Resin hole-plugging method for large-aperture back-drilled hole

A technology of resin plugging and back-drilling, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of hole depression, incompleteness, and voids, and achieve the effect of avoiding holes in holes

Active Publication Date: 2020-02-21
珠海崇达电路技术有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the above-mentioned existing technical defects, the present invention provides a large-diameter back-drilled resin plugging method, which solves the quality problems such as the conventional

Method used

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Examples

Experimental program
Comparison scheme
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Example Embodiment

[0028] Example

[0029] The method for manufacturing a circuit board shown in this embodiment can produce a high-quality large-diameter resin plug hole, which sequentially includes the following processing steps:

[0030] (1) Cutting: the core board and auxiliary light board are cut out according to the panel size of 520mm×620mm, the thickness of the core board is 0.35mm (excluding the outer copper thickness), and the thickness of the copper layer on both surfaces of the core board is 1OZ.

[0031] (2) Inner layer circuit production (negative film process): inner layer pattern transfer, the photosensitive film is coated with a vertical coater, and the thickness of the photosensitive film is controlled to 8μm, using a fully automatic exposure machine, with a 5-6 grid exposure ruler (21 Lattice exposure ruler) complete the inner layer circuit exposure; inner layer etching, the core board after exposure and development is etched out of the inner layer circuit, the inner layer line width...

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PUM

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Abstract

The invention discloses a resin hole-plugging method for a large-aperture back-drilled hole, and the method comprises the following steps: drilling a through hole on a production plate, wherein one surface of the production plate is a back-drilled surface, and the other surface is a non-back-drilled surface; metalizing the through hole through copper deposition and full-board electroplating in sequence; performing back drilling at the position, corresponding to the metallized through hole, in the back-drilled surface through a depth-controlled drilling method, and forming a stepped back-drilled hole, wherein the hole diameter of the back-drilled part is larger than that of the through hole; filling resin in the back-drilled hole in a vertical vacuum hole-plugging manner and performing curing; filling resin into the back-drilled hole for the second time in a horizontal vacuum hole-plugging manner and curing; and removing the resin protruding out of the plate surface through an abrasivebelt grinding plate. According to the method, the quality problems that a conventional resin hole-plugging process cannot be used for manufacturing or hole plugging cavities, holes are not full, and hole openings are sunken are solved, full resin hole plugging is ensured, and hole opening sunken parts are less than 30 microns.

Description

Technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a resin plugging method for back drilling with a large aperture. Background technique [0002] PCB back-drilling is a through hole that is electroplated and conducted, and a part of the hole copper is removed using the controlled depth drilling method, and only a part of the hole copper is retained. The key role of the back-drilling is in the high-speed signal transmission process. Reduce the reflection and interference of excess copper on the signal to ensure the integrity of signal transmission. At present, back drilling is a low-cost manufacturing method that can meet the performance of high-frequency and high-speed circuit boards. [0003] In recent years, the density of printed boards has continued to increase. The originally shrinking aperture, line width, and line spacing of the plane density tend to be a bottleneck, and increasing the three-dimension...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2203/085H05K2203/1476
Inventor 寻瑞平张华勇戴勇杨勇
Owner 珠海崇达电路技术有限公司
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