1) Long-term high-temperature use requires The energy consumption is high, which consumes a lot of electric energy and heat energy, which is contrary to the energy-saving production vigorously promoted by the government; 2) Long-term high-temperature use causes the aging and decomposition of the tackifying resin in the colloid. Pollution. On the other hand, the aging of the resin will lead to carbonization of the colloid, which will affect the adhesive performance. The carbide deposition will damage the melting equipment and increase the maintenance and repair costs of the equipment. The maintenance of the equipment will affect the production efficiency.

Method used

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  • Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1 Preparation of hot melt adhesive used at low temperature for perfect book binding

[0019] (1) Melting: Add 40 parts of ethylene-vinyl acetate copolymer EVA, 0.5-5 parts of filler, 20 parts of wax thinner and 1 part of antioxidant to the reaction kettle in sequence, heat to 150°C, and stir at a speed of 60r / min 40min;

[0020] (2) Secondary melting: Add 36 parts of tackifying resin to the mixture obtained in step (1), continue to heat to 150°C, stir at a speed of 60r / min for 20min, until it is completely melted, mix and stir evenly;

[0021] (3) Vacuum discharge: vacuumize the mixture obtained in step (2), the vacuum degree is -0.08MPa, the vacuum time is 10min, until the reaction system has no bubbles; add a 200-mesh filter at the outlet of the reactor to discharge , cooling and molding at room temperature to obtain the product, the hot melt adhesive used for perfect book binding at low temperature.

[0022] The content of VA in the ethylene-vinyl acetat...

Embodiment 2

[0024] Embodiment 2 Preparation of hot melt adhesive used at low temperature for perfect book binding

[0025] (1) Melting: Add 45 parts of ethylene-vinyl acetate copolymer EVA, 1.8 parts of filler, 23 parts of wax thinner and 0.3 part of antioxidant to the reaction kettle in sequence, heat to 180°C, and stir at a speed of 40r / min for 30min;

[0026] (2) Secondary melting: Add 30 parts of tackifying resin to the mixture obtained in step (1), continue heating to 180°C, and stir at a speed of 40r / min for 20min until it is completely melted, and mix and stir evenly;

[0027] (3) Vacuum discharge: Vacuumize the mixture obtained in step (2), the vacuum degree is -0.08MPa, the vacuum time is 10~20min, until the reaction system has no bubbles; add a 200-mesh filter at the outlet of the reactor Unwinding, cooling and forming at room temperature to obtain the hot melt adhesive used for perfect book binding at low temperature.

[0028] The content of VA in the ethylene-vinyl acetate co...

Embodiment 3

[0030] Embodiment 3 Preparation of hot melt adhesive used at low temperature for perfect book binding

[0031] (1) Melting: Add 35 parts of ethylene-vinyl acetate copolymer EVA, 2.5 parts of filler, 22 parts of wax thinner and 0.5 part of antioxidant into the reaction kettle in sequence, heat to 130°C, and stir for 50 minutes at a speed of 60r / min ;

[0032] (2) Secondary melting: Add 40 parts of tackifying resin to the mixture obtained in step (1), continue heating to 130°C, stir at a speed of 60r / min for 50min, until it is completely melted, mix and stir evenly;

[0033] (3) Vacuum discharge: Vacuumize the mixture obtained in step (2), the vacuum degree is -0.08MPa, the vacuum time is 10~20min, until the reaction system has no bubbles; add a 200-mesh filter at the outlet of the reactor Unwinding, cooling and forming at room temperature to obtain the hot melt adhesive used for perfect book binding at low temperature.

[0034] The content of VA in the ethylene-vinyl acetate ...

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Abstract

The invention relates to hot melt glue and a preparation method thereof, and belongs to the technical field of preparation of hot melt glue. The preparation method comprises the following steps of: starting stirring and opening a heat-conduction oil heating valve; sequentially filling ethylene-vinyl acetate (EVA) resin, a filler, a wax diluents and an antioxygen according to the proportion into a reaction kettle for heating; totally melting each component; adding tackified resin to heat until the tackified resin is totally melted; vacuumizing a reaction system until the reaction system has no bubbles; adding a filter screen and discharging at a discharging port of the reaction kettle; and cooling and forming the materials to obtain a product. The book thermoplastic binding hot melt glue can be used at about 130 DEG C, and is suitable for linkage line production; compared with the traditional book thermoplastic binding hot melt glue, the using temperature is reduced by 30 DEG C to 50 DEG C, so that the production energy consumption (electric energy, heat energy and the like) is reduced, the maintenance cost of equipment is reduced, and the production efficiency is improved; and the glue performance in a glue groove is stable, energy-saving production is facilitated, and the hot melt glue is environment-friendly.

Description

technical field [0001] The invention relates to a hot-melt adhesive and a preparation method thereof, in particular to a low-temperature hot-melt adhesive for wireless book binding and a preparation method thereof, and belongs to the technical field of hot-melt adhesive preparation. Background technique [0002] Hot melt adhesive has the reputation of green adhesive because it does not contain solvents, is pollution-free, has fast curing speed, and has good process performance. In recent years, hot melt adhesives have developed rapidly and are widely used. EVA (ethylene-vinyl acetate copolymer) hot-melt adhesive for book binding, no need to lock the thread when book binding, saving one process, easy to operate, and suitable for high-speed continuous production lines, greatly improving production efficiency, so it is the most widely used . At present, the EVA hot melt adhesive used in book binding is generally designed to be used at a temperature between 160°C and 180°C, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J193/04C09J157/02
Inventor 周其平王美健
Owner WUXI WANLI ADHESION MATERIALS
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