The invention relates to the technical field of heat dissipation, in particular to the technical field of heat dissipation of personal computers, workstations and servers, and particularly relates to an
open type air duct memory radiator. The radiator comprises radiating fins, a limiting component and a heat-conducting medium, wherein the radiating fins, the limiting component and the heat-conducting medium surround a
memory bank to form an
open air duct. The cooling fins are symmetrically arranged on the two sides of the
memory bank; the limiting component is arranged between the two cooling fins and abuts against the top of the
memory bank. And the heat-conducting medium is arranged on a
memory chip of the memory
bank and is in contact with the inner surfaces of the adjacent cooling fins. According to the
internal memory radiator, internal accumulated heat is reduced through the
open air duct, and the air flowing efficiency is improved; and heat generated during operation of the memory
bank is directly conducted to the cooling fins through the heat-conducting medium, so that the heat conduction efficiency is improved. The flow guide type design of an
open type air channel is combined with the direct heat conduction design, efficient heat dissipation is achieved, and stable operation of the memory
bank is guaranteed.