281 results about "Copper deposition" patented technology

The invention discloses a structure and a manufacturing method of a circuit board with interconnection of any layers of through holes, two ends of an isolation strip which needs to be insulated between layers at the through holes of the circuit board are respectively provided with a concave etching position, the concave etching positions serve as isolation rings, and the concave etching positions are formed after an isolation disc arranged on an inner-layer core plate is etched in a concave mode; the manufacturing method comprises the following steps that a circuit board is provided, a drilling position is arranged on the circuit board, and the drilling position is a position needing to be drilled in subsequent processing; the two ends of the interlayer isolation strip needing insulation at the drilling position of the circuit board are each provided with an isolation disc with the outer diameter larger than the outer diameter of the drilling position. A through hole is drilled in the position, corresponding to the drilling position, of the circuit board, so that the isolation disc on the inner layer is exposed in the through hole, then the isolation disc in the hole is removed through concave etching, and a concave etching position serving as an isolation ring is formed; and after the circuit board is subjected to copper deposition and electroplating, a structure of interconnection of any layers of the through holes is formed. According to the method, a plurality of signals can be transmitted in the same hole, and the purpose of interconnection of any layer in the through hole can be achieved.

The invention relates to a processing technology of an optical module circuit board, which comprises the following steps of: cutting a double-sided copper-clad plate, cutting the plate, and manufacturing an inner-layer circuit to obtain an inner-layer plate; performing hot melting and riveting on the inner-layer plate and then adding layers to obtain a first multi-layer plate; the first multilayer board is subjected to browning copper reduction, laser target burning, plasma degumming, copper deposition and electroplating, vacuum tree plug, high-cutting grinding and circuit manufacturing; performing double-sided layer adding on the treated first multilayer board to obtain a second multilayer board, and performing browning copper reduction, laser target burning, plasma degumming, copper deposition electroplating, vacuum tree plug, high-cutting grinding and circuit manufacturing on the second multilayer board to obtain a semi-finished board; and performing finger gold plating, LPI printing, vacuum etching and the like on the semi-finished board to obtain a finished board. The processing technology can meet the market requirements of 800G optical module products, the high-speed resistance yield is improved, and the mass production capability of the optical module technology is realized.

The invention relates to the technical field of electroplating, and discloses a ceramic substrate through hole electro-coppering hole filling process control method which comprises the following steps: acquiring structural parameters of a target ceramic substrate through hole, optimizing the proportion of a prefabricated electroplating solution to obtain a proportioned electroplating solution, analyzing a composite electroplating medium of the proportioned electroplating solution, and inquiring a pulse current waveform; the copper deposition morphology is monitored, polarization effect coefficients under different current densities are calculated, duty ratio indexes are optimized to score a shaped current sequence, a multi-order electric field is applied to obtain in-hole flow field data, and the copper deposition uniformity is calculated; and performing multi-cycle electroplating-annealing iteration to obtain a copper hole filling structure, testing residual stress, identifying a lattice distortion section, generating a crystallization-annealing curve, and formulating a process optimization scheme according to regulation and control data. According to the invention, the reliability of the through hole electro-coppering filling process can be improved.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The invention discloses an HDI plate manufacturing process for a pen electronic camera module, and the process comprises the steps: carrying out the multi-frequency acoustic wave penetration and temperature gradient processing of a substrate, and obtaining the pre-detection data of the substrate; in the laser drilling process, short-pulse multi-frequency acoustic waves and local heat regulation are applied to a target hole area, and micropore acoustic reflection data are obtained; the method comprises the following steps: independently regulating and controlling the temperature of a plurality of areas of a board surface before chemical copper deposition treatment, and recording acoustic scanning data to form a regional acoustic characteristic spectrum; performing acoustic wave excitation according to a preset time interval in the chemical copper deposition process to obtain monitoring data of the copper deposition process; periodic thermal excitation and fluid disturbance are applied in the electroplating process, and electroplating dynamic monitoring data are obtained; after electroplating is completed, temperature circulation and stress excitation treatment are carried out, and the evaluation result of the internal structure of the micro-through hole is obtained. According to the technical scheme, the micro-through-hole structure with the bubble micro-migration tendency can be accurately identified and screened in the manufacturing process, and the long-term reliability and the use stability of the HDI plate are effectively improved.

The utility model discloses a full-automatic circuit board horizontal copper deposition connecting wire VCP electroplating device. Comprising a horizontal copper deposition incoming plate placing station, a horizontal copper deposition wire, an intelligent plate placing machine arranged at the feeding end of the horizontal copper deposition wire, an intelligent plate collecting machine arranged at the discharging end of the horizontal copper deposition wire, a VCP plating line, an intelligent feeding machine arranged at the feeding end of the VCP plating line, an intelligent discharging machine arranged at the discharging end of the VCP plating line, and a temporary storage station arranged between the horizontal copper deposition wire and the VCP plating line. The intelligent transport vehicle is used for conveying the circuit board collected by the intelligent board collecting machine of the horizontal copper deposition line to a temporary storage station for partitioned temporary storage and conveying the circuit board at the temporary storage station to a VCP plating line; and the memory is used for storing processing information of the circuit board. According to the full-automatic circuit board horizontal copper deposition connecting wire VCP electroplating device provided by the utility model, intelligent board placement and collection are realized, the working efficiency is improved, and the probability of misoperation of personnel is reduced.

The invention discloses a manufacturing method of a small-spacing lamp panel. The manufacturing method comprises the following steps: pressing; drilling is conducted, specifically, through holes are mechanically drilled, and the hole diameter is 0.2-0.3 mm; copper deposition: the thickness of a hole wall copper plating layer is 0.3-0.5 [mu] m; electroplating through holes, wherein the copper thickness in the holes is greater than or equal to 18 microns; the through holes are filled with epoxy resin with the shrinkage rate smaller than 0.5%, and curing is conducted; ceramic board grinding is conducted, an aluminum oxide ceramic grinding wheel is adopted for board grinding, the resin surface in the hole is flush with the surface of the outer layer copper foil of the multi-layer circuit board, the surface roughness Ra is smaller than 0.1 micrometer, and board grinding technological parameters are as follows: the pressure is 5-8 N / cm < 2 >, the rotating speed is 200-300 rpm, and the linear speed is 1-2 m / min; secondary copper deposition: copper deposition is carried out on the surface of the hole plugging resin to form a copper plating layer, and the thickness of the copper plating layer is 0.3-0.5 [mu] m; the whole board is electroplated, and the copper thickness on the resin is larger than or equal to 12 micrometers; and manufacturing an outer-layer circuit. The manufacturing method of the small-spacing lamp panel has the advantages of being low in cost, high in yield, simple in process and the like.

The invention discloses an electroplating method of a circuit board positive piece process based on vertical copper deposition, which comprises the following steps: cutting and baking a board at the temperature of 165 + / -5 DEG C for 3-5 hours; drilling and polish-brushing are conducted, and the polish-brushing linear speed is 4.0 m / min; the backlight grade of the circuit board after copper deposition is greater than or equal to 9 grade; performing line pretreatment, wherein the line speed is 4.5 m / min; pressing a film; exposure is conducted, the exposure energy is 3400-3600 MJ, the exposure time is 3-4 s, and standing is conducted for 30 min or above after exposure; developing, wherein the temperature of developing tank liquid is 28-32 DEG C, and the production line speed is 5-5.5 m / min; pattern electroplating is conducted, the current density is 13 ASF, the electroplating time is 40-50 min, hole copper is larger than or equal to 20 microns, and surface copper is larger than or equal to 33 microns; etching is carried out, the film stripping line speed is 4.7 m / min, and the etching line speed is 8.0 m / min; and AOI. According to the electroplating method of the circuit board positive film process based on the vertical copper deposition, the vertical copper deposition process is adopted, and the production efficiency and the product yield are improved.

A magnetic shield reduces external noise in a chamber including a target and at least one electromagnet for copper physical vapor deposition (PVD). The shield may have a thickness in a range from approximately 0.1 mm to approximately 10 mm to provide sufficient protection from radio frequency and other electromagnetic signals. As a result, copper atoms in the chamber undergo less re-direction from external noise. Additionally, even when hardware failure occurs during PVD (e.g., an electromagnet malfunctions, a wafer stage is not level, and / or a flow optimizer induces too much shift, among other examples), the copper atoms are less susceptible to small re-directions from external noise. As a result, back end of line (BEOL) and / or middle end of line (MEOL) conductive structures are formed in a more uniform manner, which increases conductivity and improves lifetime of an electronic device including the BEOL and / or MEOL conductive structures.

A magnetic shield reduces external noise in a chamber including a target and at least one electromagnet for copper physical vapor deposition (PVD). The shield may have a thickness in a range from approximately 0.1 mm to approximately 10 mm to provide sufficient protection from radio frequency and other electromagnetic signals. As a result, copper atoms in the chamber undergo less re-direction from external noise. Additionally, even when hardware failure occurs during PVD (e.g., an electromagnet malfunctions, a wafer stage is not level, and / or a flow optimizer induces too much shift, among other examples), the copper atoms are less susceptible to small re-directions from external noise. As a result, back end of line (BEOL) and / or middle end of line (MEOL) conductive structures are formed in a more uniform manner, which increases conductivity and improves lifetime of an electronic device including the BEOL and / or MEOL conductive structures.

The invention relates to the technical field of integrated circuit manufacturing, in particular to copper deposition equipment for a new energy vehicle lamp printing integrated circuit board and a working method thereof.The copper deposition equipment comprises a conveying mechanism, a copper deposition frame, a traveling crane and a clamping frame, a lifting table is arranged at the tail end of the conveying mechanism, and a plurality of rolling wheels are arranged on the other side of the lifting table; a plurality of layering plates are arranged at the two ends of the inner side of the copper deposition frame, a pair of clamping frames are clamped at the two ends of the copper deposition frame and located at the upper end of the copper deposition frame, the outer ends of the clamping frames are rotationally connected with the travelling crane, inclined chamfers are formed in the four corners of the upper end of the copper deposition frame, and triangular grooves are formed in the lower sides of the inclined chamfers; and a plurality of triangular clamping blocks are arranged on the inner side of the clamping frame, a first spring piece is arranged between the triangular clamping blocks, inclined chamfers are formed in the lower ends of the triangular clamping blocks in the same way, and the automatic loading function is conveniently, rapidly and efficiently achieved.

The invention relates to the technical field of cleaning machines, in particular to a PCB after-copper-deposition cleaning machine which comprises a pickling machine, a clear water flushing machine is arranged on the left side of the pickling machine, a cold air drying machine is arranged on the left side of the clear water flushing machine, a hot air drying machine is arranged on the left side of the cold air drying machine, and a turnover box is arranged on the left side of the hot air drying machine. A conveying mechanism used for conveying PCBs is jointly arranged in the pickling machine, the clean water flushing machine, the cold air drying machine and the hot air drying machine, and the PCBs are conveyed and cleaned from right to left. Through cooperative use of the driving assembly, the reciprocating assembly and the rotating assembly, rotation of the rotating nozzles is synchronously achieved while the rotating nozzles are driven to do linear reciprocating motion; by means of the technical scheme, reciprocating linear spraying and rotary spraying are achieved, the washing coverage area is increased, compared with fixed spray head washing, dynamic washing reduces cleaning blind areas, shearing force to stains is increased through a complex water flow mode generated by rotation and reciprocating actions, pollutants can be stripped and taken away easily, and the cleaning effect is good.

The present invention relates to a palladium-free activated chemical copper deposition process for a resin substrate, the process comprising the following steps: (1) sequentially performing a degreasing treatment and a roughening treatment on the resin substrate to obtain a pretreated resin substrate; (2) immersing the pretreated resin substrate in a pyrrole solution for a period of time, then immersing the resin substrate in a ferric chloride solution and allowing it to stand for a period of time to obtain a substrate with a polypyrrole film, placing the substrate with the polypyrrole film above boiling water so that water vapor fumigates the substrate with the polypyrrole film, and then washing to obtain an activated substrate; (3) immersing the activated substrate in a chemical copper deposition solution to perform chemical copper deposition to obtain a chemical copper plating layer. Compared with the prior art, the present invention uses pyrrole-loaded colloidal iron as a catalytic active site for chemical copper plating to achieve chemical copper deposition on the surface of a non-conductive plastic substrate, replacing the use of precious metals, solving the problem of difficult treatment of waste liquid from precious metal catalytic reactions, and reducing production costs.

The invention relates to a method for realizing in-hole signal isolation based on chemical copper deposition resisting ink and a selective chemical copper deposition process, which comprises the following steps of: coating the chemical copper deposition resisting ink at preset hole opening positions on two sides of a PCB (Printed Circuit Board) core board to form chemical copper deposition resisting ink film layers; a palladium poisoning agent and a surface active agent for inhibiting palladium adsorption are added into the chemical copper deposition resisting ink; laminating the PCB core board to be separated with other boards to form a pretreated board; performing trepanning treatment on a preset trepanning position of the pretreatment plate to form a via hole; and performing chemical copper deposition treatment on the pre-treated board to form a copper layer on the side wall of the via hole of the pre-treated board, and removing the chemical copper deposition resistant ink film layer from the pre-treated board to form the PCB. Therefore, due to the fact that the palladium poisoning agent and the surface active agent for inhibiting palladium adsorption are added into the anti-electroless copper deposition printing ink, the formed anti-electroless copper deposition printing ink film layer is resistant to attack of chemical copper series liquid medicine, the problem of copper coating on a separation layer can be effectively reduced or eliminated, and in-hole signal separation can be effectively achieved.

A method for recycling gold and copper from gold-bearing waste specifically comprises the steps that after the gold-bearing waste of a gold smelting plant is finely ground, the gold-bearing waste and flotation sulfur gold tailings or cyanidation tailings are mixed according to the proportion of 1: (20-600) for ore blending, and a mixed ingredient is obtained; the mixed ingredients are mixed into ore pulp, the gold grade and the S content are controlled, hot-pressing pre-oxidation is conducted under the conditions of certain temperature, oxygen partial pressure, time and stirring linear speed, and oxidized ore pulp is obtained; the oxidized ore pulp is subjected to dense washing, and gold-rich underflow oxidizing slag and copper-rich overflow acid liquor are obtained; in one path, the underflow oxidizing slag is subjected to subsequent conventional cyanidation leaching, activated carbon adsorption, desorption electrodeposition and gold mud purification, and a gold ingot is obtained; in the other path, after the pH value of overflow acid liquor rich in copper is adjusted, the overflow acid liquor is thickened after being subjected to sulfuration and copper deposition under the conditions of certain reaction time, pH and oxidation-reduction potential, overflow liquid and underflow are obtained, the underflow is subjected to filter pressing and packaging to obtain copper concentrate, and the overflow liquid and flotation tailings are neutralized and then stacked to a tailings pond. And the method has the advantages of low cost, high efficiency and the like, and is particularly suitable for gold smelting plants.

The invention discloses a high-precision substrate laser processing method, and belongs to the technical field of packaging substrate production. A high-precision substrate laser processing method comprises the steps that a plurality of circular positioning targets are arranged on a substrate with a conductive pattern on the surface layer; laminating a layer-adding dielectric electric film and a protective film on the surface of the substrate in sequence; the actual coordinates of the multiple positioning targets are grabbed through measuring equipment, and the expansion and shrinkage value of the base plate is calculated according to the actual coordinates and the theoretical coordinates of the positioning targets; correcting the theoretical coordinates of the blind holes in the surface layer of the substrate according to the expansion and shrinkage value of the substrate, and performing laser processing according to the corrected coordinates of the blind holes in the surface layer of the substrate; capturing an image of each positioning target through a measuring device to obtain a processing error; whether the machining precision error is smaller than a set precision value or not is judged; if yes, removing the protective film on the surface of the substrate, and performing copper deposition and porefilling electroplating on the surface of the layer-adding dielectric electric film; and if not, giving an alarm. And the problem of batch scrapping caused by the fact that substrates with overlarge layer deviation flow into the subsequent processing process can be avoided.

The invention provides a method for manufacturing copper columns on a packaging substrate and the packaging substrate, and the method comprises the steps: sequentially covering a copper deposition layer and a graphical dry film on the surface of the packaging substrate, and vertically and continuously electroplating n first copper column groups of which the heights form an arithmetic progression on the graphic surfaces of the inner layer and the outer layer of a groove between the dry films; and the packaging carrier plate is rotated by 180 degrees, second copper column sets arranged in the height arithmetic progression are vertically and continuously electroplated on the first copper column sets correspondingly, the corresponding copper columns of the second copper column sets and the first copper column sets form target copper columns, and the heights of the target copper columns are the same. According to the invention, the first copper column group with equal height is arranged on the surface of the packaging carrier plate, and the second copper column group with equal height is arranged after up-down rotation, so that the single vertical continuous electroplating process does not exceed the single maximum copper plating amount, and the target copper column height is increased; meanwhile, increasing the height of the target copper column is beneficial to expanding the application range of the double-sided packaging process; in addition, redundant copper columns are arranged in the large plate before cutting, the residual copper rate of the whole plate is increased, the risk of plate burning and leakage is reduced, and the uniformity of the target copper columns is improved.

The invention discloses a circuit board line deposition method and a circuit board line, and belongs to the technical field of circuit board manufacturing, and the method comprises the steps: carrying out the pretreatment of a substrate, the surface of which does not contain a copper foil, and forming a through hole in the substrate; forming graphical printing ink on the surface of the pre-treated substrate; putting the patterned substrate into a chemical copper deposition tank containing a copper salt and a reducing agent, and enabling copper ions to be reduced and separated out to be attached to the hole walls of the through holes and the surface of the substrate which is not covered by the ink under the catalytic action, so as to obtain a copper layer with a target thickness and complete the manufacturing of a circuit layer; the thickness of the ink is greater than or equal to that of the copper layer. The thick copper is directly deposited on the surface of the substrate without the copper foil by combining the circuit deposition process and the thick copper deposition process aiming at the substrate without the copper foil on the surface, so that the cost can be continuously reduced, and the manufacturing cost is greatly reduced through new process development on the premise of meeting the product quality.

The application belongs to the technical field of circuit board preparation, in particular to a PCB circuit board production line, which comprises a cutting machine for cutting and opening fixed holes of an insulating substrate, a copper deposition tank for depositing a conductive layer on the surface of the substrate, a film laminating machine for laminating a film on the substrate and using a solution to produce a circuit pattern on the substrate, an electroplating device for tinning the copper foil of the substrate to prevent damage during etching, a tin stripping machine for cleaning and removing the protective tin on the surface of the substrate, a screen printing device for screen printing text on the PCB, and a rack for loading and transferring the PCB circuit board during processing. The rack can maintain better balance during transfer and will not have the problem of "head heavy and foot light". In addition, the distance between the moving plate and the moving plate and the distance between the moving plate and the fixed plate can be adjusted by the bidirectional screw rod, so that PCB circuit boards of various thicknesses can be loaded and transferred, improving the applicability of the device.

The invention relates to the technical field of electronic manufacturing, and discloses a substrate processing device which comprises a copper deposition tank, one side of the copper deposition tank is connected with a conduction device and a transmission device in a penetrating mode, one side of the transmission device is in transmission connection with a water flow monitoring device, and one side of the transmission device is in transmission connection with an automatic nozzle device. The water flow monitoring device comprises a flow speed fan, a fan blade transmission rod is movably installed in the flow speed fan, a telescopic groove is formed in the outer side of the fan blade transmission rod, and a telescopic spring is fixedly connected into the telescopic groove. The automatic nozzle devices are opened and closed one by one, the flow velocity of the solution is controlled, the solution and impurities deposited at the bottom of the copper deposition tank are sucked into the filter bin through the conduction device, uniform distribution of a copper layer is facilitated, the solution in the copper deposition tank is stirred through the automatic nozzle devices, and the flow velocity of the solution is controlled.

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

This invention provides a method for recovering copper from waste circuit boards, belonging to the field of waste circuit board recycling technology. The method for recovering copper from waste circuit boards according to this invention includes the following steps: (1) Crushing and sorting: mechanically crushing and sorting the waste circuit boards to obtain copper-enriched metal particles; (2) Pre-leaching: mixing the metal particles with a dilute sulfuric acid solution to perform a pre-leaching reaction, obtaining pre-leaching residue and pre-leaching solution; (3) Electrolytic deposition: using the pre-leaching solution as an electrolyte for electrolytic deposition to obtain high-purity copper deposits; (4) Post-treatment: washing and drying the copper deposits to obtain recovered copper. The entire recycling process of the technical solution described in this invention does not generate harmful gases or wastewater, resulting in minimal environmental pollution. Furthermore, this invention allows for copper leaching and electrodeposition within the same device, shortening the process flow and reducing energy consumption.

The invention discloses fading-washing-free plating-resistant ink for a chemical copper deposition process as well as a preparation method and application of the fading-washing-free plating-resistant ink. The washing-free anti-plating ink comprises the following components in parts by weight: (A) 40-80 parts of photocurable acrylate resin; (B) 0.1-5 parts of a nitrogen-containing plating-resistant functional monomer; (C) 10-40 parts of an inorganic filler; (D) 0.5 to 1.5 parts of a reactive leveling agent; (E) 0.5 to 1.5 parts of a non-reactive leveling agent; (F) 5-25 parts of a reactive diluent monomer; (G) 0.5-6 parts of a photoinitiator; and (H) 5-15 parts of an organic solvent. The washing-free plating-resistant ink is subjected to screen printing or jet printing to form a film, and a cured film layer does not form copper deposition in a chemical copper deposition solution, and can enter a subsequent electroplating process without washing or stripping treatment after copper deposition.

The embodiment of the invention relates to the technical field of PCB manufacturing, in particular to an AI server PCB manufacturing method and device, and the method comprises the steps: carrying out the copper reduction of a first copper reduction region of a multi-layer PCB and the grinding of a dry film hole sealing region of the multi-layer PCB before the copper deposition plate electric treatment of the multi-layer PCB, thereby eliminating the defects of a plating layer interface, guaranteeing the uniformity of the plate thickness, and improving the production efficiency. The defects of a plating layer interface are reduced, the etching flatness and the binding force are improved, and the electrical performance and the long-term reliability of a product are ensured.

The invention discloses a treatment process for high-copper sulfur concentrate waste sulfuric acid treatment, and relates to the technical field of waste sulfuric acid treatment, the treatment process comprises the following steps: S1, waste sulfuric acid pretreatment; s2, copper deposition reaction; s3, cobalt and nickel precipitation reaction; and S4, carrying out double-way optimization treatment. Through the integral treatment process, the high-quality gypsum can be obtained, heavy metals such as copper, cobalt and nickel are prevented from being mixed into the gypsum in the conventional treatment process, and a foundation for effectively utilizing the gypsum is laid. And heavy metals in the waste sulfuric acid are effectively converted into mineral products, so that the heavy metals such as copper, cobalt and nickel in the waste sulfuric acid are comprehensively utilized, and the solid waste generation amount of waste sulfuric acid treatment is reduced.

The utility model discloses circuit board copper deposition device with good copper deposition effect relates to circuit board copper deposition technical field, including circuit board fixed component, set up in the side of L type board, be used for the insertion fixed of circuit board, and circuit board fixed component includes the fixed frame of setting up in one side of L type board, and the fixed frame is fixedly installed with the partition strip, and the fixed frame is provided with anti -drop mechanism, drive mechanism sets up on L type board and circuit board fixed component, and drive mechanism includes the pivot that rotates and installs in L type board, and the fixed frame is fixedly installed on the pivot, and the end of pivot is fixedly installed with worm wheel, and the worm wheel is meshed with the installation of worm, in the utility model, through the setting of circuit board fixed component, drive mechanism, can fix circuit board in the fixed frame when copper deposition, and the fixed frame agitates the solution in copper deposition pool, makes the solution concentration distribution even in copper deposition pool, and drives circuit board activity, and then can make the copper surface distribution even after circuit board copper deposition, and the copper deposition effect is better.

The application discloses a method for realizing TGV high-conductivity copper-clad by using a magnetic filtering vacuum arc metal film, and specifically comprises the following steps: S1, ultrasonic cleaning is performed on a glass through-hole substrate; S2, sub-etching cleaning treatment and activation of a substrate surface are performed on the glass through-hole substrate under a vacuum environment; S3, a Ti film layer is deposited on the glass through-hole substrate after the treatment in S2 by using a magnetic filtering vacuum cathode arc method; and S4, a Cu film layer is deposited on the Ti film layer under a low vacuum environment. By using the method provided by the application, a Ti undercoat layer is first deposited, the problem of poor adhesion between Cu and a glass substrate is solved, then copper-clad deposition is performed, in addition, the glass substrate can be conductive after Ti plating, so that the bias voltage can be increased, the energy of Cu ions entering the hole is larger, the thickness of the film plated on the hole wall is improved, the adhesion is stronger, and the conductivity is improved.

The invention discloses a preparation method of high-strength and high-toughness graphene-doped composite copper foil, which comprises the following steps: S1, treating graphene by adopting a high-energy ball milling method to obtain nano-sized defective graphene; s2, preparing a composite electrolyte containing the defective graphene, and adding the composite electrolyte into an industrial electrolytic cell after ultrasonic dispersion; s3, adding a compound additive into the electrolytic bath, and uniformly mixing through air blowing and ultrasound; s4, direct current is introduced, so that graphene and copper ions are co-deposited on the surface of the cathode roller to prepare a composite copper foil; and S5, carrying out acid pickling, water washing, drying, stripping and rolling on the composite copper foil. According to the invention, through doping of nano-scale defective graphene, on one hand, active sites are provided for copper deposition so as to refine grains, increase grain boundaries and hinder dislocation motion; on the other hand, due to the fact that the size of the defective graphene is matched with the height of copper grains, the strength can be improved through dislocation pinning and back stress strengthening, meanwhile, a multi-slip system is activated, dislocation storage is promoted to improve plasticity, the balance dilemma of the strength and the ductility of the copper foil is broken through finally, the copper foil has the high-strength and high-toughness characteristics, and the design requirement for the high energy density of the lithium ion battery is met.

The invention relates to the technical field of printed circuit boards, and discloses a process method for optimizing a copper lattice to improve the binding force of a plating layer, which comprises the following steps of: glue residue removal treatment: carrying out glue residue removal treatment on a drilled printed circuit board to form a roughened structure on the surface of a hole wall; activating treatment: adsorbing palladium catalytic particles on the coarsened pore wall surface to form a uniformly distributed catalytic center; and chemical copper deposition: immersing the activated plate in a chemical copper solution, controlling the reaction temperature to be 41-45 DEG C, maintaining the concentration of copper ions, alkali and a reducing agent through automatic compensation and liquid mixing, and depositing on the hole wall to form an initial copper layer. The technological method for optimizing the copper lattice to improve the coating binding force aims at solving the problems that in high-density interconnection and high-speed and high-frequency printed circuit board manufacturing, due to the fact that a traditional chemical copper plating technology lacks dynamic regulation and control capacity, the coating binding force is insufficient, the lattice structure is loose, and uniformity is poor.

The invention discloses a three-dimensional metallization method based on DPC ceramic, and the method comprises the following steps: carrying out the front metallization: carrying out the front metallization of a ceramic plate; metalizing the back surface: metalizing the back surface of the ceramic plate; blind holes are formed in the side face of the ceramic plate through laser, and the blind holes are distributed in the side face of the ceramic plate at intervals and communicate with the front face of the ceramic plate; laser hole scanning is conducted, specifically, green light scanning is conducted firstly, then ultraviolet light scanning is conducted, the green light scanning power is 100 w, the green light scanning frequency is 150000, the green light scanning speed is 1000 mm / min, and the scanning number of times is 10; the scanning power of the ultraviolet light is 100w, the frequency of the ultraviolet light is 150000, the scanning speed of the ultraviolet light is 700mm / min, and the scanning times of the ultraviolet light is 20; magnetron sputtering: copper deposition; manufacturing a circuit; and electroplating. The invention has the beneficial effects that a new structure with the front and back metallization and the side metallization is developed, which becomes a new demand for improving a micro-assembly form; signal transmission channels are added, two signal transmission surfaces are improved to six signal transmission channel surfaces, and the product is changed from a planar structure to a three-dimensional structure.