The invention discloses a method for making an outer layer pattern of a thick copper plate, comprising the following steps: a. sticking a dry film on the copper surface of the thick copper plate according to the copper thickness of the outer layer; b. first exposure and first development; c. , coating wet film; d, second exposure, second development, making outer layer circuit graphics; e, laser window opening, will need to make thick copper layer by laser window opening at the position where the hole is sealed by dry film; f , Pattern electroplating, to meet the requirements for the thickness of the copper layer in the hole and on the surface of the copper plate. For the thick copper core board with uneven surface, apply the dry film first, seal the hole with the dry film after making the circuit pattern, and then apply the wet film to fill the gap, which improves the dry film and copper surface only. Combined with the problem of being weak and easy to fall off, the quality of the thick copper plate is improved, the production yield is improved, and the production cost is reduced.