The embodiment of the invention provides a
chip packaging method and a
chip packaging structure. The method comprises the following steps: providing a
chip, a substrate, a heat dissipation cover plate and a heat conduction
metal sheet; wherein a gas groove is formed in the surface of the heat-conducting
metal sheet; the front face of the chip is fixed to the first surface of the substrate, the heat conduction
metal sheet is arranged on the back face of the chip, the heat dissipation cover plate is fixed to the first surface of the substrate and arranged on the surface, away from the chip, of the heat conduction
metal sheet, and a to-be-welded unit is obtained; the gas groove is filled with weld-aid gas; and the heat dissipation cover plate is welded and fixed on the back surface of the chip through the heat conduction
metal sheet. According to the embodiment of the invention, the surface of the heat-conducting
metal sheet and the surface of the gold-plated layer of the heat-dissipating cover plate are provided with the grooves, so that
welding-aid gas can enter the grooves to be in full contact with the
welding surface, the problem that
formic acid gas is not easy to enter the
welding surface is solved, cavities in the welding surface are avoided, and the heat-dissipating efficiency of the packaged chip is ensured.