413results about How to "Reduce signal loss" patented technology

in general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin seated within an assembly that forms a hermetic sealed, coaxial structure to prevent signal loss at increasing frequencies.

An integrated circuit structure includes a semiconductor substrate of a first conductivity type; and a depletion region in the semiconductor substrate. A deep well region is substantially enclosed by the depletion region, wherein the deep well region is of a second conductivity type opposite the first conductivity type. The depletion region includes a first portion directly over the deep well region and a second portion directly under the deep well region. An integrated circuit device is directly over the depletion region.

An efficient, low-loss, low sidelobe, high dynamic range phased-array radar antenna system is disclosed that uses metamaterials, which are manmade composite materials having a negative index of refraction, to create a biconcave lens architecture (instead of the aforementioned biconvex lens) for focusing the microwaves transmitted by the antenna. Accordingly, the sidelobes of the antenna are reduced. Attenuation across microstrip transmission lines may be reduced by using low loss transmission lines that are suspended above a ground plane a predetermined distance in a way such they are not in contact with a solid substrate. By suspending the microstrip transmission lines in this manner, dielectric signal loss is reduced significantly, thus resulting in a less-attenuated signal at its destination.

A fiber optic transceiver incorporating a lens array with an integrated mirror and method of creating the same is disclosed. The transceiver includes the lens array and transceiver housing used to convert optical signals to electrical signals. The lens array includes a fiber side that can be connected to a fiber optic connector. The lens array also has a device side that can be connected to a photodetector. The lens array also includes a mirror that is positioned to transmit an optical signal received from the fiber side to the device side. Both the fiber side and the device include lenses used to provide focused transmission of optical signals. Accordingly, optical signals can be transmitted from a fiber optic connector to a photodetector in a compact and efficient manner at high bandwidths.

A terminal structure includes ground terminals, signal terminals, connection elements, and ground electrical connection elements. The connection elements connect the ground terminals to the signal terminals, respectively. The ground electrical connection elements are in connection with connection elements and in electrical contact with at least a ground terminal. An electrical connector includes two terminal structures and a casing. The connection elements are connected to each other. An insertion slot is disposed on the front side of the casing. The terminal structure is disposed at the casing. The resilient ground electrical contact segments and the resilient signal electrical contact segments face the insertion slot. The ends of the ground electrical connection segments and the ends of the signal electrical connection segments are exposed from the casing. The terminal structure and the electrical connector improve resonance, adjust impedance, reduce signal loss, simplify die structures, and extend service life of a die.

An in-house coaxial network includes an input (10) capable of connection to a cable or satellite television signal provider and which is connected to a signal splitting device (12) for communicating the signal to a plurality of outlets in the form of subscriber equipment, wherein a filter (36: 38) is positioned between the input (10) and the signal splitting device (12). The filter is adapted to reflect signals outside a frequency pass band used for data transfer thereby to reduce signal loss. By reflecting signals outside the frequency pass band, whilst at the same time passing all signals in the frequency pass band, the filter (36: 38) significantly reduces the signal loss between the plurality of outlets (16).

A signal coupling apparatus for power line communications includes an impedance matching transformer and a transmission mode control circuit for high data rate power line communications on a three-phase four-wire distribution line. Therefore, it is possible to improve the efficiency of power line communications, to minimize signal loss, and to construct an optimal high voltage distribution path.

An antenna arrangement for a portable communication apparatus includes a main antenna connectable to an antenna input, a receive antenna connectable to an antenna output, an external antenna connector for receiving a terminal of an auxiliary antenna, an antenna detector arranged to detect the terminal when it is connected to the external antenna connector, a switch adapted to connect either the receive antenna or the external antenna connector to the antenna output, and a DC voltage network. The DC voltage network is connected to the switch and is arranged to automatically control the switch to connect the external antenna connector to the antenna output and disconnect the receive antenna from the antenna output, when the terminal is connected to the external antenna connector.

A method and structure for fabricating a monolithic integrated CMOS and MEMS device. The method includes providing a first semiconductor substrate having a first surface region and forming one or more CMOS IC devices on a CMOS IC device region overlying the first surface region. The CMOS IC device region can also have a CMOS surface region. A bonding material can be formed overlying the CMOS surface region to form an interface by which a second semiconductor substrate can be joined to the CMOS surface region. The second semiconductor substrate having a second surface region to the CMOS surface region by bonding the second surface region to the bonding material, the second semiconductor substrate comprising one or more first air dielectric regions. One or more free standing MEMS structures can be formed within one or more portions of the processed first substrate.

A method and system of applying modulated carrier signals to tree networks and processing signals tapped from the tree networks to generate output signals with phase-synchronized carriers are disclosed.

A spectrum analyzer is provided that includes components to achieve from below 9 kHz to above 20 GHz operation range while remaining hand-held. Components of the spectrum analyzer include an integrated precision stand-alone step attenuator that does not rely on printed circuit board (PCB) mounted circuit elements within the signal path. Further, a PIN diplexing switch separates signals into different base-band and highband paths. The baseband path includes a pre-amplifier for low frequency signals, while the higher frequency bands may not necessarily include a pre-amplifier. The baseband path further provides improved broadband termination of its 1st mixer IF port by incorporating a new quadrature-coupled directional (QCD) filter that includes a ring resonator. An inexpensive air dielectric multi-cavity baseband filter is also used to suppress 2nd mixer IF images. The highband path incorporates multi-throw MMIC PIN diode switches to selectively filter different bands of input signals. At least three total 1st mixers are used to increase operation bandwidth. A phase locked loop providing a 1st LO to the 1st mixers is created that uses a divide-by-two frequency divider in cascade with a sampler-type frequency downconverter. The output of the 1st LO is frequency doubled and filtered to increase the frequency range of the highband signal path.

A magnetic resonance imaging (MRI) method of obtaining MRI images of a patient and storing the images in physical storage media.

A radar level gauge (RLG), intended for measuring with a close-range low-power radar a distance to a content surface in a container relatively to a measuring position, which is located above the surface and fixed in relation to a lower boundary of said container. The RLG comprises a transmitter for transmitting an electromagnetic transmitter pulse, a signal medium interface connectable to means for directing said transmitter pulse towards said surface and for receiving a reception pulse reflected back from said surface, and a receiver for receiving said reception pulse. A switch connects said signal medium interface to said transmitter while said transmitter pulse is transmitted, and said signal medium interface to said receiver while said reflected pulse is received, the switch having a switching time short enough to enable short distance detection. According to this design, signal losses can be reduced significantly compared to prior solutions.

To reduce the RF losses associated with high RF loss plating, such as, for example, Ni / Pd / Au plating, the solder mask is reconfigured to prevent the edges and sidewalls of the wire-bond areas from being plated in some embodiments. Leaving the edges and sidewalls of the wire-bond areas free from high RF loss plating, such as Ni / Pd / Au plating, provides a path for the RF current to flow around the high resistivity material, which reduces the RF signal loss associated with the high resistivity plating material.

A signal coupling apparatus for power line communications includes an impedance matching transformer and a transmission mode control circuit for high data rate power line communications on a three-phase four-wire distribution line. Therefore, it is possible to improve the efficiency of power line communications, to minimize signal loss, and to construct an optimal high voltage distribution path.

A method and system of applying modulated carrier signals to tree networks and processing signals tapped from the tree networks to generate output signals with phase-synchronized carriers are disclosed.

A dynamically self-bootstrapping circuit for a switch features a resistor in series with the control node of the switch. A bypass switch connects a control node to ground. When the switch is in an off-state, the bypass switch is enabled.

The present invention discloses an asymmetric bidirectional silicon-controlled rectifier, which comprises: a second conduction type substrate; a first conduction type undoped epitaxial layer formed on the substrate; a first well and a second well both formed inside the undoped epitaxial layer and separated by a portion of the undoped epitaxial layer; a first buried layer formed in a junction between the first well and the substrate; a second buried layer formed in a junction between the second well and the substrate; a first and a second semiconductor area with opposite conduction type both formed inside the first well; a third and a fourth semiconductor area with opposite conduction type both formed inside the second well, wherein the first and second semiconductor areas are connected to the anode of the silicon-controlled rectifier, and the third and fourth semiconductor areas are connected to the cathode of the silicon-controlled rectifier.

The invention discloses a preparation method for a high-refractive index hydrogenated silicon film, the high-refractive index hydrogenated silicon film, a light filtering lamination and a light filtering piece and relates to the technical field of optical films. The preparation method comprises the following steps that firstly, by means of magnetic controlled Si target sputtering, Si deposits on abase body, and a silicon film is formed; and secondly, the hydrogenated silicon film containing oxygen is formed through the silicon film under the environment where activated hydrogen and active oxygen are contained, the amount of the activated oxygen accounts for 4%-99% of the total amount of the activated hydrogen and the activated oxygen, or, the hydrogenated silicon film containing nitrogenis formed through the silicon film under the environment where the activated hydrogen and the activated nitrogen are contained, and the amount of the activated nitrogen accounts for 5%-20% of the total amount of the activated hydrogen and the activated nitrogen. According to the preparation method, sputtering and a reaction are separately conducted, firstly, by means of magnetic controlled Si target sputtering, Si deposits on the base body, then, plasmas of the activated hydrogen and the activated oxygen / nitrogen react with the silicon to obtain the oxygen or nitrogen containing SiH, the poisoning problem of a target is avoided, and the SiH film has a relatively high refractive index and relatively low absorption.

An approximately rectangular plate-shaped radiation member (2) is provided and support portions (4,6) are attached to lower surface end portions adjacent to a pair of parallel shorter sides of the radiation member (2). The support portion (4) is composed of a laminated circuit member including a laminated demultiplexer and a laminated band pass filter of the reception side and the transmission side respectively connected to the laminated demultiplexer. The radiation member (2) has a power supply terminal (2c) and a ground terminal (2d) at the end portion where the support portion (4) is mounted. The power supply terminal (2c) and the ground terminal (2d) are connected to an antenna terminal (4a) and the ground terminal (4b) of the laminated circuit, respectively. The radiation member (2) has a radiation electrode (2a) where a slot (2b) is formed. The shape of the slot is set so that the radiation electrode (2a) causes resonance in a plurality of frequency bands.

To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel / Palladium / Gold (Ni / Pd / Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.

A keyless entry device which performs communication between a portable device and a vehicle-side device is provided in a vehicle. The vehicle includes a door handle provided with a grip portion, which is provided with a vehicle-side electrode that detects an electric field induced in a human body by a portable device electrode, and the vehicle-side electrode has at least two of a first face opposed to a vehicle body face of the vehicle, a second face opposed to the vehicle body face of the vehicle and disposed at a position more distant from a vehicle body than the first face, and an upper face and a lower face orthogonal to the first face and the second face and parallel to each other. The vehicle-side electrode includes faces other than the first face or includes the first face having a smaller area than other faces.

The invention relates to a low-dielectric laser direct structuring composite material suitable for 5G communication. The composite material is composed of the following components in parts by weight:52 to 86 parts of base resin, 0 to 30 parts of glass fibers, 10 to 30 parts of a filling agent, 1 to 9 parts of a flame retardant, 4 to 15 parts of a toughening agent, 0.1 to 1 part of a lubricating agent, 0.2 to 1 part of an antioxidant and 10 to 30 parts of a laser sensitive additive. A preparation method of the composite material comprises the steps that a twin-screw extruder is used for processing, the melt extrusion temperature is 250-380 DEG C, and the screw rotating speed is 150-300 rpm / min. The composite material has low dielectric property, so that improvement of the transmission speed of 5G communication millimeter wave signals is facilitated, the signal delay is reduced, and the signal loss is reduced; the composite material has the LDS processing capacity, can be rapidly prepared in a small size and a large number, can be subjected to batch laser etching and chemical plating to form a metal connecting circuit, and is an optimal solution of a 5G plastic antenna oscillator material.

An optical rotary adapter is featured by including: a fixed side optical fiber which is fixedly supported by a fixed sleeve and which has an end surface inclined with respect to a plane perpendicular to the optical axis of the optical fiber; a fixed side collimator lens which is arranged to be separated from the inclined end surface of the fixed side optical fiber by a predetermined interval; a rotation side optical fiber which is fixedly supported substantially at the center of a rotatably supported rotary cylinder, which is arranged to face the fixed side collimator lens, and which has an end surface inclined with respect to a plane perpendicular to the optical axis of the fixed side collimator lens; a rotation side collimator lens which is fixedly supported by the rotary cylinder, and which is arranged between the fixed side collimator lens and the rotation side optical fiber so as to be separated from the inclined end surface of the rotation side optical fiber by a predetermined interval; a second luminous flux optical fiber which guides a second luminous flux having a function different from that of a first luminous flux as a measuring light beam to the inside of the fixed sleeve; and a multiplexing device which is provided between the fixed side collimator lens and the rotation side collimator lens, and which multiplexes the first luminous flux with the second luminous flux.

A circuit board structure of an optoelectronic component is proposed. A supporting structure has a first surface and a second surface. At least one optical transceiver has an active surface and an inactive surface. The inactive surface of the optical transceiver is mounted on the first surface of the supporting structure, and the active surface of the optical transceiver has an optical active region and a plurality of electrode pads. A dielectric layer is formed on the first surface of the supporting structure and the active surface of the optical transceiver. A circuit layer is formed on the dielectric layer and is electrically connected to the electrode pads on the active surface of the optical transceiver through the conductive structure in the dielectric layer. At least one hole, which penetrates the dielectric layer, is used to expose the optical active region on the active surface of the optical transceiver. Therefore, the transmission quality of the optical transceiver is improved and the dimension of the circuit board structure is shrunken.

A magnetic resonance imaging (MRI) method of obtaining MRI images of a patient and storing the images in physical storage media.