Peeling device and peeling method of substrate, and manufacturing method of electronic device

A technology for peeling off devices and substrates, applied in semiconductor/solid-state device manufacturing, chemical instruments and methods, electrical components, etc., capable of solving problems such as damage to the reinforcing plate 104

Active Publication Date: 2014-08-06
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, there is a problem that if the part of the reinforcing plate 104 (substrate 102 ) that has been greatly deflected and deformed is detached from the flexible plate 118 , the vacuum suction of the flexible plate 118 to the reinforcing plate 104 (substrate 102 ) will be limited. release, so the reinforcing plate 104 (substrate 102) falls off from the flexible plate 118 and is damaged

Method used

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  • Peeling device and peeling method of substrate, and manufacturing method of electronic device
  • Peeling device and peeling method of substrate, and manufacturing method of electronic device
  • Peeling device and peeling method of substrate, and manufacturing method of electronic device

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Embodiment Construction

[0053] Hereinafter, embodiments of a substrate peeling device, a peeling method, and an electronic device manufacturing method according to the present invention will be described with reference to the drawings.

[0054] figure 1 It is an enlarged side view of main parts of the laminated board 1 used in the manufacturing process of an electronic device.

[0055] (Manufacturing method of electronic device)

[0056] In order to cope with the thinning of the substrate 2 used in electronic devices, the manufacturing method of the electronic device according to the embodiment has the following steps: constructing the laminated board 1 in which the front surface of the reinforcing plate 3 is pasted on the back surface of the substrate 2, and forming a laminated board 1 on the laminated board 1 A functional layer forming step of forming a functional layer on the surface of the substrate 2; and a peeling step of peeling off the interface between the substrate 2 formed with the funct...

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Abstract

The invention relates to a peeling device and peeling method of a substrate, and a manufacturing method of an electronic device. The peeling device of the substrate enables at least one of the substrate and a reinforcing plate for reinforcing the substrate to form flexural deflection and peels successively from an interface between the substrate and the reinforcing plate along a forward direction from one end side to the other end side. The peeling device of the substrate comprises a peeling component. The peeling component is provided with a flexible plate for absorbing and keeping the substrate or the reinforcing plate, and a drive component which applies a force to the flexible plate in a direction in parallel to the interface to make one of the substrate and the reinforcing plate form flexural deflection together with the flexible plate.

Description

technical field [0001] The present invention relates to a substrate peeling device and a peeling method for peeling an interface between a substrate and a reinforcing plate, and a manufacturing method of an electronic device. Background technique [0002] In recent years, along with the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin-film secondary batteries, there has been a demand for thinner substrates used in electronic devices. However, when the strength of the substrate decreases due to thinning, the handling of the substrate deteriorates, so functional layers for electronic devices such as thin film transistors (TFT: Thin Film Transistor) and color filters (CF: color filter) are formed on The surface of the substrate becomes difficult. [0003] Therefore, a method has been proposed in which a laminate (in a broad sense, a laminate) is formed by detachably pasting the surface of a reinforcing plate on the back surf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCB32B38/10H01L21/67092H01L21/6838
Inventor 伊藤泰则宇津木洋泷内圭
Owner ASAHI GLASS CO LTD
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