The invention discloses a manufacturing method of a circuit board plated hole. The manufacturing method comprises the following steps of material cutting, internal layer, inspection, pressing, manufacturing the drilling target locating hole for drilling the resin filling hole, drilling the resin filling hole, primary copper plating, whole plate copper plating, film drying before hole plating, holeelectroplating, film stripping, resin hole filling, resin grinding, manufacturing the drilling target locating hole for drilling the non-resin-filling hole, drilling the non-resin-filling hole, secondary copper plating and secondary whole plate electroplating. The method that the resin filling hole is completed and then the non-resin-filling hole and the external line are completed is adopted sothat the phenomenon of non-uniform copper thickness after whole plate copper thickening and chemical copper thinning can be successfully solved, the porthole pit abnormity of the resin filling hole after chemical copper thinning can be avoided, the manufacturing yield rate can be greatly enhanced, the process manufacturing capability can be powerfully enhanced and thus wide application and preference of the circuit board manufacturers can be received. The manufacturing method of the circuit board plated hole is widely suitable for the technical field of circuit board production.