782results about How to "Speed up preparation" patented technology

The present invention is related to the field of semiconductor processing equipment and methods and provides, in particular, methods and equipment for the sustained, high-volume production of Group III-V compound semiconductor material suitable for fabrication of optic and electronic components, for use as substrates for epitaxial deposition, for wafers and so forth. In preferred embodiments, these methods and equipment are optimized for producing Group III-N (nitrogen) compound semiconductor wafers and specifically for producing GaN wafers. Specifically, the precursor is provided at a mass flow of at least 50 g Group III element/hour for a time of at least 48 hours to facilitate high volume manufacture of the semiconductor material. Advantageously, the mass flow of the gaseous Group III precursor is controlled to deliver the desired amount.

A method for manufacturing a component, in particular a component of a turbine or a compressor, in which at least these steps are carried out: application in layers of at least one powdered component material to a component platform in the area of a buildup and joining zone; melting and/or sintering locally in layers of the component material by supplying energy with the aid of at least one electron beam in the area of the buildup and joining zone; lowering of the component platform in layers by a predefined layer thickness; and repeating steps a) through c) until completion of the component. During the manufacturing, electrons emitted due to the interaction of the electron beam with the component material are detected, after which material information, characterizing the topography of the melted and/or sintered component material, is ascertained on the basis of the emitted electrons. Alternatively or additionally, the component material is melted and/or sintered by at least two, preferably at least four electron beams.

A method for fabricating a semiconductor device in which a scribe area can be diced with high yield. The method for fabricating a semiconductor device comprises (a) a step for providing a semiconductor wafer having a plurality of chip areas in which semiconductor elements are formed, and a scribe area for separating the plurality of chip areas and including dicing areas with groove forming areas being defined to surround each chip area on the outer side of the dicing area in the scribe area, (b) a step for arranging a multilayer interconnection structure where interlayer insulation films and interconnection layers are formed alternately above the semiconductor wafer along with dummy lines, (c) a step for forming a cover layer covering the multilayer interconnection structure and including a passivation layer, and (d) a step for forming a groove surrounding each of the plurality of chip areas and penetrating at least the passivation layer from above in the groove forming area.

The invention discloses a multimedia resource processing method based on speech recognition and an online teaching system thereof. The method comprises the steps: audio and video frequencies are collected simultaneously and data are processed to process audio documents into a speech recognizable format; the audio documents are imposed with the speech recognition to generate script documents and with automatic generation and synchronization of Chinese captions with the video documents; and a content retrieval is imposed on the video documents, an automatic story segmentation based on the content is imposed on the script documents of the audio documents which are stored into the video database after being matched and labeled. The multimedia resource processing method based on the speech recognition and the online teaching system thereof are applied with the automatic processing technology of the multimedia resources, greatly increase the processing speed of such information as captions and the like by the use of high-performance computation of the computer, and reduce the participation degree of manual processing, thus accelerating the video manufacturing process and improving the work efficiency.

The invention discloses the transgenic animal model for pathological anxiety, the method to generate this model, the method to test drugs and drug candidates for the treatment of pathological anxiety and the method to use Wfs1 as target for screening of new anxiolytic drugs to treat pathological anxiety. This animal model is useful to test potential drug candidates for the treatment of diseases caused by pathological anxiety and to screen therapeutic compounds for the psychiatric disorders caused by reduces stress-tolerance and deficiency in adaptation to environmental challenges.

Flexible shavers and curved access ports that reduce access and trajectory problems associated with conventional lateral approaches to the lower spine. These devices and methods allow for preparing a disc space in the lower spine at an angle that is parallel to the disc space. Consequently, these devices and methods allow for preparing with less endplate damage.

The present invention relates to an optical connector for use in a fibre optic communications system, and particularly an expanded beam optical connector (20) for connecting optical fibres. The connector (20) comprises a housing (6), a port (48) within the housing for receiving an end (35) of an optical fibre (38), a cylindrical ferrule (32) within the housing (6) having opposite first and second ends (33, 35), and an optical fibre stub held axially (14) within the ferrule (32) and extending between said ferrule ends (33, 35). The connector (20) also has a lens (8) for projecting and/or receiving an expanded beam (40) optically coupled with the optical fibre stub at the first ferrule end (33). A sleeve (34) surrounds the ferrule (32) and extends towards the port (48) axially away from the second ferrule end (35) to present an open end to the sleeve for receiving a termination ferrule (36) of an optical fibre (38) inserted into the port. The connector (20) has a connector portion (2, 4, 5) for connecting the optical fibre connector (20) to another expanded beam optical fibre connector so that said expanded beam (40) traverses between the connectors. A channel (28) extends through the housing (6) from the port (48) towards the lens (8), the ferrule (32) being secured by means of a cured adhesive (30) to the housing (6) and in alignment with respect to the lens (8), the open end of the sleeve (34) and/or the second end (35) of the ferrule being surrounded by a void (60) within the channel (28).

A terminal structure includes ground terminals, signal terminals, connection elements, and ground electrical connection elements. The connection elements connect the ground terminals to the signal terminals, respectively. The ground electrical connection elements are in connection with connection elements and in electrical contact with at least a ground terminal. An electrical connector includes two terminal structures and a casing. The connection elements are connected to each other. An insertion slot is disposed on the front side of the casing. The terminal structure is disposed at the casing. The resilient ground electrical contact segments and the resilient signal electrical contact segments face the insertion slot. The ends of the ground electrical connection segments and the ends of the signal electrical connection segments are exposed from the casing. The terminal structure and the electrical connector improve resonance, adjust impedance, reduce signal loss, simplify die structures, and extend service life of a die.

A touch display panel including a first substrate, a touch sensing device, and a display medium layer is provided. The first substrate has a display area and a non-display area located outside the display area. The touch sensing device may be directly disposed on the first substrate and located within the non-display area, wherein the touch sensing device is consisted of two or more groups of receiving elements. The display medium layer is disposed in the display area.

The present invention provides an interconnect structure (of the single or dual damascene type) and a method of forming the same, in which a dense (i.e., non-porous) dielectric spacer is present on the sidewalls of a dielectric material. More specifically, the inventive structure includes a dielectric material having a conductive material embedded within at least one opening in the dielectric material, wherein the conductive material is laterally spaced apart from the dielectric material by a diffusion barrier, a dense dielectric spacer and, optionally, an air gap. The presence of the dense dielectric spacer results in a hybrid interconnect structure that has improved reliability and performance as compared with existing prior art interconnect structures which do not include such dense dielectric spacers. Moreover, the inventive hybrid interconnect structure provides for better process control which leads to the potential for high volume manufacturing.

A continuous deposition process and apparatus for depositing semiconductor layers containing cadmium, tellurium or sulfur as a principal constituent on transparent substrates to form photovoltaic devices as the substrates are continuously conveyed through the deposition apparatus is described. The film deposition process for a photovoltaic device having an n-type window layer and three p-type absorber layers in contiguous contact is carried out by a modular continuous deposition apparatus which has a plurality of processing stations connected in series for depositing successive layers of semiconductor films onto continuously conveying substrates. The fabrication starts by providing an optically transparent substrate coated with a transparent conductive oxide layer, onto which an n-type window layer formed of CdS or CdZnS is sputter deposited. After the window layer is deposited, a first absorber layer is deposited thereon by sputter deposition. Thereafter, a second absorber layer formed of CdTe is deposited onto the first absorber layer by a novel vapor deposition process in which the CdTe film forming vapor is generated by sublimation of a CdTe source material. After the second absorber layer is deposited, a third absorber layer formed of CdHgTe is deposited thereon by sputter deposition. The substrates are continuously conveyed through the modular continuous deposition apparatus as successive layers of semiconductor films are deposited thereon.

A multi-cavity wiring board includes a coreless substrate, an adhesive, and a stiffener having a plurality of apertures with lateral shielding sidewalls. The coreless substrate covers the stiffener and includes electrical pads exposed from the apertures of the stiffener as electrical contacts for semiconductor devices packaged within the apertures. The aperture sidewalls of the stiffener can serve as effective lateral electromagnetic shields for the semiconductor devices within the apertures.

The invention relates to a prefabricated reinforced concrete beam-column joint, in particular to a single-layer prefabricated assembly type reinforced concrete beam-column joint. In order to solve the problem that the connection integrity of existing prefabricated beams and prefabricated columns is hard to guarantee, the prefabricated joint for one-piece casting manufacturing of a column section and part of beam sections is provided according to the concept of the point of inflection. The single-layer prefabricated assembly type reinforced concrete beam-column joint is formed by overall manufacturing of a vertical column section (1) and joint superposed beam sections (2) in a factory for prefabrication. A manufacturing method comprises the steps of beam-column longitudinal bar and stirrup binding, connector pre-burying, formwork erecting and concrete pouring and curing. The height of the vertical column section (1) of the joint is 1/2 of the storey height, and the length of each joint superposed beam section (2) is 1/3 of the span of adjacent columns. The vertical column section (1) comprises a pouring section (1-1), a concrete filled steel tube connector (1-2), a steel tube connector (1-3) and column section longitudinal bars (1-4). Each joint superposed beam section (2) comprises a groove-shaped pouring section (2-1), inverted-T-shaped structural steel connectors (2-2) and a reinforcement cage framework (2-3). The single-layer prefabricated assembly type reinforced concrete beam-column joint is applied to the construction industry.

To be able to produce a scissors-type frame of a vehicle seat in a quick and easy manner, the present invention is directed to a scissors-type frame for a vehicle seat, in particular for a motor vehicle seat, comprising a first scissors element and a second scissors element, wherein the scissors-type frame is height-adjustable by means of the two scissors elements, and wherein the scissors-type frame is characterized in that one of the two scissors elements passes through the other of the two scissors elements.

The present invention relates to a curing assembly comprising at least two light sources combined into one light path, wherein the light sources are capable of curing a material exposed to the combined light path. The invention also relates to a method of curing a material or material in contact with a heat sensitive material comprising providing a curable material or a material associated with a heat sensitive material and exposing curable material to a combined light path from the curing assembly.

The invention provides a dual-mode microwave filter, comprising a rectangular resonator of length l, height b, and width a operating in two distinct modes (m, 0, n) and (p, 0, q) from a single family of modes and presenting the same direction as the E field, and wherein coupling and mode excitation discontinuities are inductive and in the same direction.

The invention discloses a method for calculating lighting parameters and carrying out relighting rendering based on an image and a model, comprising the following steps: (1) using a 3D point cloud model of a scene to calculate the normal vector of each 3D point; (2) calculating the light source position and direction vector of an image according to the coordinates and the normal vector of each 3D point and the pixel value of the image; (3) by supposing that the lighting model of the image is a Phong model, calculating the parameters of an energy function in the model based on the light source information obtained in the previous step; (4) calculating the shadow and highlight areas of the image; and (5) giving a target RGB image to be rendered, fusing and rendering the scene and lighting information of the original image into the target image, and outputting a final rendering result. By using the method, the relighting process of special-effects production in film and television post-production is simplified, the relighting rendering result can be output quickly, and a user can preliminarily judge whether an input image is applicable to later virtual-real combination. The problem that rework is caused as the lens and post-production inconsistency cannot be found in the existing film and television production process is solved.

A coated article is provided that may be used as a vehicle windshield, insulating glass (IG) window unit, or the like. Ion beam treatment is performed on a layer(s) of the coating. For example, a silicon nitride layer of a low-E coating may be ion beam treated. It has been found that ion beam treatment, for example, of a silicon nitride underlayer is advantageous in that sodium migration from the glass substrate toward the IR reflecting layer(s) can be reduced during heat treatment.

Systems and methods are provided for conducting business activities related to an industrial facility to achieve immersive operations intelligence. Immersive technology is used visualize a subject facility, and to access resources that may be required to design, test, operate, maintain and improve the facility. Resources may include personnel, data, models, work flows, historical data, and real-time data, e.g., audio, video, sensor, instrumentation data, etc.