The invention provides an adhesive film. The adhesive film has the characteristic of simple assembling, the adhesive film also has the characteristics of high relative dielectric constant, good light proofness, adjustable color, strong adhesive strength, and the like, and the relative dielectric constant in over 6, therefore, the adhesive film is especially applicable to the adhering of capacitive fingerprint recognition chip module encapsulation. The adhesive film is a semi-cured adhesive film which has low viscosity at room temperature, but has high viscosity in the process of thermal curing; compared with a common dispensed adhering mode, the adhesive film provided by the invention has the advantages of uniform film-forming thickness, controllable adhering shape, no bubble produced, simple assembling process, and the like, therefore, the adhesive film is especially suitable for plane adhesive assembly. The invention provides an adhesive composition for forming the adhesive film. The adhesive composition has the characteristics of high relative dielectric constant, and the like. The invention also provides an adhesive film roll. The adhesive film is protected by covering PET release liner or release paper on both sides of the adhesive film in the adhesive film roll, thereby preventing the environment from polluting the adhesive film.