1828results about "Pulse generation by logic circuits" patented technology

Timing signal generation and distribution are combined in operation of a signal path exhibiting endless electromagnetic continuity affording signal phase inversion and having associated regenerative active means. Two-or more-phases of substantially square-wave bipolar signals arise directly in travelling wave transmission-line embodiments compatible with semiconductor fabrication including CMOS. Coordination by attainable frequency synchronism with phase coherence for several such oscillating signal paths has intra-IC inter-IC and printed circuit board impact.

A transceiver includes a phase lock loop (PLL) and a clock data recovery circuit (CDR). The phase lock loop generates a first level control signal. The clock data recovery circuit, coupled to the phase lock loop, locks an incoming data signal to generate a data recovery clock according to a second level control signal. Wherein the clock data recovery circuit receives the first level control signal to further control a frequency range of the data recovery clock.

In a ring oscillator constituting an oscillating circuit, resistor circuits are used as delay circuits to be connected to respective inverters. That is, the inverters and the resistors are connected in series so that the resistor is provided between the adjacent inverters. With the arrangement, it is possible to provide an oscillating circuit which is less dependent on any of power supply voltages, temperatures, and manufacturing variations, while maintaining a characteristic in which the oscillating frequency decreases as an output voltage of a booster circuit increases.

Embodiments of the invention include on-chip characterization of transistor degradation. In one embodiment, includes one or more functional blocks to perform one or more functions and an integrated on-chip characterization circuit to perform on-chip characterization of transistor degradation. The integrated on-chip characterization circuit includes a selectively enabled ring oscillator to generate a reference oscillating signal, a free-running ring oscillator to generate a free-running oscillating signal, and a comparison circuit coupled to the selectively enabled ring oscillator and the free-running ring oscillator. From the reference oscillating signal and the free-running oscillating signal, the comparison circuit determine a measure of transistor degradation.

An inverter type delay circuit, voltage-controlled oscillation circuit, and voltage-controlled delay circuit capable of realizing simplification of circuit configuration, reduction of an effect of power source noise, and reduction of jitter, wherein a delay circuit, voltage-controlled oscillation circuit, and voltage-controlled delay circuit comprised of a plurality of delay stages controlled in drive current in accordance with a bias voltage or a control voltage and determined in delay time by the drive current, adding a change of a power source voltage to the above bias voltage or control voltage by a predetermined ratio and supplying a result of the addition to the above delay stages to suppress the power source voltage dependencies of the delay times of the delay stages, or connecting by a predetermined ratio a plurality of delay stages having different power source voltage dependencies, for example, power source voltage dependencies of opposite delay times, to suppress the power source voltage dependencies of delay times of the delay stages are realized.

A micropower RC oscillator having stable frequency characteristics with varying temperature includes a number of inverting circuits which are driven by an external driving voltage and connected in series with each other and an RC circuit having a resistor disposed in between a head-inverter and a tail inverter to form a closed loop and a capacitor disposed between the tail-inverter and the head-inverter. The resistor comprises a plurality of unit resistors constituting of a P+ diffusion resistor and a polysilicon resistor having opposing characteristics with respect to temperature variation at a predetermined ratio. A resistance regulator controls the resistance of the resistor by decoding an external resistance setting data to select a unit resistor that determines the oscillation frequency effectively. A driving voltage circuit receives a reference signal having the voltage level which is stable against the temperature variation by using a current source and a load having opposing characteristics with respect to the temperature variation and provides as a driving voltage of the RC oscillating circuit after increasing a fan-out capacity of the reference signal. An output level shifting circuit can be added to the rear side of the RC oscillating circuit to adjust the voltage level of the oscillation signal with the appropriate standard required at a receiving end.

In various embodiments, the invention provides a clock generator and / or a timing and frequency reference, with multiple operating modes, such power conservation, clock, reference, and pulsed modes. The various apparatus embodiments include a resonator adapted to provide a first signal having a resonant frequency; an amplifier; a temperature compensator adapted to modify the resonant frequency in response to temperature; and a process variation compensator adapted to modify the resonant frequency in response to fabrication process variation. In addition, the various embodiments may also include a frequency divider adapted to divide the first signal having the resonant frequency into a plurality of second signals having a corresponding plurality of frequencies substantially equal to or lower than the resonant frequency; and a frequency selector adapted to provide an output signal from the plurality of second signals. The output signal may be provided in any of various forms, such as differential or single-ended, and substantially square-wave or sinusoidal.

A method and apparatus for temperature sensing in an IC. The IC includes a plurality of remote temperature sensors each coupled to a control logic unit. The plurality of remote temperature sensors may be distributed throughout the integrated circuit. The integrated circuit includes a reference unit coupled to provide a reference temperature to the control logic unit and a reference sensor coupled to provide a signal having a reference frequency to the control logic unit. The reference unit and the reference sensor are located near each other. The control logic unit is configured to correlate the reference frequency received from the reference sensor with the reference temperature received from the reference unit. The control logic unit is further configured to determine the temperature of each of the remote temperature sensors based on this correlation, and also configured to determine the maximum temperature of all of the temperature sensors.