133results about How to "Short height" patented technology

The present invention relates to a multi-cyclone dust collector for a vacuum cleaner and dust collecting chamber. The multi-cyclone dust collector includes a first cyclone unit having a first cyclone body and a first dust collecting chamber, the first cyclone body taking dust-laden air entering through an under portion thereof and forming a first upwardly whirling air current so as to separate contaminants centrifugally from the dust-laden air, the first dust collecting chamber collecting contaminants discharged from the first cyclone body; and a second cyclone unit wrapping around at least a portion of the first dust collecting chamber, sucking semi-clean air discharged from the first cyclone unit through an under portion thereof, taking the sucked semi-clean air and forming a second upwardly whirling air current so as to separate contaminants centrifugally from the semi-clean air.

A spring loaded electrical contact assembly for making a connection between two surfaces that consist of two U-shaped components axially opposed and rotated 90 degrees with respect to each other and configured to allow them to pass over each other while contacting in a wiping manner. When compressed to a test position, the components completely envelop a spring and provide a minimal solid height at maximum compliance while providing a low and reliable electrical contact.

A distributor assembly for a multi-bed, downflow catalytic reactor is disclosed. The distributor assembly is configured for disposal and fixable attachment between the inner surfaces of the walls of a multi-bed downflow cylindrical reactor wall and for disposal between vertically stacked catalyst beds within the reactor. The assembly includes:(a) a collection plate configured for substantially horizontal disposal between the walls of a cylindrical reactor;(b) a plurality of generally arc-shaped elongated baffles disposed in a staggered, substantially symmetrical pattern about the collection plate;(c) a first mixing zone configured to be bounded on the bottom by the collection plate, on one side by a wall of a cylindrical reactor, and on the opposite side by the outer surface of the elongated baffles;(d) a cylindrical weir fixably attached to the collection plate about the outlet;(e) a second mixing zone bounded on the bottom by the collection plate, on one side by the outer surface of the cap and the first cylindrical weir, and on the opposite side by the inner surface of the elongated baffles;(f) a cap disposed over and about the first cylindrical weir, thereby forming a third mixing zone, plurality of semi-spiral-shaped baffles disposed in the third mixing zone, the semi-spiral-shape;(g) baffles having an elongated shape, having one lateral edge fixed to an inner surface of the cap or an opposite lateral edge fixed to an outer surface of the first cylindrical weir;(h) a substantially doughnut-shaped screen member disposed over a top portion of the cylindrical weir;(i) a plurality of fourth-mixing-zone baffles fixably attached to a top surface of the doughnut-shaped screen member; and(j) a plurality of quench gas ports disposed in the second mixing zone.

A memory module preferably includes a printed circuit board (PCB) panel having multiple memory chip pad groups arranged on both sides thereof. Each memory chip pad group preferably includes multiple pads that correspond to lead lines of multiple memory chips arranged on the PCB panel. Connectors are preferably formed along an edge of the PCB panel to electrically connect the memory chip pad groups to an external device. Multiple damping chip pad groups preferably include built-in damping chips. One or more of the damping chip pad groups are preferably arranged adjacent to a lateral edge of one or more of the memory chips. The damping chip pad groups can electrically connect the connectors to the memory chip pad groups and dampen the signal noises.

The present invention relates to an interlocking masonry wall block having two spaced lugs or projections and a cooperating recess or channel that enable like-shaped blocks to be stacked in a staggered relation to form straight and serpentine walls that are particularly suited for landscaping applications. In one embodiment, the lugs are located proximal the sides of the block and extend from an upper surface of the block. The channel is formed in a lower surface of the block. In another embodiment, the lugs are located at the rear corners of the block and extend below the lower surface of the block. The recess is formed in the rear end of the block between the lugs. Like-shaped blocks are stacked in a staggered relation so that each block is stacked atop two immediately lower blocks. In each embodiment, the lugs and their cooperating channel or recess define a setback dimension.

A system for communicating with a subcutaneous sensor includes a transceiver with a flat antenna. The flat antenna may include a cross section in which the height and the width are not equal. The coils of the antenna may be mounted on a substrate, which may be flexible. The flexible substrate may allow the antenna to conform to the contours of body parts, such as arms, wrists, ankles, legs, or waists.

Guidewire assembly methods and apparatus are described for incorporating one or more pressure sensors with one or more electrodes within or along the body of the guidewire. Guidewires may incorporate a number of different sensors within or along the body of the guidewire. To achieve the combination of the pressure sensor and one or more electrodes, various assembly methods and apparatus may be utilized as described in further detail herein.

An electrostatic spray dryer for drying liquid into powder including an elongated body defining a drying chamber, a spray nozzle assembly at one end of the drying chamber and a filter element housing and powder collection chamber at an opposite end. A non-structural non-metallic liner is disposed within the elongated body in spaced relation to an inner wall surface for defining an internal drying zone. The liner is releasably supported within the body for enabling selective removal and replacement following a particular usage. The illustrated elongated body has a modular construction comprising a plurality of modules, with at least one being selectively removable and replacement for altering the length of the drying chamber for a particular spray application. The liner also is replaceable with a liner of a length corresponding to the altered length of the drying chamber or with a different diameter for a particular usage.

The present invention relates to a load and moment sensor for a prosthetic device detecting load in a single direction and moment in a single plane. The load and moment sensor includes a sensing element, and a plurality of strain gauges placed in specific locations of the sensing element. The plurality of strain gauges is part of a plurality of resistor circuits such as Wheatstone bridges. While the strain gauges can be located on a single sensing element, some resistive elements of the Wheatstone bridges can be located elsewhere on the prosthetic device. The combination of the location of the strain gauges and the use of the Wheatstone bridges allows for good side load rejection which is load and moment not in the single direction or the single plane.

A safety barrier comprising is disclosed. The safety barrier comprises a plurality of posts spaced from each other and disposed adjacent to a roadway, each post having a cross section defined in part by a web and a pair of legs extending therefrom. Additionally, each post has one slot formed in the web of the post extending from an upper end of the post. A first cable and a second cable are releasably engaged with and supported by the posts and disposed within each slot between the respective legs of each post. A third cable and a fourth cable are each coupled to an exterior surface of the posts. The posts and the first, second, third and fourth cables cooperate to prevent a vehicle from leaving the roadway.

The invention relates to a moulding device for blowing thermoplastic recipients of various heights, said device comprising a mould provided with two mould halves and a mould bottom which are mutually mobile. Each mould half comprises a mould carrier, a chill carrier and a chill, said two chills and the mould bottom comprising mould impressions, which together define a moulding cavity. The inventive device also comprises means for compensating the blowing pressure, said means being provided between a mould carrier and the associated chill carrier. For recipients with the maximum height, the chill carriers and chills are the same height. For lower recipients, the chills are lower than the chill carriers and radially reinforcing means are provided on the internal faces of the carriers in the parts thereof which do not co-operate with the chills.

Taught herein is a lockable container 10 for detachably connecting and securing a unit dose pack 20. A foldable portion 12 connected to the lockable container allows a unit dose pack 20 or a blister card 72 to be temporarily or permanently attached to a flap 16 or other structure within the container. Similarly, a blister card 70 connected to a lockable container 10 allows a blister pack 20 to be temporarily or permanently mounted to the blister card 70. Also, taught is a method of mounting a blister pack to a blister card.

A semiconductor device includes. A first epi-layer and a second epi-layer are each located in a first region of the semiconductor device. A first dielectric fin is located between the first epi-layer and the second epi-layer. The first dielectric fin has a first dielectric constant. A third epi-layer and a fourth epi-layer are each located in a second region of the semiconductor device. A second dielectric fin is located between the third epi-layer and the fourth epi-layer. The second dielectric fin has a second dielectric constant that is less than the first dielectric constant.

A semiconductor process includes the following step. A metal gate strip and a cap layer are sequentially formed in a trench of a dielectric layer. The cap layer and the metal gate strip are cut off to form a plurality of caps on a plurality of metal gates, and a gap isolates adjacent caps and adjacent metal gates. An isolation material fills in the gap. The present invention also provides semiconductor structures formed by said semiconductor process. For example, the semiconductor structure includes a plurality of stacked structures in a trench of a dielectric layer, where each of the stacked structures includes a metal gate and a cap on the metal gate, where an isolation slot isolates and contacts adjacent stacked structures at end to end, and the isolation slot has same level as the stacked structures.