Coppering and porefilling process for circuit board

Abstract

The invention discloses a coppering and porefilling process for a circuit board, which comprises the following steps of: A) performing cutting, inner layer multibond and plane pressing on a circuit board substrate, and then drilling the circuit board substrate; B) performing copper deposition and panel plating on the drilled substrate; C) performing image transfer on the substrate subjected to copper deposition and panel plating through a hole plating film; D) performing a coppering and porefilling process on the substrate subjected to image transfer; E) performing circuit image transfer through a circuit film; F) performing silk screen on a solder mask and characters; G) performing a plane immersion Ni / Au process; and H) testing and checking the electrical property and shape of a finished board, and producing the finished product. By using the coppering and porefilling process for the circuit board, a hole is subjected to the image transfer process before the coppering and porefilling process; and after a dry film is stuck, the hole is subjected to exposure and development by the hole plating film, and the hole which needs electroplating and copper filling is exposed; and by using a scheme of low copper low current density plating, the copper concentration in plating solution is controlled to be 50 to 60g / L, and the current density is controlled to be 10 to 14ASF, so that plump plating is reduced to a maximum extent, and the finished product ratio and finished product quality are improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a circuit board copper plating and hole filling process which adopts a selective plating process for copper plating and hole filling. Background technique [0002] As consumers continue to pursue light, small, thin and multi-functional electronic products, the integration density of electronic components is getting higher and higher, and the wiring of PCB products is becoming more and more dense. In order to effectively use the surface area of ​​PCB products, and To improve the reliability of component soldering, the via holes are required to be plated and filled. [0003] In the past, copper plating and hole filling used the method of split hole electroplating and copper filling, that is, firstly drill out the holes that need to be electroplated and filled with copper, then immerse copper and electroplate and add copper to fill the holes, and then dr...

AI Technical Summary

Problems solved by technology

Using this process, there are often the following defects: 1. Due to the characteristics of the electroplating process itself, there are different degrees of drum plating phenomenon in copper plating and filling holes, that is, the copper plating on the hole is thicker than the middle part, and finally the hole on both sides is thicker. There is still a gap in the middle of the hole during sealing and plating, and therefore there is a problem of hidden plating solution in the hole, which will not only bring hidden dangers to the quality of the product, but may also cause pollution of the liquid in the subsequent process; 2. The past copper plating hole filling process The method of electroplating and filling holes is completed by split-hole whole board electroplating. Surface copper plating and hole copper are almost electroplated at a ratio of 1:1. The surface copper plating is thicker, which greatly increases the production cost of the product; 3. The surface copper plating is relatively thick. When it is thick, sometimes it is necessary to increase the copper reduction process of surface copper. When reducing copper, it is easy to cause the difference in surface copper thickness to increase, which brings great difficulties to line etching and even leads to the uncontrollable etching line width of products and scrapping