405results about How to "Reduce signal loss" patented technology

An efficient, low-loss, low sidelobe, high dynamic range phased-array radar antenna system is disclosed that uses metamaterials, which are manmade composite materials having a negative index of refraction, to create a biconcave lens architecture (instead of the aforementioned biconvex lens) for focusing the microwaves transmitted by the antenna. Accordingly, the sidelobes of the antenna are reduced. Attenuation across microstrip transmission lines may be reduced by using low loss transmission lines that are suspended above a ground plane a predetermined distance in a way such they are not in contact with a solid substrate. By suspending the microstrip transmission lines in this manner, dielectric signal loss is reduced significantly, thus resulting in a less-attenuated signal at its destination.

A terminal structure includes ground terminals, signal terminals, connection elements, and ground electrical connection elements. The connection elements connect the ground terminals to the signal terminals, respectively. The ground electrical connection elements are in connection with connection elements and in electrical contact with at least a ground terminal. An electrical connector includes two terminal structures and a casing. The connection elements are connected to each other. An insertion slot is disposed on the front side of the casing. The terminal structure is disposed at the casing. The resilient ground electrical contact segments and the resilient signal electrical contact segments face the insertion slot. The ends of the ground electrical connection segments and the ends of the signal electrical connection segments are exposed from the casing. The terminal structure and the electrical connector improve resonance, adjust impedance, reduce signal loss, simplify die structures, and extend service life of a die.

An in-house coaxial network includes an input (10) capable of connection to a cable or satellite television signal provider and which is connected to a signal splitting device (12) for communicating the signal to a plurality of outlets in the form of subscriber equipment, wherein a filter (36: 38) is positioned between the input (10) and the signal splitting device (12). The filter is adapted to reflect signals outside a frequency pass band used for data transfer thereby to reduce signal loss. By reflecting signals outside the frequency pass band, whilst at the same time passing all signals in the frequency pass band, the filter (36: 38) significantly reduces the signal loss between the plurality of outlets (16).

A method and structure for fabricating a monolithic integrated CMOS and MEMS device. The method includes providing a first semiconductor substrate having a first surface region and forming one or more CMOS IC devices on a CMOS IC device region overlying the first surface region. The CMOS IC device region can also have a CMOS surface region. A bonding material can be formed overlying the CMOS surface region to form an interface by which a second semiconductor substrate can be joined to the CMOS surface region. The second semiconductor substrate having a second surface region to the CMOS surface region by bonding the second surface region to the bonding material, the second semiconductor substrate comprising one or more first air dielectric regions. One or more free standing MEMS structures can be formed within one or more portions of the processed first substrate.

A spectrum analyzer is provided that includes components to achieve from below 9 kHz to above 20 GHz operation range while remaining hand-held. Components of the spectrum analyzer include an integrated precision stand-alone step attenuator that does not rely on printed circuit board (PCB) mounted circuit elements within the signal path. Further, a PIN diplexing switch separates signals into different base-band and highband paths. The baseband path includes a pre-amplifier for low frequency signals, while the higher frequency bands may not necessarily include a pre-amplifier. The baseband path further provides improved broadband termination of its 1^st mixer IF port by incorporating a new quadrature-coupled directional (QCD) filter that includes a ring resonator. An inexpensive air dielectric multi-cavity baseband filter is also used to suppress 2^nd mixer IF images. The highband path incorporates multi-throw MMIC PIN diode switches to selectively filter different bands of input signals. At least three total 1^st mixers are used to increase operation bandwidth. A phase locked loop providing a 1^st LO to the 1^st mixers is created that uses a divide-by-two frequency divider in cascade with a sampler-type frequency downconverter. The output of the 1^st LO is frequency doubled and filtered to increase the frequency range of the highband signal path.

A radar level gauge (RLG), intended for measuring with a close-range low-power radar a distance to a content surface in a container relatively to a measuring position, which is located above the surface and fixed in relation to a lower boundary of said container. The RLG comprises a transmitter for transmitting an electromagnetic transmitter pulse, a signal medium interface connectable to means for directing said transmitter pulse towards said surface and for receiving a reception pulse reflected back from said surface, and a receiver for receiving said reception pulse. A switch connects said signal medium interface to said transmitter while said transmitter pulse is transmitted, and said signal medium interface to said receiver while said reflected pulse is received, the switch having a switching time short enough to enable short distance detection. According to this design, signal losses can be reduced significantly compared to prior solutions.

To reduce the RF losses associated with high RF loss plating, such as, for example, Ni/Pd/Au plating, the solder mask is reconfigured to prevent the edges and sidewalls of the wire-bond areas from being plated in some embodiments. Leaving the edges and sidewalls of the wire-bond areas free from high RF loss plating, such as Ni/Pd/Au plating, provides a path for the RF current to flow around the high resistivity material, which reduces the RF signal loss associated with the high resistivity plating material.

A signal coupling apparatus for power line communications includes an impedance matching transformer and a transmission mode control circuit for high data rate power line communications on a three-phase four-wire distribution line. Therefore, it is possible to improve the efficiency of power line communications, to minimize signal loss, and to construct an optimal high voltage distribution path.

An approximately rectangular plate-shaped radiation member (2) is provided and support portions (4,6) are attached to lower surface end portions adjacent to a pair of parallel shorter sides of the radiation member (2). The support portion (4) is composed of a laminated circuit member including a laminated demultiplexer and a laminated band pass filter of the reception side and the transmission side respectively connected to the laminated demultiplexer. The radiation member (2) has a power supply terminal (2c) and a ground terminal (2d) at the end portion where the support portion (4) is mounted. The power supply terminal (2c) and the ground terminal (2d) are connected to an antenna terminal (4a) and the ground terminal (4b) of the laminated circuit, respectively. The radiation member (2) has a radiation electrode (2a) where a slot (2b) is formed. The shape of the slot is set so that the radiation electrode (2a) causes resonance in a plurality of frequency bands.

To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.

The invention relates to a low-dielectric laser direct structuring composite material suitable for 5G communication. The composite material is composed of the following components in parts by weight:52 to 86 parts of base resin, 0 to 30 parts of glass fibers, 10 to 30 parts of a filling agent, 1 to 9 parts of a flame retardant, 4 to 15 parts of a toughening agent, 0.1 to 1 part of a lubricating agent, 0.2 to 1 part of an antioxidant and 10 to 30 parts of a laser sensitive additive. A preparation method of the composite material comprises the steps that a twin-screw extruder is used for processing, the melt extrusion temperature is 250-380 DEG C, and the screw rotating speed is 150-300 rpm/min. The composite material has low dielectric property, so that improvement of the transmission speed of 5G communication millimeter wave signals is facilitated, the signal delay is reduced, and the signal loss is reduced; the composite material has the LDS processing capacity, can be rapidly prepared in a small size and a large number, can be subjected to batch laser etching and chemical plating to form a metal connecting circuit, and is an optimal solution of a 5G plastic antenna oscillator material.

An optical rotary adapter is featured by including: a fixed side optical fiber which is fixedly supported by a fixed sleeve and which has an end surface inclined with respect to a plane perpendicular to the optical axis of the optical fiber; a fixed side collimator lens which is arranged to be separated from the inclined end surface of the fixed side optical fiber by a predetermined interval; a rotation side optical fiber which is fixedly supported substantially at the center of a rotatably supported rotary cylinder, which is arranged to face the fixed side collimator lens, and which has an end surface inclined with respect to a plane perpendicular to the optical axis of the fixed side collimator lens; a rotation side collimator lens which is fixedly supported by the rotary cylinder, and which is arranged between the fixed side collimator lens and the rotation side optical fiber so as to be separated from the inclined end surface of the rotation side optical fiber by a predetermined interval; a second luminous flux optical fiber which guides a second luminous flux having a function different from that of a first luminous flux as a measuring light beam to the inside of the fixed sleeve; and a multiplexing device which is provided between the fixed side collimator lens and the rotation side collimator lens, and which multiplexes the first luminous flux with the second luminous flux.

The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

A circuit board structure of an optoelectronic component is proposed. A supporting structure has a first surface and a second surface. At least one optical transceiver has an active surface and an inactive surface. The inactive surface of the optical transceiver is mounted on the first surface of the supporting structure, and the active surface of the optical transceiver has an optical active region and a plurality of electrode pads. A dielectric layer is formed on the first surface of the supporting structure and the active surface of the optical transceiver. A circuit layer is formed on the dielectric layer and is electrically connected to the electrode pads on the active surface of the optical transceiver through the conductive structure in the dielectric layer. At least one hole, which penetrates the dielectric layer, is used to expose the optical active region on the active surface of the optical transceiver. Therefore, the transmission quality of the optical transceiver is improved and the dimension of the circuit board structure is shrunken.