556results about How to "Avoid voids" patented technology

A solid-sealing type organic EL display device is provided that can prevent water permeation through a defect generated in a passivation film which covers an extraction line in a peripheral sealing region thereby making it possible to prevent deterioration of an organic EL layer. An extraction line that couples a wiring line in a display region with a terminal part passes a peripheral sealing region. The extraction line is covered with an inorganic passivation film in the peripheral sealing region. The extraction line has a first flexure part and a second flexure part in the peripheral sealing region thereby making it possible to prevent a void and a crack generated in the inorganic passivation film from penetrating the peripheral sealing region. Consequently it is possible to prevent water permeation from outside and to prevent the deterioration of the organic EL layer.

The invention relates to a steel structure and foundation pre-burying connection structure, which is characterized in that the pre-burying connection structure is integrally cast by a prefabricated component and a foundation bottom plate, the prefabricated component is a steel bar concrete connecting block with a connecting steel plate embedded in the upper surface, the periphery of the steel bar concrete connecting block is provided with reserved steel bars connected with steel bars arranged in a foundation, a plurality of steel structure connecting screw rods penetrating through the prefabricated component are arranged in a range of the connecting steel plate, and the lower parts of the connecting screw rods extend into the foundation. The connecting structure provided by the invention has the advantages that the connection intensity of the steel structure and the foundation can be effectively improved, the problems of bottom hollowing and the like due to non-compact casting of the bottom concrete of the traditional pre-burying component and nonuniform deformation of the steel plate and the concrete can be solved, and better technical and economic benefits are realized. The invention also discloses a construction method of the pre-burying connecting structure.

A wiring board with lead pins having high reliability is provided. When the lead pins are attached to electrode pads, the lead pins are attached to the electrode pads without leaving voids in a conductive agent, and bonding strength of the lead pins are improved. When the wiring board to which the lead pins are attached is reheated, the lead pins are prevented from being inclined or shifted from their normal positions. In the wiring board with lead pins formed by attaching head portions of the lead pins to the electrode pads formed on the wiring board through the conductive agent, the lead pin has notch portions are formed in cut-out shapes in peripheral edge portion of the disk shaped head portion.

The invention provides a bread making method. A bread machine is used for making bread, the bread machine consists of a bread bucket and an oven bucket, a steam device is arranged between the bread bucket and the oven bucket, and the steam device is used for generating steam under the heating action of a heating element arranged on the inner side wall of the oven bucket. The making method comprises the following steps: firstly, putting bread raw materials in the bread bucket, and forming a bread dough under the stirring action of a stirring piece, wherein the stirring time is 20 to 40 min; secondly, controlling the temperature inside the bread machine to be 28 to 35 DEG C, and fermenting the bread blanks for 50 to 90 min; thirdly, controlling the temperature inside the bread machine to be 50 to 80 DEG C and the relative humidity to be 80% to 90%, and finally fermenting the fermented bread dough for 20 to 30 min; fourthly, controlling the temperature inside the bread machine to be 110 to 140 DEG C, and carrying out high-temperature baking on the bread dough after final fermentation to make the bread. The bread making method provided by the invention solves the technical problem that bread skins of the bread made by an existing bread making method are relatively thick as well as brown and crisp.

A process for reparing the surface defects on the surface of carbon fibre by gas-phase deposition method includes such steps as preparing an acetylene reaction environment, putting the defective carbon fibres in it, heating by focused electromagnetic field to crack the acetylene into H2 and carbon atoms, and depositing the carbon atoms on the surface of carbon fibres.

The invention discloses a sleeve reinforced concrete column. The sleeve reinforced concrete column is characterized in that: a sleeve (1) of a reinforced concrete column (2) is a prefabricated active powder concrete sleeve. The sleeve reinforced concrete column has the advantages of convenience for construction, low cost, high axial bearing capacity, good shock resistance, predominant fireproof performance, excellent durability and the like, meanwhile, saves more resources and energy, and accords with the requirements of sustainable development.

The invention relates to a construction method of a tunnel two-lining concrete pouring system, which comprises the following steps of: carrying out full-coverage scanning on a primary cross section byusing a three-dimensional laser scanner, calculating an estimated pouring two-liner concrete square quantity, and transmitting the estimated pouring two-liner concrete square quantity to an electriccabinet (40); installing a strip-shaped pressure sensing gasket (33) and a transparent pipe (30); installing a pressure sensing chip (9), a pressure sensing piece (32) and a temperature sensor (5); arranging a high-frequency pneumatic vibrator (12) and an automatic insertion type vibrator (18), and installing a flow sensor (1); stopping jacking when the pressure sensing value of the pressure sensing chip (9) is greater than the pressure resistance value of the upper plate two-lining concrete, installing a comprehensive pipe (3); pressing air, monitoring the square quantity of the concrete; carrying out pneumatic vibrating; carrying out insertion vibrating; judging that the concrete is full, and finishing pouring the concrete. The automation of the pouring of the two-lining concrete is achieved.

The invention provides a transistor forming method. The transistor forming method is characterized in that a substrate can be provided; dummy grid layers can be formed on the surface of the substrate, and the surfaces of the side walls of the dummy grid layers are provided with side walls; first dielectric layers are formed on the substrate and the surfaces of the side walls, and the surfaces of the first dielectric layers are lower than the surfaces of the dummy grid layers; the side walls higher than the surfaces of the first dielectric layers can be removed, and the parts of the surfaces of the side walls of the dummy grid layers can be exposed, and first openings can be formed in the first dielectric layers between adjacent dummy grid layers and the surfaces of the side walls; second dielectric layers are formed in the first openings, and the surfaces of the second dielectric layers are aligned with the surfaces of the dummy grid layers, and the densities of the materials of the second dielectric layers are higher than the densities of the materials of the first dielectric layers; the dummy grid layers can be removed, and second openings can be formed in the second dielectric layers and the first dielectric layers; the etching of the side walls of the second dielectric layers of the second openings can be carried out, and then the sizes of the top parts of the second openings can be enlarged; grid layers can be formed in the second openings after the etching of the side walls of the second dielectric layers of the second openings. The performance of the formed transistors is stable, and the reliability can be improved.

The present invention relates to a ceramic electronic component wherein via conductors that are embedded in through holes of dielectric layers formed from a sintered body of ceramic particles are made by firing a electrically conductive paste for via conductor that contains inorganic particles made of the same material as the ceramic particles that constitute the dielectric layer and having an average particle diameter smaller than that of the ceramic particles, and a method for manufacturing the same. According to the present invention, such a ceramic electronic component can be provided that the via conductors and the internal electrodes are electrically connected with each other satisfactorily without voids generated therein.

The invention provides an anti-overturning reinforcement system for single-column pier bridges, which comprises a steel structure support, a steel connecting base, and rigid tie rods; the steel structure support comprises two semicircular hoops with cantilevers, and the surface, which is in contact with a pier, of each semicircular hoop is provided with reserved holes for the mounting of anchor bolts at intervals; the external surfaces of the semicircular hoops are provided with axial reinforcing ribs; the two semicircular hoops are connected through first high-strength bolts to hoop both sides of the pier, and the semicircular hoops and the cantilevers are of an integrated structure; one end, which is far from the hoop, of each cantilever is provided with a vertically through mounting through hole; the steel connecting base is fixed on the bottom of a bridge, the center of the steel connecting base and the center of the through hole are on the same vertical line, and both ends of eachrigid tie rod are respectively fixedly connected to the steel structure support and the steel connecting base. The invention can effectively enhance the anti-overturning performance of a single-column pier bridge, the structure is simple, stress is clear, construction is convenient, the anti-overturning reinforcement system has relatively good economical efficiency and appearance, and the invention is suitable for popularization and application in the field of bridge reinforcement.

The purpose of the present invention is to provide a semiconductor device manufacturing method, whereby cutting reliability of an adhesive film can be improved and debris contamination due to the adhesive film can be suppressed. Provided is a semiconductor device manufacturing method which is provided with: a step wherein, after forming a groove (4S) on the front surface of a semiconductor wafer (4), a protective adhesive film (44) is adhered, the rear surface of the semiconductor wafer is ground, and the groove is exposed from the rear surface; a step wherein, after adhering the adhesive film on the rear surface of the semiconductor wafer, the protective adhesive film is peeled; and a step wherein a laser beam having a wavelength of 355 nm is radiated along the groove exposed from the adhesive film, and the adhesive film is cut. The adhesive film has (a) a light absorption coefficient of 40 cm-1 or more at a wavelength of 355 nm, (b) a tensile storage elastic modulus of 0.5-20 MPa at 50 DEG C, and (c) a tensile storage elastic modulus of 0.3-7 MPa at 120 DEG C, or a melt viscosity of 2,000 Pa.s or more at 120 DEG C.

The invention provides a method for manufacturing shallow trench isolation. After being etched to form a shallow trench, a substrate is subject to an annealing process under a certain condition of hydrogen atmosphere, so that element atoms of the substrate are promoted to make thermal motion migration under a high temperature, side walls of the rough shallow trench and square corners of the shallow trench become smooth, the leakage current of a semiconductor device employing the shallow trench isolation is reduced, and the performances of the semiconductor device and an integrated circuit are improved.

The invention discloses a manufacturing method of a prefabricated structural column formwork. According to the manufacturing method of the prefabricated structural column formwork, a prefabricated structural column formwork manufacturing device is used, the two ends of a structural column steel bar penetrate through through holes in sealing cover plates at the two ends correspondingly so that the structural column steel bar can be positioned, then concrete is poured into a structural column concrete pouring trough directly, a vibration platform is started at the same time, the concrete can evenly fill all portions in the structural column concrete pouring trough, cavitation can be avoided, and a corresponding formwork is removed after the concrete is solidified. The prefabricated structural column formwork is manufactured easily and conveniently, and the forming quality is high.

A semiconductor process includes the following step. A metal gate strip and a cap layer are sequentially formed in a trench of a dielectric layer. The cap layer and the metal gate strip are cut off to form a plurality of caps on a plurality of metal gates, and a gap isolates adjacent caps and adjacent metal gates. An isolation material fills in the gap. The present invention also provides semiconductor structures formed by said semiconductor process. For example, the semiconductor structure includes a plurality of stacked structures in a trench of a dielectric layer, where each of the stacked structures includes a metal gate and a cap on the metal gate, where an isolation slot isolates and contacts adjacent stacked structures at end to end, and the isolation slot has same level as the stacked structures.

The invention relates to a high polymer material field, in particular to a prepreg compound used in a vacuum forming massive article, which comprises reinforcing fiber, matrix resin and fiber base-material and is characterized in that the reinforcing fiber is retted by the matrix resin to form the reinforcing fiber at one side which is completely soaked by the matrix resin and the prepreg compound at the other side which is not completely soaked by the matrix resin; wherein for one side of the reinforcing fiber which is not completely by the matrix resin, the soakage rate of the matrix resin is more than or equal to 20% and is less than or equal to 95%.

The invention provides a preparation method of a shallow trench isolation structure. After a linear oxidation layer is formed in a trench, a linear amorphous silicon layer is introduced to consume H2O and other oxygen-containing groups generated in a subsequent water steam annealing step for an isolation medium layer, and diffusion of the formed H2O and the other oxygen-containing groups to a semiconductor substrate is further stopped; during water steam annealing of the linear amorphous silicon layer, the semiconductor substrate on the side wall of the trench is replaced, and the H2O and the other oxygen-containing groups are consumed and completely converted into SiO2 to be part of the isolation medium layer in the trench, so that oxidation of a boundary of an active area of the side wall of the trench in the water steam annealing process can be avoided, the material consumption of the semiconductor substrate on the side wall of the trench is reduced, the decrease of the critical dimensions (AA CD) of the active area is reduced, and meanwhile, the defect of forming of a cavity or a gap inside an isolation medium filled in the trench is avoided.

The invention discloses a resin hole-plugging method for a large-aperture back-drilled hole, and the method comprises the following steps: drilling a through hole on a production plate, wherein one surface of the production plate is a back-drilled surface, and the other surface is a non-back-drilled surface; metalizing the through hole through copper deposition and full-board electroplating in sequence; performing back drilling at the position, corresponding to the metallized through hole, in the back-drilled surface through a depth-controlled drilling method, and forming a stepped back-drilled hole, wherein the hole diameter of the back-drilled part is larger than that of the through hole; filling resin in the back-drilled hole in a vertical vacuum hole-plugging manner and performing curing; filling resin into the back-drilled hole for the second time in a horizontal vacuum hole-plugging manner and curing; and removing the resin protruding out of the plate surface through an abrasivebelt grinding plate. According to the method, the quality problems that a conventional resin hole-plugging process cannot be used for manufacturing or hole plugging cavities, holes are not full, and hole openings are sunken are solved, full resin hole plugging is ensured, and hole opening sunken parts are less than 30 microns.

The invention relates to a pre-warning method for preventing tunnel vault concrete from disengaging. An anti-disengaging pre-warning device and a tunnel second lining trolley are included. The anti-disengaging pre-warning device comprises pressure contact induction devices, network cables, an electric switch box and an alarming system. The pre-warning method comprises the following steps that a, the pressure contact induction devices are mounted on a tunnel vault waterproof plate corresponding to the tunnel second lining trolley, and the pressure contact induction devices, the electric switchbox and the alarming system are connected to form the anti-disengaging pre-warning device through the network cables; b, pouring of the second lining concrete is conducted by using the tunnel second lining trolley; and c, along with rising of a pouring face of the second lining concrete in the pouring process, the concrete is in contact with the pressure contact induction devices on the tunnel vault waterproof plate, the corresponding alarming system gives out an alarm, and it is proved that the second lining vault concrete is poured compactly. The pre-warning method can well avoid the existing phenomena of disengaging and hollow voids caused by incompact grouting of the tunnel second lining vault concrete.