Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

41 results about "Polysilicon hydride" patented technology

Polysilicon hydrides are polymers containing only silicon and hydrogen. They have the formula (SiHₙ)ₓ where 0.2 ≤ n ≤ 2.5 and x is the number of monomer units. The polysilicon hydrides are generally colorless or pale-yellow/ocher powders that are easily hydrolyzed and ignite readily in air. The surfaces of silicon prepared by MOCVD using silane (SiH₄) consist of a polysilicon hydride.

Double-layer air-guide heat insulation shield of polysilicon hydriding furnace

The invention discloses a double-layer air-guide heat insulation shield of a polysilicon hydriding furnace, which comprises an inner-layer heat insulation shield and an outer-layer heat insulation shield sleeved outside the inner-layer heat insulation shield, wherein heat insulation chassises are arranged at the bottom of the inner-layer heat insulation shield and the bottom of the outer-layer heat insulation shield, and an air-guide channel is formed between the inner-layer heat insulation shield and the outer-layer heat insulation shield; an air inlet channel is arranged at the lower part of the outer-layer heat insulation shield, and an air inlet channel is arranged at the upper part of the inner-layer heat insulation shield. In the invention, two layers of heat insulation shields are arranged, and the air-guide channel is formed between the two heat insulation shields, therefore, process tail gas can enter into a reaction region in the inner-layer heat insulation shield through the air-guide channel. The invention has the advantages: firstly, the process tail gas is poor conductor of heat and can play a better heat insulation role; secondly, the process tail gas is preheated after absorbing heat transferred from the reaction region while passing the air-guide channel, thereby improving the reaction efficiency of the process tail gas after entering into the reaction region; and thirdly, the airflow direction formed by the double-layer heat insulation shield can ensure that the device is safer and more stable.
Owner:SHANGHAI MORIMATSU NEW ENERGY EQUIPMENT CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products