29 results about "Silica hydride" patented technology

This fluoropolyether-based curable composition contains(A) a perfluoropolyether compound having two or more alkenyl groups per molecule,(B) a fluorine-containing organo hydrogen silane compound having two or more hydrosilyl groups having a specific structure,(C) a platinum group metal-based catalyst, and(D) a specific amount of at least one filler selected from organic resin powders and carbon black powders.Such a fluoropolyether-based curable composition can provide a cured product that has endurance against fluoric acid and electrolytic solutions for lithium ion batteries, has fine mechanical properties, and has excellent releasability because of not having uncured portions resulting from low compatibility between structural ingredients.

An optical interference filter includes one or more sets of layers. Each set of layers includes a first layer that includes at least aluminum and nitrogen (e.g., an aluminum nitride (AlN) material), a second layer that includes at least silicon and oxygen (e.g., a silicon dioxide (SiO2) material), and a third layer that includes at least hydrogen and silicon (e.g., a hydrogenated silicon (Si:H) material). The second layer is disposed between the first layer and the third layer.

The utility model provides a device for improving the conversion rate of cold hydrogenated silicon powder. The device comprises an external dust remover (2) in fluid connection with a top discharge hole (13) of a fluidized bed (1) in a cold hydrogenation production process; a bottom outlet of the external dust remover (2) is in fluid connection with a top inlet of the reactor (3); a top outlet of the reactor (3) is in fluid connection with a top inlet of the chlorosilane storage tank (5) after sequentially passing through a first heat exchange channel of the heat exchanger (4) and a condensation channel of the condenser (6); a top outlet of the chlorosilane storage tank (5) is connected with a second heat exchange channel outlet of the heat exchanger (4) in parallel and then is in fluid connection with a bottom inlet of the reactor (3).

Production of dihydrogen from metallurgical silicon. The present invention relates to a process for the production of dihydrogen, comprising a step of contacting: - hydrogenated silicon obtained by contacting a silicon substrate with an acid, the silicon substrate having a purity of 99.99% or less, - an alkaline solution, thereby generating dihydrogen. Figure for the abstract: None

In some implementations, an optical interference filter includes a substrate and one or more sets of layers disposed on the substrate. Each layer set comprises: a first layer comprising at least tantalum and oxygen (e.g., tantalum pentoxide (Ta2O5) material); a second layer including at least aluminum and nitrogen (e.g., aluminum nitride (AlN) material); and a third layer comprising at least hydrogen and silicon (e.g., a silicon hydride (Si: H) material). The second layer is disposed between the first layer and the third layer. In some implementations, the first surface of the second layer is disposed on the surface of the first layer, and the second surface of the second layer is disposed on the surface of the third layer.

According to the present invention there is provided a method of depositing a hydrogenated silicon carbon nitride (SiCN:H) film onto a substrate by plasma enhanced chemical vapour deposition (PECVD) comprising the steps of: providing the substrate in a chamber; introducing silane (SiH4), a hydrocarbon gas or vapour, nitrogen gas (N2), and hydrogen gas (H2) into the chamber; and sustaining a plasma in the chamber so as to deposit SiCN:H onto the substrate by PECVD at a process temperature of less than about 200° C.

The invention provides an anti-aging ethylene propylene diene monomer rubber compound which comprises a main material and an auxiliary material, the main material comprises the following components in parts by mass: 50-100 parts of maleic anhydride modified ethylene propylene diene monomer, 60-100 parts of a reinforcing filler, 40-60 parts of a plasticizer, 10-30 parts of N330 carbon black, 10-25 parts of mineral oil, 2-4 parts of an anti-aging agent, 1-5 parts of polyethylene glycol, 2-4 parts of a modifier, 2-5 parts of a compound containing a peroxy (O-O) structure, 3-10 parts of hyperbranched phosphamide modified graphene oxide and 5-10 parts of a calcium compound; 5-10 parts of hydrogenated silicone oil and 1.5-5 parts of an anti-aging agent; the auxiliary materials comprise the following components in parts by mass: 0.5-2 parts of stearic acid, 2-5 parts of zinc oxide, 10-15 parts of a solubilizer, 0.01-0.02 part of a catalyst and 0.2-0.5 part of a vulcanization accelerator; according to the present invention, with the synergistic effect of the peroxide (O-O) structure-containing compound, the hyperbranched phosphamide modified graphene oxide, the calcium compound and the hydrogenated silicone oil crosslinking, the strength and the toughness of the ethylene propylene diene monomer are enhanced, the damping performance of the ethylene propylene diene monomer is improved, the micro-damage is self-repaired in the thermal environment, the aging resistance of the rubber is increased, and the service life is prolonged.

The invention relates to a process for preparing acid-free hydrosiloxane equilibrates. A mixture is contacted with a macrocrosslinked water-containing cation exchange resin that contains sulfonic acid groups and left to react with rearrangement of the SiOSi bonds until the acid-free hydrosiloxane equilibrate produced in this way, in a metal-catalysed hydrosilylating addition onto at least one unsaturated polyether affords an addition product that is clear at T=25° C. The rearrangement of the SiOSi bonds is implemented in the temperature range from 10 to 50° C. The cation exchange resin is characterized in that the product P of the specific surface area thereof and the average pore diameter thereof is P≥2.2×10−3 m3 / kg and the specific surface area A is ≥35 m2 / g, and in that it additionally has a water.

The present invention relates to a process for the production of dihydrogen, comprising a step of bringing into contact: - hydrogenated silicon obtained by bringing a silicon substrate into contact with an acid, the silicon substrate having a purity of less than or equal to 99.99%, and - an alkaline solution, whereby dihydrogen is produced.

[Problem] To provide a composition which can contain a large amount of a functional inorganic filler, is sufficiently hard at room temperature in an uncured state, has sufficient hardness even when compression-molded, has excellent hot melt properties and the like characterized by high fluidity at high temperatures, and gives a cured product. [Solution] Provided is a curable silicone composition characterized by: comprising (A) an organopolysiloxane resin that has a softening point of 30°C or more, has a curing reactive functional group, and contains 20 mol% or more of a T-unit, (B) an organohydrogenpolysiloxane, (C) hydrosilylation reaction catalyst-containing thermoplastic fine resin particles, (D) a functional inorganic filler, and (E) an organopolysiloxane resin that does not have a hydrosilyl reactive functional group in the molecule, that has a silanol group content of 5.0 mol% or less, and that contains 20 mol% or more of a T-unit; and exhibiting hot melt properties as a whole. Also provided are a molded product of the curable silicone composition and a use thereof.

A process for producing one or more silane compounds (A) having at least one Si-H bond, comprising reacting one or more compounds having at least one Si-X bond (B), where X is a halogen atom, with one or more metal hydrides (C) in the presence of one or more heterocyclic ionic liquids.

This invention discloses a manufacturing apparatus for helium-silicon hydride thin films, with helium, hydrogen, or argon gas inlets independently located at both ends of the target mounting base. The manufacturing method is as follows: the target and substrate are respectively mounted onto the target mounting base and the workpiece; a vacuum is drawn; baking is initiated at a temperature ranging from 200℃ to 1000℃; after reaching the baking temperature, the temperature is maintained for half an hour; sputtering gas is activated with a flow rate set between 1 and 1000 sccm; a hydrogen-helium mixed gas is activated with a flow rate set between 1 and 1000 sccm, and the hydrogen-helium molecular ratio is between 10% and 90%; after sputtering, the sputtering gas is turned off, and the hydrogen-helium mixed gas is continuously introduced, maintaining the temperature for half an hour; after cooling, the furnace is opened, the substrate is removed, and the substrate is annealed in the atmosphere at a temperature of 200℃ to 500℃ for half an hour. This method and apparatus can greatly increase process stability and improve the uniformity of film thickness.

An optical interference filter includes one or more sets of layers. Each set of layers includes a first layer that includes at least aluminum and nitrogen (e.g., an aluminum nitride (AlN) material), a second layer that includes at least silicon and oxygen (e.g., a silicon dioxide (SiO2) material), and a third layer that includes at least hydrogen and silicon (e.g., a hydrogenated silicon (Si:H) material). The second layer is disposed between the first layer and the third layer.

The invention provides a cable material for a new energy charging pile and a preparation method of the cable material. The cable material is prepared from the following components: 25 to 35 percent of hydrogenated silicone rubber, 20 to 30 percent of poly (butylene succinate), 6 to 10 percent of carboxymethyl chitosan, 3 to 7 percent of rosemary phenolic acid ester, 3 to 7 percent of nano cellulose, 2 to 6 percent of polyglycerol polyricinoleate, 2 to 6 percent of tannic acid, 5 to 15 percent of aluminum hypophosphite, 2 to 4 percent of hindered amine light stabilizer, 2 to 4 percent of zinc oxide and 2 to 4 percent of titanate coupling agent. The hydrogenated silicone rubber and the poly (butylene succinate) are compounded to form an interpenetrating network structure, the polyglycerol polyricinoleate improves the processing and low temperature resistance of the material, the coupling agent optimizes the interface between the filler and the matrix, and multi-dimensional innovative design is performed from the molecular structure to the overall performance of the material.

To provide a two-pack curable composition set that prevents occurrence of cracks and enables maintenance of high thermal conductivity even under repeated exposure to high and low temperatures.SOLUTION: A two-pack curable composition set comprises a first agent including a vinyl-modified organopolysiloxane A and a second agent including a hydrosilyl-modified organopolysiloxane B, where at least one of the first agent and the second agent includes a reaction retarder C having an ethylenically unsaturated bond, and at least one of the first agent and the second agent includes an addition reaction catalyst D. The ratio of the total mass of the vinyl-modified organopolysiloxane A to the total mass of the reaction retarder C contained in the first agent and the second agent is from 500 to 2000, and the ratio of the total mass of the hydrosilyl-modified organopolysiloxane B to the total mass of the reaction retarder C contained in the first agent and the second agent is from 500 to 2000.SELECTED DRAWING: None

The present invention relates to a method for the preparation of trichlorosilane (HSiCl3) which comprises the reaction of tetrachlorosilane (SiCl4) with a hydridosilane in the presence of a catalyst. [Selected Figure] Figure 1

Compositions disclosed herein comprise a silicone rubber base composition comprising a vinyl silicone, a crosslinker comprising a pendant-only hydride silicone having an average silicon hydride (Si-H) content of at least 1 mmol / g, an inhibitor, a transition metal catalyst complex, and from about 0.2 wt.% to about 2 wt.%, based on a total weight of the composition, of a primary unsaturated fatty acid amide having a C=C double bond. Post-cured silicone products formed from the compositions are also provided.

This heat-curable and photocurable silicone composition comprises:(A) an organopolysiloxane having at least three (meth)acrylic groups per molecule;(B) an organopolysiloxane having at least two alkenyl groups per molecule and having no (meth)acrylic group;(C) an organohydrogen polysiloxane having at least two hydrosilyl groups per molecule;(D) a hydrosilylation reaction catalyst; and(E) a photopolymerization initiator,wherein the ratio of the number of (meth)acrylic groups in the component (A) to the number of alkenyl groups in the composition is 0.9-3.0, andthe ratio of the number of hydrosilyl groups to the number of alkenyl groups is 0.8-1.2. The heat-curable and photocurable silicone composition makes it possible to easily manage a first stage of curing and a second stage of curing separately.

Hydrogenated silicon heteropyrroles and hydrogenated silicon azapyrroles are a new class of heterocyclic compounds in which silicon is bonded to carbon and nitrogen atoms in the ring system, and one or two hydrogen atoms are attached to the silicon atom. These compounds are represented by formula (I), wherein R is a substituted or unsubstituted organic group and R' is an alkyl group. These compounds react with various organic and inorganic hydroxyl groups through ring-opening reactions and can be used to produce silicon nitride or silicon carbonitride films. #imgabs0#

This invention relates to the field of thermal interface materials and provides a thermally conductive silicone grease and its components. The thermally conductive silicone grease of this invention comprises a base adhesive and fillers; the volume ratio of the base adhesive to the fillers is (1-6):(4-9); the base adhesive comprises dual-vinyl-terminated polydimethylsiloxane, dual-hydrogen-terminated polydimethylsiloxane, and side-hydrogen-containing silicone oil; the molar content of the side-hydrogenated silane functional groups in the base adhesive is 0.0005 mol% to 0.003 mol%; the molar ratio of vinyl to hydrogenated silane functional groups in the base adhesive is (2-1.02):1; the molar ratio of the side-hydrogenated silane functional groups to hydrogenated silane functional groups in the base adhesive is (0.02-0.5):1. This invention starts from the fundamental point of structure and performance correspondence, innovatively designs the crosslinking network structure of the base adhesive, and then achieves the preparation of highly reliable thermally conductive silicone grease through precise proportion control.

The invention discloses a metal piece, a coating method and electronic equipment, the metal piece comprises a metal base material, a bottom layer, a transition layer and an interference layer, the bottom layer covers the surface of the metal base material, and the transition layer covers the surface, away from the metal base material, of the bottom layer; the interference layer covers the surface, deviating from the base layer, of the transition layer, and the interference layer comprises silicon nitride layers and silicon hydride layers which are alternately arranged. In the metal piece, the bottom layer, the transition layer and the interference layer are formed on the surface of the metal base material, the bottom layer plays a role in improving the bonding firmness between the metal base material and the transition layer, the transition layer provides a background color so that the color of the interference layer can be better presented, and the interference layer contains the silicon nitride layers and the silicon hydride layers which are alternately arranged, so that the service life of the metal piece is prolonged. The appearance of the metal piece can be orange, the color saturation of the orange is improved, and the whole appearance of the metal piece is helped to be bright orange.

To provide a two-pack curable composition set that prevents occurrence of cracks and enables maintenance of high thermal conductivity even under repeated exposure to high and low temperatures.SOLUTION: A two-pack curable composition set comprises a first agent including a vinyl-modified organopolysiloxane A and a second agent including a hydrosilyl-modified organopolysiloxane B, where at least one of the first agent and the second agent includes a reaction retarder C having an ethylenically unsaturated bond, and at least one of the first agent and the second agent includes an addition reaction catalyst D. A cured product obtained by mixing the first agent and the second agent in equal volumes is subjected to 1000 cycles of maintaining at 150°C for 30 minutes and then maintaining at -40°C for 30 minutes, such that a ratio C1000 / C0, which is a ratio of an Asker C hardness C1000 after the cycles to an Asker C hardness C0 before the cycles, is less than 2.0.SELECTED DRAWING: None

To provide a two-pack curable composition set that prevents occurrence of cracks and enables maintenance of high thermal conductivity even under repeated exposure to high and low temperatures.SOLUTION: A two-pack curable composition set comprises a first agent including a vinyl-modified organopolysiloxane A, and a second agent including a hydrosilyl-modified organopolysiloxane B, where at least one of the first agent and the second agent includes a reaction retarder C, and at least one of the first agent and the second agent includes an addition reaction catalyst D. The vinyl-modified organopolysiloxane A, the hydrosilyl-modified organopolysiloxane B, the reaction retarder C, and the addition reaction catalyst D contained in the first agent and the second agent are mixed and subjected to continuous dynamic viscoelasticity measurement while maintained at 150°C, such that a ratio G'(14) / G'(8), which is a ratio of a storage modulus G'(14) after 14 hours to a storage modulus G'(8) after 8 hours, is 1.5 or less.SELECTED DRAWING: None

The present invention relates to a process for preparing hydrosilanes by means of the electrochemical reduction of corresponding (pseudo-)halosilanes in the presence of a transition metal complex as a hydride transfer agent, and a protonated (or deuterated) organic base as a source of protons (or deuterium). The process of the invention is part of a circular approach to the silicon element, because it enables (pseudo-)halosilane compounds, which are common waste products from silicon chemistry, to be recycled into hydrosilanes with higher added value.

In some implementations, the optical interference filter includes a substrate and one or more layers disposed on the substrate. Each layer comprises: a first layer comprising at least tantalum and oxygen (e.g., tantalum pentoxide (Ta₂O₅)); a second layer comprising at least aluminum and nitrogen (e.g., aluminum nitride (AlN)); and a third layer comprising at least hydrogen and silicon (e.g., silicon hydride (Si:H)). The second layer is disposed between the first and third layers. In some implementations, a first surface of the second layer is disposed on the surface of the first layer, and a second surface of the second layer is disposed on the surface of the third layer.

This method for manufacturing a laminate including two silicon substrates includes: (a) a step for preparing a first silicon substrate having a first bonding part and a second silicon substrate having a second bonding part, the first and second bonding parts containing silicon oxide; (b) a step for preparing a first composition containing at least one of an organic material capable of reacting with a hydrosilyl group and / or a silanol group and an inorganic material capable of being bonded to silicon oxide, and having a particle amount of 3,000 pieces / mL or less; and (c) a step for providing an adhesive layer by using at least one of the organic material and the inorganic material, and bonding the first bonding part and the second bonding part to the organic material and / or a reaction product derived from the organic material, or bonding the first bonding part and the second bonding part to the inorganic material and / or a reaction product derived from the inorganic material. The adhesive layer includes a first adhesive part provided on the first bonding part, and the number of clusters of particles included in a surface of the first adhesive part on the opposite side of the first bonding part is 5 pieces / cm2 or less.

A silicone composition contains(A) an organopolysiloxane having at least three (meth)acrylic groups in one molecule,(B) an organopolysiloxane having at least two alkenyl groups in one molecule and not having a (meth)acrylic group,(C) an organohydrogenpolysiloxane having at least two hydrosilyl groups in one molecule,(D) a photopolymerization initiator, and(E) a hydrosilylation reaction catalyst,wherein:the content of the (meth)acrylic groups contained in the (A) component is 1-15 mmol in 100 g of the composition;the ratio of the number of the alkenyl groups in the composition / the number of the (meth)acrylic groups contained in the (A) component is at least 0.5; andthe ratio of the number of the hydrosilyl groups / the number of the alkenyl groups and (meth)acrylic groups contained in the (A) and (B) components is 0.8-3.0.This silicone composition makes it possible to individually and simply manage curing at a first stage and curing at a second stage.

The present disclosure provides a method of preparing an organosilicon compound. The method comprises combining (A) a hydridosilane conforming to formula RxHySiQz, (B) an arene compound, and (C) a catalyst. The (C) catalyst comprises a boron cluster and can couple the arene compound (B) to a silicon atom of the hydridosilane (A), thereby preparing a reaction mixture comprising the organosilicon compound conforming to formula Rx'R1 y'SiQz'. R is an alkyl group having from 1 to 4 carbon atoms. Each Q is an individually selected halogen atom. Each of subscripts x, y, and z are independently 1 or 2, subject to the proviso that x+y+z=4. Each R1 is an independently selected aryl group, and each of subscripts x', y', and z' are 1 or 2, subject to the provisos that x=x' and x'+y'+z'=4. A reaction product comprising the organosilicon compound prepared in accordance with the method is also provided.