An insulating substrate (10) in which a plurality of via holes (11, 12) that penetrate said substrate in the thickness direction thereof are filled with a conductive paste (41, 51) is prepared. Said conductive paste (41, 51) is obtained by adding an organic solvent to an alloy powder in which a plurality of metal atoms maintain a prescribed crystal structure. Then, while the insulating substrate (10) is being heated, pressure is applied from the top surface (10a) and the bottom surface (10b) thereof. The conductive paste (41, 51) is thus subjected to solid-state sintering, forming interlayer connection members (40, 50). Next, a top-surface protection member (20) is placed on the top surface (10a) of the insulating substrate (10) and a bottom-surface protection member (30) is placed on the bottom surface (10b) of the insulating substrate (10), forming a laminate (80). Said laminate (80) is then fused into a single unit by the application of simultaneous heat and pressure, albeit at a lower temperature and with less pressure than were used in the step that formed the interlayer connection members (40, 50).