3results about How to "Increase process margin" patented technology

The invention belongs to the technical field of high-performance fibers, and particularly relates to a gel silk solidification system and a preparation method of ultra-high molecular weight polyethylene fibers.The gel silk solidification system comprises a cooling water tank and a silk spraying assembly, the silk spraying assembly is connected with a bottom roller A through fibers sprayed by the silk spraying assembly, and the bottom roller A is connected with a bottom roller B through fibers; the bottom roller B is parallel to the bottom roller A relative to the inner bottom end of the cooling water tank, the bottom roller B is connected with two sets of three-rollers through gel threads formed after cellosilk is cooled through the cooling water tank, and the two sets of three-rollers are connected through the gel threads and connected with a silk outlet roller through the gel threads. The silk outlet roller is sequentially connected with a silk swinging rod and a silk containing barrel from top to bottom through gel silk. According to the method, the production stability, the product performance and color difference control can be remarkably improved, the production cost is reduced, the consistency of the retraction rate and the flexibility of a process window are improved, and powerful support is provided for wide application of the ultra-high molecular weight polyethylene fiber.

The invention discloses a bending forming method of a grid conical wallboard, which comprises the following steps: S1, calculating an unfolded blank, and adding process allowance on the periphery to form an unfolded shape of a part; s2, machining a grid and a peripheral process table to form a part unfolding semi-finished product; s3, designing and manufacturing a lineation sample plate and a profile detection sample plate; s4, lineation is conducted at the large end and the small end of the unfolded semi-finished product of the part through the lineation sample plate, and bending is conducted along lineation; s5, timely detecting the sample plate by using a molded surface in the bending process; and S6, shaping according to a sample plate detection result. The bending machine is used for forming, and the equipment requirement and cost are reduced; different sample plates are designed, and the bending line and the pressing amount are adjusted, so that the forming requirements of the grid conical wall plates with different tapers can be met; process allowance is added around the unfolded blank, material use is optimized, and meanwhile it is ensured that accurate bending is conducted according to a lineation sample plate; a special sample plate is adopted for scribing and radian detection, and the bending forming precision of the grid conical wall plate is improved.

A display panel and a display device, the display panel includes a circuit substrate, a plurality of light emitting elements, a side edge circuit and a thin film flip chip packaging structure. The circuit substrate includes a circuit structure on a first surface. The side edge circuit includes a first bonding portion, a first extending portion, a second extending portion and a second bonding portion. The first bonding portion is disposed on the first surface of the circuit substrate and bonded to the circuit structure. The first extending portion is disposed on a side surface of the circuit substrate. The second extending portion is disposed on a second surface of the circuit substrate and overlaps a peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate and its orthographic projection overlaps a display region. The first bonding portion, the first extending portion, the second extending portion and the second bonding portion are connected in sequence and have the same resistivity. The thin film flip chip packaging structure is bonded to the second bonding portion.