The invention relates to a manufacturing method of a circuit board with selectively plated
copper and
tin, comprising the following steps:
coating a plating-resistant cover film on a
copper precipitation circuit board or a circuit board plated with
copper at first time, and then bonding positive sheets of all
metal holes and hole rings, which are contained in circuit diagrams, on the plating-resistant cover film to form a primary circuit after
exposure and development; plating copper and
tin on the hole walls of all the
metal holes and the hole rings and then carrying out film de-
coating;
coating a
corrosion-resistant cover film on the de-coated circuit board, and then bonding negative sheets of the circuit diagrams on the
corrosion-resistant cover film to form a
secondary circuit after
exposure and development;
etching the circuit diagrams and then carrying out film de-coating and
tin de-coating; and manufacturing a circuit board product after
welding prevention,
exposure, development, element mark printing, tin spraying, anti-
oxidation process or turmeric and outline process. The invention selectively plates copper and tin, thereby greatly reducing the amount of copper and tin to greatly reduce the environmental
pollution from tin de-coating process, effectively saving the copper, tin, water,
electricity, chemical materials, energy charges and manpower and effectively reducing the production costs for enterprises.