A dynamic random access memory (DRAM) cell and associated array are disclosed. In a first embodiment, the DRAM (300) includes a storage capacitor (308) and a pass transistor (306). The pass transistor (306) is formed within a silicon mesa (314), and includes a source region (320), a drain region (322), and a channel region (324) that extends in a length direction between the source region (320) and drain region (322). When viewed with respect to a width direction, the channel region (324) has a narrower width than that of the source region (320) and drain region (322). Further, the channel region (324) has a top surface and opposing side surfaces. A surrounding gate (318) is disposed around the channel region (324), adjacent to the top and side surfaces, and separated therefrom by a gate insulating layer (316). Due to the reduced channel region width and surrounding gate (318), greater control of the operation of the pass transistor (302) is provided, including an off state with reduced source-to-drain leakage.