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Electronic device

A technology for electronic devices and electronic components, applied in electrical components, instruments, circuits, etc., can solve the problem that the content of particles with small particle size is not considered, the bonding strength and bonding reliability of the glass substrate and the sealing layer are easily reduced, and the sealing Problems such as reduced material flow

Inactive Publication Date: 2013-02-27
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in Patent Document 5, the content of particles with smaller particle diameters is not considered.
When the low-expansion filler contains a large number of particles with a small particle size, the fluidity of the sealing material during melting is reduced, so cracks or cracks are likely to occur in the sealing layer and the glass substrate, or the bonding strength and adhesion between the glass substrate and the sealing layer are reduced. Easy to reduce reliability

Method used

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preparation example Construction

[0066] As the carrier used in the preparation of the sealing material paste, methyl cellulose, ethyl cellulose, carboxymethyl cellulose, ethoxy cellulose, benzyl cellulose, propyl cellulose, nitrocellulose Base cellulose and other resins dissolved in solvents such as terpineol, butyl carbitol acetate, ethyl carbitol acetate and other solvents, or methyl (meth)acrylate, (meth)acrylic acid Acrylic resins such as ethyl ester, butyl (meth)acrylate, and 2-hydroxyethyl methacrylate are dissolved in methyl ethyl ketone, terpineol, butyl carbitol acetate, ethyl carbitol A carrier obtained from a solvent such as acetate.

[0067] The viscosity of the sealing material paste can be adjusted by the ratio of the resin (binder component) to the solvent or the ratio of the sealing material to the carrier, as long as it is suitable for the apparatus for applying it to the glass substrate 3 . Additives known in the glass paste field, such as a solvent for dilution, an antifoaming agent, or a ...

Embodiment 1

[0077] The following materials are prepared: having Bi 2 o 3 83%, B 2 o 3 5%, ZnO 11%, Al 2 o 3 Bismuth-based glass frit with a composition of 1% (softening point: 410°C, thermal expansion coefficient: 106×10 -7 / °C); as a low-expansion filling material, the average particle size (D50) is 4.3 μm and the specific surface area is 1.6m 2 / g of cordierite powder; a compound comprising Fe, Mn, and Cu (specifically, having an oxide-converted mass ratio of Fe 2 o 3 16.0%, MnO 43.0%, CuO 27.3%, Al 2 o 3 8.5%, SiO 2 5.2% composition), with an average particle size (D50) of 1.2 μm and a specific surface area of ​​6.1 m 2 / g of laser absorbing material.

[0078] The particle size distribution of the cordierite powder was measured with a particle size analyzer (manufactured by Nikkiso Co., Ltd. (Nikkiso Co., Ltd., MICROTRAC HRA). The measurement conditions are set as: measurement mode: HRA-FRA mode; particle transparency: yes; spherical particle: no; particle refractive ...

Embodiment 2

[0090] In addition to being used as a low-expansion filler material with an average particle size (D50) of 2.6 μm and a specific surface area of ​​4.5 m 2 Formation of the sealing material layer and sealing of the first glass substrate and the second glass substrate by laser were carried out in the same manner as in Example 1 except for the cordierite powder per g. The temperature of the sealing material layer during laser irradiation was 620° C. as in Example 1. As a result of observing the state of the electronic device having the glass panel produced in this way, no cracks or cracks were observed in the glass substrate and sealing layer, and it was confirmed that the sealing was good. In addition, cross-sectional observation and image analysis of the sealing layer were carried out in the same manner as in Example 1, and the fluidity hindrance value was 1.26 μm -1 , the thermal expansion value is 74×10 -7 / °C.

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Abstract

Disclosed is an electronic device capable of suppressing the occurring of cracks or breaks in glass substrates or a sealing layer when laser-sealing two glass substrates together. An electronic device (1) is provided with a first glass substrate (2), a second glass substrate (3), and a sealing layer (6) formed between these. The sealing layer (6) comprises a molten anchoring layer of a sealing material containing a sealing glass, a low expansion filler material and a laser absorption material. From a cross section view of the sealing layer (6), the sum of the perimeter lengths of the low-expansion filler material and the laser absorption material per unit surface area (the liquid inhibition value) is 0.7-1.3[mu]m-1, and the sum of the sealing glass heat expansion coefficient multiplied by the sealing glass surface area ratio and of the low-expansion filler material heat expansion coefficient multiplied by the sum of the surface area ratios of the low-expansion filler material and the laser absorption material (the heat expansion value), is 50-90x10-7 / C.

Description

technical field [0001] The present invention relates to an electronic device having an electronic element portion between two glass substrates whose peripheral portions are sealed. Background technique [0002] Organic EL display (Organic Electro-Luminescence Display: OELD), Field Emission Display (Field Emission Display: FED), Plasma Display (PDP), Liquid Crystal Display (LCD) and other flat-panel display devices (FPD) ) adopts a structure in which an element glass substrate on which a display element and the like are formed and a sealing glass substrate are arranged facing each other, and the display element is sealed with a glass package obtained by sealing the two glass substrates (see Patent Document 1). For solar cells such as dye-sensitized solar cells, studies have also been made on glass encapsulation in which solar cell elements (photoelectric conversion elements) are sealed with two glass substrates (see Patent Documents 2 to 4). . [0003] As a sealing material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C27/06C03C8/24G02F1/1339H05B33/04
CPCC03C8/24G02F1/1339H01J2329/867C03C8/04H01J2329/8675H01J9/261H01J11/48G02F1/1303C03C27/06H01J2211/48Y10T428/239
Inventor 山田和夫小野元司渡边满竹内俊弘竹田谕司
Owner ASAHI GLASS CO LTD
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