Manufacturing method for JANS plate type thick film resistor
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A technology of thick film resistors and manufacturing methods, which is applied in the direction of resistor manufacturing, resistors, resistors with lead-out terminals, etc., can solve the problems of low reliability, failure to meet the requirements of spacecraft use, and high failure rate, so as to improve reliability , improve adhesion, improve the effect of quality
Active Publication Date: 2009-12-02
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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Problems solved by technology
However, the current chip thick film resistors manufactured by ordinary methods have defects such as high failure rate and low reliability, which can no longer meet the requirements of spacecraft.
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[0021] The present invention will be further described below in conjunction with specific embodiment:
[0022] 1) Put the ceramic substrate with an alumina content of more than 96% into an ultrasonic cleaning tank with a frequency of 10-20KHz and a power of 25-50W, and clean it with deionized water with a resistivity of 2MΩ or more for 2-10min, Then dry at 100±5°C for 25 minutes;
[0023] 2) Print the surface electrode on the surface of the cleaned ceramic substrate, and then dry it at 125°C for 10 minutes; ensure that the printing thickness reaches 15-20μ after drying, and the electrode paste used for printing is prepared from palladium-silver alloy according to the conventional method. The content of metal palladium in the alloy is 1% to 10%, and the rest is metal silver;
[0024] 3) Print the back electrode on the back of the cleaned ceramic substrate, and then dry it at 125°C for 10 minutes; ensure that the printing thickness reaches 15-20μ after drying, and the electrode...
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Abstract
The invention discloses a manufacturing method for a JANS plate type thick film resistor, which belongs to a manufacturing method for a plate type resistor. The invention aims to provide the manufacturing method for the JANS plate type thick film resistor. The manufacturing method comprises the manufacture of a gauge, a back electrode and a resistor body, encapsulating, trimming, splintering, sintering, end coating and electroplating; and the concrete steps comprise substrate cleaning, printing for the gauge and the back electrode, electrode sintering, stirring and defoaming for resistance paste and secondary glass paste, resistor body printing, resistor body sintering, primary glass printing, primary glass sintering, laser trimming, resistor body cleaning, secondary glass printing, primary splintering, end coating for the electrode, end electrode sintering, secondary splintering, nickel plating and tinlead plating. The products manufactured by the manufacturing method have the advantages of low resistance value, low TCR, high precision, high power, high reliability and the like, and completely meet the requirements of JANS products.
Description
Technical field: [0001] The invention relates to a method for manufacturing a resistor, in particular to a method for manufacturing a chip thick film resistor. Background technique: [0002] Basic electronic components such as resistors and capacitors are called "cells" of electronic equipment, and the accuracy and reliability of electronic equipment depend to a large extent on the quality of these basic electronic components. Chip thick film resistors, as a new type of small size and light weight components, have been widely used in the aerospace industry; with the advancement of technology, aerospace equipment has a high demand for the quality, accuracy, safety and reliability of chip resistors. The requirements for performance and other indicators are getting higher and higher, and the failure rate of components in some key parts must reach 10 -9 / h or more, that is, aerospace-grade components. However, the current chip thick film resistors manufactured by ordinary meth...
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