Semiconductor device manufacturing method, and adhesive film used in semiconductor device manufacturing method

A manufacturing method and adhesive film technology, which are applied in semiconductor/solid-state device manufacturing, film/sheet without carrier, semiconductor devices, etc., can solve problems such as inability to properly cut off the die-bonding sheet, inability to peel off the chip-bonding sheet, etc., and achieve suppression Adhesion to the chip surface and the effect of reducing the amount of debris

Active Publication Date: 2014-09-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the chips at the time of cutting the die-bonding sheet are fused with the die-bonding sheet, and the die-bonding sheet cannot be cut properly.
Especially when the chip is thin or the die-bonding sheet is thick, there is a high possibility that the die-bonding sheet cannot be properly cut.
Therefore, there is a problem that the die-bonding sheet cannot be peeled off from the dicing tape in the subsequent pick-up process.

Method used

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  • Semiconductor device manufacturing method, and adhesive film used in semiconductor device manufacturing method
  • Semiconductor device manufacturing method, and adhesive film used in semiconductor device manufacturing method
  • Semiconductor device manufacturing method, and adhesive film used in semiconductor device manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0155] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0156] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)

[0157] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 32 parts

[0158] (c) 34 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)

[0159] (d) 90 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)

[0160] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, an adhesive film A having a thickness of 25 μm in Example 1 was obtained.

Embodiment 2

[0162] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0163] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)

[0164] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 12 parts

[0165] (c) 13 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)

[0166] (d) 188 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)

[0167] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, the adhesive film B of Example 2 having a thickness of 25 μm was obtained.

Embodiment 3

[0169] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0170] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)

[0171] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 21 parts

[0172] (c) 22 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)

[0173] (d) 77 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)

[0174] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, an adhesive film C having a thickness of 25 μm in Example 3 was obtained.

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Abstract

The purpose of the present invention is to provide a semiconductor device manufacturing method, whereby cutting reliability of an adhesive film can be improved and debris contamination due to the adhesive film can be suppressed. Provided is a semiconductor device manufacturing method which is provided with: a step wherein, after forming a groove (4S) on the front surface of a semiconductor wafer (4), a protective adhesive film (44) is adhered, the rear surface of the semiconductor wafer is ground, and the groove is exposed from the rear surface; a step wherein, after adhering the adhesive film on the rear surface of the semiconductor wafer, the protective adhesive film is peeled; and a step wherein a laser beam having a wavelength of 355 nm is radiated along the groove exposed from the adhesive film, and the adhesive film is cut. The adhesive film has (a) a light absorption coefficient of 40 cm-1 or more at a wavelength of 355 nm, (b) a tensile storage elastic modulus of 0.5-20 MPa at 50 DEG C, and (c) a tensile storage elastic modulus of 0.3-7 MPa at 120 DEG C, or a melt viscosity of 2,000 Pa.s or more at 120 DEG C.

Description

technical field [0001] The present invention relates to a method of manufacturing a semiconductor device and an adhesive film used in the method of manufacturing the semiconductor device. Background technique [0002] Conventionally, silver paste has been used when adhering semiconductor chips to lead frames or electrode members in the manufacturing process of semiconductor devices. The adhesion process is performed by applying a paste-like adhesive on a die pad of a lead frame, etc., mounting a semiconductor chip thereon, and curing the paste-like adhesive layer. [0003] However, the slurry adhesive has large variations in coating amount, coating shape, etc. due to its viscosity behavior, deterioration, and the like. As a result, the thickness of the formed paste-like adhesive is not uniform, and thus the reliability of the adhesion strength of the semiconductor chip is poor. That is, when the coating amount of the paste-like adhesive is insufficient, the adhesive streng...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301C09J7/00C09J11/04C09J133/04C09J161/06C09J163/00H01L21/52C09J7/10
CPCC08G59/621H01L21/78C09J133/04H01L2221/68386H01L2224/73265C09J2433/00C09J2203/326C09J161/06H01L2224/45144H01L2221/68327H01L2924/01015C09J2463/00H01L2224/83191H01L21/52H01L2224/48091C09J163/00C09J2461/00H01L2924/01047H01L2224/45124H01L21/6836C09J7/00H01L24/27H01L2221/6834H01L2221/68377H01L2224/45147H01L2924/00014H01L2924/00C08L33/04C08L61/06H01L2924/15747H01L2924/15788H01L2924/181H01L24/45C09J7/10H01L2924/00012
Inventor 田中俊平宍户雄一郎大西谦司浅井文辉
Owner NITTO DENKO CORP
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