194 results about "Copper deposition" patented technology

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The invention discloses an electroplating method of a circuit board positive piece process based on vertical copper deposition, which comprises the following steps: cutting and baking a board at the temperature of 165 + / -5 DEG C for 3-5 hours; drilling and polish-brushing are conducted, and the polish-brushing linear speed is 4.0 m / min; the backlight grade of the circuit board after copper deposition is greater than or equal to 9 grade; performing line pretreatment, wherein the line speed is 4.5 m / min; pressing a film; exposure is conducted, the exposure energy is 3400-3600 MJ, the exposure time is 3-4 s, and standing is conducted for 30 min or above after exposure; developing, wherein the temperature of developing tank liquid is 28-32 DEG C, and the production line speed is 5-5.5 m / min; pattern electroplating is conducted, the current density is 13 ASF, the electroplating time is 40-50 min, hole copper is larger than or equal to 20 microns, and surface copper is larger than or equal to 33 microns; etching is carried out, the film stripping line speed is 4.7 m / min, and the etching line speed is 8.0 m / min; and AOI. According to the electroplating method of the circuit board positive film process based on the vertical copper deposition, the vertical copper deposition process is adopted, and the production efficiency and the product yield are improved.

The invention relates to the technical field of cleaning machines, in particular to a PCB after-copper-deposition cleaning machine which comprises a pickling machine, a clear water flushing machine is arranged on the left side of the pickling machine, a cold air drying machine is arranged on the left side of the clear water flushing machine, a hot air drying machine is arranged on the left side of the cold air drying machine, and a turnover box is arranged on the left side of the hot air drying machine. A conveying mechanism used for conveying PCBs is jointly arranged in the pickling machine, the clean water flushing machine, the cold air drying machine and the hot air drying machine, and the PCBs are conveyed and cleaned from right to left. Through cooperative use of the driving assembly, the reciprocating assembly and the rotating assembly, rotation of the rotating nozzles is synchronously achieved while the rotating nozzles are driven to do linear reciprocating motion; by means of the technical scheme, reciprocating linear spraying and rotary spraying are achieved, the washing coverage area is increased, compared with fixed spray head washing, dynamic washing reduces cleaning blind areas, shearing force to stains is increased through a complex water flow mode generated by rotation and reciprocating actions, pollutants can be stripped and taken away easily, and the cleaning effect is good.

The invention relates to a method for realizing in-hole signal isolation based on chemical copper deposition resisting ink and a selective chemical copper deposition process, which comprises the following steps of: coating the chemical copper deposition resisting ink at preset hole opening positions on two sides of a PCB (Printed Circuit Board) core board to form chemical copper deposition resisting ink film layers; a palladium poisoning agent and a surface active agent for inhibiting palladium adsorption are added into the chemical copper deposition resisting ink; laminating the PCB core board to be separated with other boards to form a pretreated board; performing trepanning treatment on a preset trepanning position of the pretreatment plate to form a via hole; and performing chemical copper deposition treatment on the pre-treated board to form a copper layer on the side wall of the via hole of the pre-treated board, and removing the chemical copper deposition resistant ink film layer from the pre-treated board to form the PCB. Therefore, due to the fact that the palladium poisoning agent and the surface active agent for inhibiting palladium adsorption are added into the anti-electroless copper deposition printing ink, the formed anti-electroless copper deposition printing ink film layer is resistant to attack of chemical copper series liquid medicine, the problem of copper coating on a separation layer can be effectively reduced or eliminated, and in-hole signal separation can be effectively achieved.

The invention discloses a high-precision substrate laser processing method, and belongs to the technical field of packaging substrate production. A high-precision substrate laser processing method comprises the steps that a plurality of circular positioning targets are arranged on a substrate with a conductive pattern on the surface layer; laminating a layer-adding dielectric electric film and a protective film on the surface of the substrate in sequence; the actual coordinates of the multiple positioning targets are grabbed through measuring equipment, and the expansion and shrinkage value of the base plate is calculated according to the actual coordinates and the theoretical coordinates of the positioning targets; correcting the theoretical coordinates of the blind holes in the surface layer of the substrate according to the expansion and shrinkage value of the substrate, and performing laser processing according to the corrected coordinates of the blind holes in the surface layer of the substrate; capturing an image of each positioning target through a measuring device to obtain a processing error; whether the machining precision error is smaller than a set precision value or not is judged; if yes, removing the protective film on the surface of the substrate, and performing copper deposition and porefilling electroplating on the surface of the layer-adding dielectric electric film; and if not, giving an alarm. And the problem of batch scrapping caused by the fact that substrates with overlarge layer deviation flow into the subsequent processing process can be avoided.

The invention provides a method for manufacturing copper columns on a packaging substrate and the packaging substrate, and the method comprises the steps: sequentially covering a copper deposition layer and a graphical dry film on the surface of the packaging substrate, and vertically and continuously electroplating n first copper column groups of which the heights form an arithmetic progression on the graphic surfaces of the inner layer and the outer layer of a groove between the dry films; and the packaging carrier plate is rotated by 180 degrees, second copper column sets arranged in the height arithmetic progression are vertically and continuously electroplated on the first copper column sets correspondingly, the corresponding copper columns of the second copper column sets and the first copper column sets form target copper columns, and the heights of the target copper columns are the same. According to the invention, the first copper column group with equal height is arranged on the surface of the packaging carrier plate, and the second copper column group with equal height is arranged after up-down rotation, so that the single vertical continuous electroplating process does not exceed the single maximum copper plating amount, and the target copper column height is increased; meanwhile, increasing the height of the target copper column is beneficial to expanding the application range of the double-sided packaging process; in addition, redundant copper columns are arranged in the large plate before cutting, the residual copper rate of the whole plate is increased, the risk of plate burning and leakage is reduced, and the uniformity of the target copper columns is improved.

The invention discloses a circuit board line deposition method and a circuit board line, and belongs to the technical field of circuit board manufacturing, and the method comprises the steps: carrying out the pretreatment of a substrate, the surface of which does not contain a copper foil, and forming a through hole in the substrate; forming graphical printing ink on the surface of the pre-treated substrate; putting the patterned substrate into a chemical copper deposition tank containing a copper salt and a reducing agent, and enabling copper ions to be reduced and separated out to be attached to the hole walls of the through holes and the surface of the substrate which is not covered by the ink under the catalytic action, so as to obtain a copper layer with a target thickness and complete the manufacturing of a circuit layer; the thickness of the ink is greater than or equal to that of the copper layer. The thick copper is directly deposited on the surface of the substrate without the copper foil by combining the circuit deposition process and the thick copper deposition process aiming at the substrate without the copper foil on the surface, so that the cost can be continuously reduced, and the manufacturing cost is greatly reduced through new process development on the premise of meeting the product quality.

The application belongs to the technical field of circuit board preparation, in particular to a PCB circuit board production line, which comprises a cutting machine for cutting and opening fixed holes of an insulating substrate, a copper deposition tank for depositing a conductive layer on the surface of the substrate, a film laminating machine for laminating a film on the substrate and using a solution to produce a circuit pattern on the substrate, an electroplating device for tinning the copper foil of the substrate to prevent damage during etching, a tin stripping machine for cleaning and removing the protective tin on the surface of the substrate, a screen printing device for screen printing text on the PCB, and a rack for loading and transferring the PCB circuit board during processing. The rack can maintain better balance during transfer and will not have the problem of "head heavy and foot light". In addition, the distance between the moving plate and the moving plate and the distance between the moving plate and the fixed plate can be adjusted by the bidirectional screw rod, so that PCB circuit boards of various thicknesses can be loaded and transferred, improving the applicability of the device.

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

This invention provides a method for recovering copper from waste circuit boards, belonging to the field of waste circuit board recycling technology. The method for recovering copper from waste circuit boards according to this invention includes the following steps: (1) Crushing and sorting: mechanically crushing and sorting the waste circuit boards to obtain copper-enriched metal particles; (2) Pre-leaching: mixing the metal particles with a dilute sulfuric acid solution to perform a pre-leaching reaction, obtaining pre-leaching residue and pre-leaching solution; (3) Electrolytic deposition: using the pre-leaching solution as an electrolyte for electrolytic deposition to obtain high-purity copper deposits; (4) Post-treatment: washing and drying the copper deposits to obtain recovered copper. The entire recycling process of the technical solution described in this invention does not generate harmful gases or wastewater, resulting in minimal environmental pollution. Furthermore, this invention allows for copper leaching and electrodeposition within the same device, shortening the process flow and reducing energy consumption.

The invention discloses fading-washing-free plating-resistant ink for a chemical copper deposition process as well as a preparation method and application of the fading-washing-free plating-resistant ink. The washing-free anti-plating ink comprises the following components in parts by weight: (A) 40-80 parts of photocurable acrylate resin; (B) 0.1-5 parts of a nitrogen-containing plating-resistant functional monomer; (C) 10-40 parts of an inorganic filler; (D) 0.5 to 1.5 parts of a reactive leveling agent; (E) 0.5 to 1.5 parts of a non-reactive leveling agent; (F) 5-25 parts of a reactive diluent monomer; (G) 0.5-6 parts of a photoinitiator; and (H) 5-15 parts of an organic solvent. The washing-free plating-resistant ink is subjected to screen printing or jet printing to form a film, and a cured film layer does not form copper deposition in a chemical copper deposition solution, and can enter a subsequent electroplating process without washing or stripping treatment after copper deposition.

The embodiment of the invention relates to the technical field of PCB manufacturing, in particular to an AI server PCB manufacturing method and device, and the method comprises the steps: carrying out the copper reduction of a first copper reduction region of a multi-layer PCB and the grinding of a dry film hole sealing region of the multi-layer PCB before the copper deposition plate electric treatment of the multi-layer PCB, thereby eliminating the defects of a plating layer interface, guaranteeing the uniformity of the plate thickness, and improving the production efficiency. The defects of a plating layer interface are reduced, the etching flatness and the binding force are improved, and the electrical performance and the long-term reliability of a product are ensured.

The invention discloses a treatment process for high-copper sulfur concentrate waste sulfuric acid treatment, and relates to the technical field of waste sulfuric acid treatment, the treatment process comprises the following steps: S1, waste sulfuric acid pretreatment; s2, copper deposition reaction; s3, cobalt and nickel precipitation reaction; and S4, carrying out double-way optimization treatment. Through the integral treatment process, the high-quality gypsum can be obtained, heavy metals such as copper, cobalt and nickel are prevented from being mixed into the gypsum in the conventional treatment process, and a foundation for effectively utilizing the gypsum is laid. And heavy metals in the waste sulfuric acid are effectively converted into mineral products, so that the heavy metals such as copper, cobalt and nickel in the waste sulfuric acid are comprehensively utilized, and the solid waste generation amount of waste sulfuric acid treatment is reduced.

The utility model discloses circuit board copper deposition device with good copper deposition effect relates to circuit board copper deposition technical field, including circuit board fixed component, set up in the side of L type board, be used for the insertion fixed of circuit board, and circuit board fixed component includes the fixed frame of setting up in one side of L type board, and the fixed frame is fixedly installed with the partition strip, and the fixed frame is provided with anti -drop mechanism, drive mechanism sets up on L type board and circuit board fixed component, and drive mechanism includes the pivot that rotates and installs in L type board, and the fixed frame is fixedly installed on the pivot, and the end of pivot is fixedly installed with worm wheel, and the worm wheel is meshed with the installation of worm, in the utility model, through the setting of circuit board fixed component, drive mechanism, can fix circuit board in the fixed frame when copper deposition, and the fixed frame agitates the solution in copper deposition pool, makes the solution concentration distribution even in copper deposition pool, and drives circuit board activity, and then can make the copper surface distribution even after circuit board copper deposition, and the copper deposition effect is better.

The application discloses a method for realizing TGV high-conductivity copper-clad by using a magnetic filtering vacuum arc metal film, and specifically comprises the following steps: S1, ultrasonic cleaning is performed on a glass through-hole substrate; S2, sub-etching cleaning treatment and activation of a substrate surface are performed on the glass through-hole substrate under a vacuum environment; S3, a Ti film layer is deposited on the glass through-hole substrate after the treatment in S2 by using a magnetic filtering vacuum cathode arc method; and S4, a Cu film layer is deposited on the Ti film layer under a low vacuum environment. By using the method provided by the application, a Ti undercoat layer is first deposited, the problem of poor adhesion between Cu and a glass substrate is solved, then copper-clad deposition is performed, in addition, the glass substrate can be conductive after Ti plating, so that the bias voltage can be increased, the energy of Cu ions entering the hole is larger, the thickness of the film plated on the hole wall is improved, the adhesion is stronger, and the conductivity is improved.

The invention discloses a preparation method of high-strength and high-toughness graphene-doped composite copper foil, which comprises the following steps: S1, treating graphene by adopting a high-energy ball milling method to obtain nano-sized defective graphene; s2, preparing a composite electrolyte containing the defective graphene, and adding the composite electrolyte into an industrial electrolytic cell after ultrasonic dispersion; s3, adding a compound additive into the electrolytic bath, and uniformly mixing through air blowing and ultrasound; s4, direct current is introduced, so that graphene and copper ions are co-deposited on the surface of the cathode roller to prepare a composite copper foil; and S5, carrying out acid pickling, water washing, drying, stripping and rolling on the composite copper foil. According to the invention, through doping of nano-scale defective graphene, on one hand, active sites are provided for copper deposition so as to refine grains, increase grain boundaries and hinder dislocation motion; on the other hand, due to the fact that the size of the defective graphene is matched with the height of copper grains, the strength can be improved through dislocation pinning and back stress strengthening, meanwhile, a multi-slip system is activated, dislocation storage is promoted to improve plasticity, the balance dilemma of the strength and the ductility of the copper foil is broken through finally, the copper foil has the high-strength and high-toughness characteristics, and the design requirement for the high energy density of the lithium ion battery is met.

The invention relates to the technical field of printed circuit boards, and discloses a process method for optimizing a copper lattice to improve the binding force of a plating layer, which comprises the following steps of: glue residue removal treatment: carrying out glue residue removal treatment on a drilled printed circuit board to form a roughened structure on the surface of a hole wall; activating treatment: adsorbing palladium catalytic particles on the coarsened pore wall surface to form a uniformly distributed catalytic center; and chemical copper deposition: immersing the activated plate in a chemical copper solution, controlling the reaction temperature to be 41-45 DEG C, maintaining the concentration of copper ions, alkali and a reducing agent through automatic compensation and liquid mixing, and depositing on the hole wall to form an initial copper layer. The technological method for optimizing the copper lattice to improve the coating binding force aims at solving the problems that in high-density interconnection and high-speed and high-frequency printed circuit board manufacturing, due to the fact that a traditional chemical copper plating technology lacks dynamic regulation and control capacity, the coating binding force is insufficient, the lattice structure is loose, and uniformity is poor.

The invention discloses a method for improving copper-free holes of a circuit board, which comprises the following steps: when the hole diameter of a finished hole is 0.2-0.5 mm, the diameter of a drill bit is 0.15-0.45 mm, the rotating speed of the drill bit is 80000-120000 rpm, the feeding speed is 0.3-1.0 m / min, and the retracting speed is greater than or equal to 5 m / min; when the hole diameter of the finished hole is 0.5-1.5 mm, the diameter of a drill bit is 0.45-1.4 mm, the rotating speed of the drill bit is 20000-50000 rpm, the feeding speed is 1-3 m / min, and the retracting speed is larger than or equal to 5 m / min; copper deposition pretreatment: degumming, coarsening, cleaning, activating and washing the base material; copper deposition: copper deposition liquid medicine comprises the following components: 5-10 g / L of copper sulfate, 2-5 g / L of a reducing agent, 20-40 g / L of a complexing agent and 0.1-0.5 g / L of a stabilizer, the pH value of the copper deposition liquid medicine is 9-9.5, the temperature is 30-35 DEG C, and the reducing agent is formaldehyde; in the initial stage, the current density is 1-2 A / dm < 2 >, and the electroplating time is 5-10 min; and in the subsequent stage, the current density is 2-3 A / dm < 2 >, and the electroplating liquid is uniformly stirred by adopting mechanical stirring in the electroplating process. According to the method for improving the copper-free condition of the circuit board hole, the drilling technology, the copper deposition pretreatment technology, the copper deposition liquid medicine and the electroplating technology are optimized, the phenomenon that copper does not exist in the hole is avoided, and the conductivity of a product is improved.

The application discloses a high-heat-dissipation double-sided aluminum substrate and a manufacturing method thereof, an electronic device and a storage medium, and relates to the technical field of packaging substrates. The method comprises the following steps: obtaining an aluminum substrate through cutting; performing first drilling on the aluminum substrate to obtain a first through hole; filling the first through hole with a first resin; arranging an isolation pad plate around the aluminum substrate to form a to-be-pressed substrate; pressing a semi-cured sheet and a copper foil on two sides of the to-be-pressed substrate through a pressing mechanism to form a packaging substrate; performing second drilling on the packaging substrate to form a second through hole penetrating through the first resin; performing first electroplating copper deposition on the packaging substrate to form a through hole in the second through hole; filling the through hole with a second resin and performing second electroplating copper deposition on the packaging substrate; manufacturing a circuit on the surface of the copper foil; and cutting off the isolation area and the isolation pad plate through a CNC device. According to the method, the heat dissipation capacity can be improved, and the demand of high-power and high-current electronic products can be met.

The invention relates to a full addition process printed circuit board circuit manufacturing method based on chemical copper deposition resistant ink and a chemical thick copper process. The method comprises the following steps: providing a copper-free substrate; forming an anti-electroless copper deposition ink film layer on the substrate by adopting anti-electroless copper deposition ink; exposing the circuit pattern on the anti-electroless copper plating ink film layer of the substrate; developing and dissolving an unexposed area of the anti-chemical copper deposition ink film layer on the substrate to form a copper deposition blocking pattern complementary with the circuit; and performing copper deposition processing on an exposed area outside the copper deposition blocking pattern on the substrate to form a circuit line. Thus, the problem that the copper thickness is not increased any more due to sudden reduction of the deposition rate in the deposition process can be solved, the copper deposition thickness can break through the traditional copper deposition upper limit, the copper deposition thickness can reach 20-25 micrometers, copper deposition can be directly conducted on a copper-free substrate, the situation that a copper-clad substrate needs to be used traditionally is avoided, and the cost is reduced. And the cost of raw materials is greatly reduced, so that the method is a low-cost printed circuit board solution.

Interconnect structures in a microelectronic device and methods of forming the same are described. The method comprises processing a substrate comprising a dielectric layer disposed thereon, the dielectric layer having one or more features including an opening, a sidewall, a top surface, a bottom. The method includes forming a cobalt liner layer having a thickness in a range of from 5 Ångstroms to 20 Ångstroms on the sidewall, the top surface, and the bottom using a physical vapor deposition process. The method includes doping an external portion of the cobalt liner layer with carbon, the external portion of the cobalt liner layer having a thickness in a range of from 1 Ångstrom to 5 Ångstroms to form a lined feature. Copper is deposited into the lined feature.

The invention discloses excellent chemical copper deposition equipment which comprises a tank body, a reaction tank located in the tank body and used for copper deposition reaction and an automatic adding device for automatically adding chemicals, and jet flow mechanisms used for spraying the chemicals are arranged at the upper end and the lower end in the tank body. A mounting device used for swinging and clamping products is arranged between the jet flow mechanisms in the reaction tank, the output end of the automatic adding device is connected with an auxiliary tank, and the auxiliary tank is connected with the jet flow mechanisms by arranging a jet flow system; the device is simple in structure and reasonable in design, the micro-nano bubble technology is adopted, micro-nano bubbles are micro bubbles with the diameter ranging from hundreds of nanometers to ten micrometers, and the micro-nano bubbles have the advantages of being high in gas-liquid mass transfer efficiency and solubility, cannot be clamped in holes compared with the holes with the diameter larger than one hundred micrometers, and are not prone to falling off. Oxygen can be provided, the problem that bubbles are blocked cannot occur, and meanwhile the hole penetrating capacity problem of a high-aspect-ratio product is solved through an efficient jet flow system.

The present application relates to lithium battery copper foil additive detection technical field, disclose a kind of lithium battery copper foil additive on copper deposition effect analysis method and its application.The analysis method includes: multiple times adding pre-configured test liquid to pre-configured simulation liquid, scans corresponding first volt-ampere characteristic curve after each addition The test liquid, according to multiple first volt-ampere characteristic curve determination the type of test liquid;According to the type determination result, select corresponding electrochemical method to measure the effect concentration of test liquid;Output the type of test liquid and corresponding effect concentration;Through multiple ladder sample addition+multiple volt-ampere characteristic curve combination, utilize the difference of electrochemical behavior of different additives to carry out type screening, based on the type determined again call the matching electrochemical model to carry out concentration inversion, can realize efficient, accurate qualitative screening and quantitative analysis, solve the problem of traditional method in qualitative inaccuracy, quantitative difficulty and low efficiency.

The present application relates to the technical field of hydrometallurgy, and discloses a method for preparing hydroxide from reverse copper-manganese solution, which comprises the following steps: controlling the potential of the reverse copper-manganese solution to carry out sulfidation copper deposition, so as to obtain a copper deposition solution; adjusting the pH of the copper deposition solution to 4-6, mixing the copper deposition solution with manganese powder to carry out manganese-zinc replacement, and obtaining zinc-manganese slag and a zinc deposition solution after sufficient reaction; mixing the zinc-manganese slag with sufficient zinc-dissolving alkali solution to carry out reaction, and obtaining manganese slag and the zinc-dissolving solution after solid-liquid separation; adjusting the pH of the zinc-dissolving solution to 7-8, and carrying out solid-liquid separation after sufficient reaction, so as to obtain zinc hydroxide. The method has a short overall process, good separation and purification effect, and can obtain crude manganese hydroxide and zinc hydroxide products.

The invention discloses a four-layer circuit thermoelectric separation copper substrate manufacturing process. The manufacturing process comprises the following steps: S1, windowing on a copper foil layer and an insulating layer; s2, sequentially laminating a copper foil layer, an insulating layer and a copper foil layer to form a first to-be-pressed plate; s3, performing hot pressing on the first to-be-pressed plate; s4, etching circuits on the copper foil layers on the two sides of the first substrate; s5, the copper foil layer, the insulating layer and the first substrate are sequentially arranged in a stacked mode, and the step S3 is repeated to form a second substrate; s6, etching a circuit on the copper foil layer, far away from the first substrate, of the second substrate; s7, a copper foil layer, an insulating layer and a second substrate are sequentially arranged in a stacked mode, and the step S3 is repeated to form a panel; s8, etching a circuit on the copper foil layer, far away from the second substrate, of the panel; s9, drilling holes in the panel, and carrying out copper deposition and electroplating; and S10, sequentially stacking the panel, the insulating layer and the copper bottom plate, and performing hot press molding to form the composite plate. By forming the side protrusions wrapping the side walls of the copper foil layer window, the copper foil layer is prevented from making contact with the heat conduction copper table.

Provided is a vapor deposition source for a vacuum treatment apparatus capable of forming molten metal spread over a wide range and depositing a Cu film at a relatively high film deposition rate.　A vapor deposition boat 3 installed in a vacuum chamber 1 and a power source Ps for supplying electricity to the vapor deposition boat are provided. A vapor deposition material Em formed of copper is continuously or intermittently supplied to the vapor deposition boat having been heated to melt and evaporate the vapor deposition material to deposit a copper film on a vapor deposition object. The vapor deposition boat is composed of a ceramic or carbon and includes an additive metal material 7 including at least one metal element of titanium, zirconium, and vanadium, and is configured such that when the vapor deposition material is melted in the vapor deposition boat, the additive metal material is blended into the molten metal of the vapor deposition material.

The invention relates to the technical field of the electronic manufacturing industry, in particular to a lead-free wave welding hole blowing machining process control method and application thereof. By limiting the copper deposition degumming treatment rate to be 0.15-0.6 mg / cm < 2 >, it is guaranteed that the backlight grade of the hole wall after copper deposition is larger than or equal to 9, organic matter and pollutants of the hole wall can be effectively removed, the hole wall has proper roughness and activity, the binding force of a copper deposition layer and the hole wall is enhanced, and the hole metallization reliability is improved. During copper electroplating treatment, the current density is set to be 15-25 ASF, the time is controlled to be 20-22 minutes, a copper layer can be evenly and compactly deposited, it is guaranteed that the hole copper thickness reaches the standard, and the conductivity and mechanical performance are improved. And finally, performing windowing treatment on the solder-resisting PTH hole, and by virtue of a reasonable windowing design, assisting solder to be smoothly filled during wave soldering, reducing hole blowing and pseudo soldering, and remarkably improving the welding quality and the production yield.

The invention relates to the technical field of PCB manufacturing, and discloses a double-sided PCB optimized structure based on local pin header connection and a manufacturing method thereof, and the method comprises the steps: carrying out the partition circuit design of a double-sided PCB substrate, and obtaining a circuit layout of the double-sided PCB substrate; drilling the double-sided PCB substrate to obtain a target PCB substrate; the method comprises the following steps of: pressing a brass conductive needle into a needle position hole of an insulating base to manufacture a pin header connecting assembly, inserting the pin header connecting assembly into a mechanical through hole of a target PCB substrate to obtain a preassembly body, and performing wave soldering to obtain a double-sided PCB finished product. The interconnection nodes of the top layer and the bottom layer of the double-sided PCB are divided into a pin header connecting area and a signal transmission area; and only the via holes in the signal transmission area are metalized, so that the number of the via holes needing three high-cost processes of glue residue removal, chemical copper deposition and copper electroplating is reduced, the consumption of copper electroplating materials and the consumption of chemical liquid medicine are reduced, and meanwhile, the production period is shortened.

The invention discloses a method for manufacturing an ultrathin high-density carrier plate. The method comprises the following steps of: cutting a copper-clad plate according to the size of a jointed plate; carrying out LDD brownification treatment on the copper-clad plate; performing laser drilling on the copper-clad plate; after the brownification film is removed, plasma degumming treatment and copper deposition treatment are sequentially carried out on the copper-clad plate; forming an inner-layer circuit pattern on the copper-clad plate, then carrying out hole-filling electroplating treatment, and removing a plate surface copper layer at a non-circuit pattern position through etching after film stripping; laminating copper foils with the thickness of 9 microns on the two surfaces of the copper-clad plate through PP (Polypropylene), and then laminating to form a production plate; lDD browning processing is carried out on the production board; laser drilling is conducted on the production board; after the brownification film is removed, plasma degumming treatment and copper deposition treatment are sequentially carried out on the production board; an outer layer circuit pattern is formed on a production board, then hole filling electroplating processing is carried out, a board surface copper layer at a non-circuit pattern position is removed through etching after film stripping, and the ultra-thin high-density carrier board is manufactured. By the adoption of the method, the problem that BT-like plates cannot be machined through a conventional manufacturing process is solved.

The invention relates to a copper-indium bimetallic nanoflower catalyst and a preparation method and application thereof, and belongs to the technical field of electrochemical reduction catalysts. The method comprises the following steps: taking foamed nickel as a substrate, firstly mixing indium sulfate and dilute sulphuric acid to obtain an indium deposition solution, and electrically depositing a layer of metal indium under the indium deposition solution; then copper sulfate and dilute sulfuric acid are mixed to obtain a copper deposition solution, metal copper is further electrically deposited on the foamed nickel loaded with indium metal, the foamed nickel subjected to electro-deposition is cleaned and dried, and the copper-indium bimetallic nanoflower catalyst is obtained. The prepared copper-indium bimetallic nanoflower catalyst is a self-supporting material, shows excellent performance in nitrate radical electroreduction, and is high in ammonia production Faraday efficiency, large in current density and good in ammonia production rate performance. The synthesis method is easy to realize large scale, mild in reaction condition and good in application prospect.