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124 results about "Reversal film" patented technology

In photography, reversal film is a type of photographic film that produces a positive image on a transparent base. The film is processed to produce transparencies or diapositives (abbreviated as "diafilm" in many countries) instead of negatives and prints. Reversal film is produced in various sizes, from 35 mm roll film to 8×10 inch sheet film.

Manufacturing process for step circuit of PCB (Printed Circuit Board)

InactiveCN102651946AReduce copper thickness dropEliminate poor quality defectsConductive material chemical/electrolytical removalProduction scheduleEngineering
The invention discloses a manufacturing process for a step circuit of a PCB (Printed Circuit Board). According to the manufacturing process, different film patterns are adopted twice for manufacturing the circuit, during the primary film pattern circuit manufacture, a positive film circuit pattern is adopted, compensation is carried out a film substrate circuit at different positions according to copper thickness so as to manufacture a special circuit, and sunk copper plate electrification is carried out on the special circuit, so that the copper thickness meets the requirement; then board grinding is carried out by a twice board grinding mode so as to reduce the copper thickness difference of step positions; a dry film is enabled to be fully combined with the step positions by virtue of a film attaching and air compressing mode; and finally, normal circuit pattern manufacturing is carried out by utilizing a high-precision LDI (Laser Direct Imaging) exposure machine. Compared with the prior art, the manufacturing process for the step circuit can be used for eliminating the defects of open circuit at the position of the step circuit, notches, large deckle edges, serious lateral erosion, halfway etching and poor quality of thin lines and the like existing in the step circuit manufacturing process, improving the production efficiency and the production quality, quickening the production schedule and lowering the production cost.
Owner:SHENZHEN SUNTAK MULTILAYER PCB

Method for converting scalar image into vector image

The invention discloses a method for converting a scalar image into a vector image. Lining is carried out on an original image so that an edge skeleton map of the image can be obtained; color gradation standardization adjusting is carried out on the edge skeleton map to obtain a skeleton map with enhanced lines; an image threshold value is calculated, and binaryzation is carried out on the image threshold value; edge skeleton points are acquired, and a polygon is formed by the continuous edge skeleton points; curve fitting is carried out on the points of each polygon; the polygons on which curve fitting is carried out are drawn through a bezier curve and filled with black, and a vector edge image is obtained; the original image is smoothened based on the bilateral filter iteration to obtain an image with the smooth plane; positive bottom overlaying operation is carried out on the plane image and the vector edge image, and the vectorization cartoon image with the clear skeleton is obtained. The method has the advantages that the processing speed is high, the algorithm of the method can be achieved on a smart phone, the processing effect is good, the image is smooth, colors are abundant, the skeleton is clear, the expanding performance is high, and the scalar image can be changed into various special vector effects.
Owner:CHENDU PINGUO TECH CO LTD

Manufacturing method of circuit board with selectively plated copper and tin

The invention relates to a manufacturing method of a circuit board with selectively plated copper and tin, comprising the following steps: coating a plating-resistant cover film on a copper precipitation circuit board or a circuit board plated with copper at first time, and then bonding positive sheets of all metal holes and hole rings, which are contained in circuit diagrams, on the plating-resistant cover film to form a primary circuit after exposure and development; plating copper and tin on the hole walls of all the metal holes and the hole rings and then carrying out film de-coating; coating a corrosion-resistant cover film on the de-coated circuit board, and then bonding negative sheets of the circuit diagrams on the corrosion-resistant cover film to form a secondary circuit after exposure and development; etching the circuit diagrams and then carrying out film de-coating and tin de-coating; and manufacturing a circuit board product after welding prevention, exposure, development, element mark printing, tin spraying, anti-oxidation process or turmeric and outline process. The invention selectively plates copper and tin, thereby greatly reducing the amount of copper and tin to greatly reduce the environmental pollution from tin de-coating process, effectively saving the copper, tin, water, electricity, chemical materials, energy charges and manpower and effectively reducing the production costs for enterprises.
Owner:深圳市源基电子科技有限公司 +1

Circuit board manufacturing method without tin plating, tin retreating and capable of saving copper and nickle

A method for manufacturing circuit board which is free of tin plating and tin removing and can save the using amounts of copper and nickel comprises the following steps: a. coating plating-resistant covering film on the circuit board after copper deposition or the first time of copper plating, then adhibiting the positive film of all metal holes and hole rings in the circuit pattern on the covering film for forming a primary circuit after exposing and developing; b. electroplating copper and nickel on the hole wall and hole ring of all metal holes, then removing the covering film; c. coating etching-resistant covering film on the circuit board after film removing, adhibiting the negative film of circuit pattern on the etching-resistant covering film, and forming the secondary circuit after exposing and developing; d. etching the circuit pattern, then removing film and checking erosion; and e. forming the finished product of circuit board through executing the steps of resistance welding, exposing, developing, printing component symbol or tin spraying or executing oxidation prevention procession. The method of the invention can reduce environment pollution and realize clean production through eliminating electrotinning and tin removing technique, effectively saves metal, water, electricity and chemical material and reduces production cost of enterprise through selectively electroplating copper and nickel.
Owner:陈国富
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