Mold release film

A release film and release agent technology, which is applied in the direction of film/sheet adhesives, synthetic resin layered products, coatings, etc., can solve the problem of insufficient adhesion between the release layer and the antistatic layer

Active Publication Date: 2018-11-23
MITSUBISHI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The other side of the antistatic film described in this document is that the antistatic property is good. When a release layer is provided on the antistatic layer, the adhesion between the release layer and the antistatic layer may not be sufficient.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

manufacture example

[0082] As a specific manufacturing example of a urethane resin, the method using the reaction of a hydroxyl group and an isocyanate is mentioned, for example. As the hydroxyl group used as a raw material, a polyol is suitably used, and examples thereof include polyether polyols, polyester polyols, polycarbonate polyols, polyolefin polyols, and acrylic polyols. These compounds may be used alone or in combination.

[0083] Examples of polyether polyols include polyethylene glycol, polypropylene glycol, polyethylene propylene glycol, polytetramethylene ether glycol, polyhexamethylene ether glycol, and the like.

[0084] Examples of polyester polyols include polycarboxylic acids (malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, sebacic acid, fumaric acid, maleic acid, terephthalic acid, isophthalic acid, etc.) or their anhydrides and polyols (ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropyl...

Embodiment 1A

[0182] The above-mentioned polyester (1) is supplied as a raw material to an extruder with a vent hole, and after being melt-extruded at 290°C, it is carried out on a cooling roll with a surface temperature set at 40°C using an electrostatic application method. After cooling and solidification, an amorphous film with a thickness of about 550 μm was obtained.

[0183] The film was stretched 3.7 times in the longitudinal direction at 85° C., 3.9 times in the transverse direction at 100° C., and heat-treated at 210° C. to obtain a biaxially stretched polyester film with a thickness of 38 μm.

[0184] Use the reverse gravure coating method to apply the release agent composition shown below at a coating amount (after drying) of 0.200 g / m 2 It was coated on the obtained polyester film in the same way as above, and a roll-shaped release film was obtained under the conditions of a dryer temperature of 150° C. and a line speed of 30 m / min. The evaluation results of the release film ar...

Embodiment 2A～4A

[0189] [Examples 2A to 4A], [Comparative Examples 1A to 6A]

[0190] Except having changed into the release agent composition shown in Table 1A about a silicone type release layer, it manufactured similarly to Example 1A, and obtained the release film. The evaluation results of the release film are shown in Table 2A.

[0191]

[0192] a1: Vinyl-modified silicone resin having at least 2 vinyl groups in the structure of polydimethylsiloxane (weight average molecular weight: 2000)

[0193] a2: Vinyl-modified silicone resin having at least 2 vinyl groups in the structure of polydimethylsiloxane (weight average molecular weight: 20000)

[0194]a3: Vinyl-modified silicone resin having at least 2 vinyl groups in the structure of polydimethylsiloxane (weight average molecular weight: 1000)

[0195] a4: Vinyl-modified silicone resin having at least 2 vinyl groups in the structure of polydimethylsiloxane (weight average molecular weight: 60000)

[0196] a5: Vinyl-modified silicone ...

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Abstract

Provided is a mold release film which exhibits excellent releasability from an adhesive, while being suppressed in migration, and which is suitable for the purpose of protecting various adhesive layers. A mold release film which has, on at least one surface of a polyester film, a silicone-based mold release layer that is formed from a mold release agent composition containing a first polydimethylsiloxane which has a weight average molecular weight of from 500 to 30,000 (inclusive), while having at least one alkenyl group in each molecule, a second polydimethyl siloxane which has a weight average molecular weight of from 150 to 10,000 (inclusive), while having at least one hydrosilyl group in each molecule, and a platinum-based catalyst.

Description

technical field [0001] The present invention relates to release films. Background technique [0002] Conventionally, release films based on polyester films have been used in various applications (capacitive touch panels, polarizing plates for LCDs, retardation plates, PDP components, organic EL components, etc.) Components, various display components, various optical applications, etc.). [0003] The substrate-less double-sided adhesive sheet is formed by laminating a light release film with a relatively low release force and a heavy release film with a relatively high release force on both sides of the adhesive layer. After removing the release film on both sides, only the Double-sided adhesive sheet without an adhesive layer supporting a substrate. [0004] As a method of using a substrate-less double-sided adhesive sheet, the following processing steps can be exemplified: first, the light release film is peeled off, and one surface of the exposed adhesive layer is adher...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00B32B27/36C08J7/04C08J7/06C08L83/05C08L83/07C08J7/043C08J7/044C08J7/046
CPCB32B27/00B32B27/36C08J7/043C08J7/046C08J7/044C09J7/401C08J5/18B32B27/283C08J7/04C09J7/29C08J2367/00C08J2483/04
Inventor 铃木太朗
Owner MITSUBISHI CHEM CORP
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