12 results about "Copper reduction" patented technology

The invention belongs to the field of solid waste resourceful treatment, and discloses a copper-containing sludge smoldering dehydration and decarbonization upgrading and copper recycling method and device.The method comprises the steps that copper-containing sludge, auxiliary fuel and a heat storage medium are mixed to obtain a mixed material, and the mixed material is subjected to smoldering treatment to obtain copper-containing smoldering ash; carrying out particle size screening on the copper-containing smoldering ash to separate the heat storage medium and obtain copper-rich smoldering ash; and a reducing agent and a slag former are added into the copper-rich smoldering ash for smelting, and finally molten copper is collected to obtain crude copper. According to the method, efficient low-energy-consumption dehydration reduction of the copper-containing sludge is achieved through the self-maintaining smoldering process, input of a large amount of external energy is avoided, the scale of treatment equipment is effectively reduced, meanwhile, high-valence copper reduction can be achieved in the smoldering process, the production cost of the follow-up pyrogenic process smelting process is effectively reduced, input of a large amount of energy and the effect of a reducing agent are avoided, and industrial production is facilitated. And the method has the advantages of being simple in process, high in adaptability, low in cost and high in recycling degree.

The invention aims to provide a preparation method and application of a copper sulfide-reduced graphene oxide composite material. The preparation method comprises the following steps: mixing copper chloride and tris (hydroxymethyl) aminomethane to obtain a first mixture, adding a graphene oxide aqueous solution into the first mixture to obtain a second mixture, adding alkali liquor into the second mixture, and then adding thiourea for reaction to obtain a copper sulfide / graphene oxide composite material; and preparing a hydrazine hydrate aqueous solution, mixing the hydrazine hydrate aqueous solution and the copper sulfide / graphene oxide composite material, and carrying out a reduction reaction at a certain temperature. The copper sulphide-reduced graphene oxide composite material can effectively increase reversibility of a phase inversion reaction, and the cycle performance of the composite material can be remarkably improved while the capacity performance is improved.

The invention belongs to the field of circuit board copper reduction etching machine processing, and discloses a copper sulfate recovery device and method for a circuit board copper reduction etching machine, the recovery device comprises a precipitation tank, a cooling assembly, a liquid supply assembly and a scraping assembly, the precipitation tank is used for injecting micro-etching waste liquid; the cooling assembly comprises cooling plates and a refrigerator, and the cooling plates are arranged on the two opposite sides of the precipitation tank; the scraping assembly comprises a plurality of scraping plates, a transmission chain and a driver, and the transmission chain drives the scraping plates to move along the precipitation tank, so that the scraping plates scrape out the copper sulfate crystals from the discharge port; the detection assembly comprises a volumetric flowmeter and a temperature sensor, the volumetric flowmeter is arranged on the infusion tube, and the temperature sensor is arranged in the precipitation tank; the water pump is provided with a first controller; the first controller is in communication connection with the volume flow meter; the refrigerator is provided with a second controller, and the second controller is in communication connection with the temperature sensor and the first controller. According to the invention, the crystallization time can be shortened, the refrigeration energy consumption is reduced, and the maintenance cost is obviously reduced.

The invention discloses a method for improving copper-free holes of a circuit board, which comprises the following steps: when the hole diameter of a finished hole is 0.2-0.5 mm, the diameter of a drill bit is 0.15-0.45 mm, the rotating speed of the drill bit is 80000-120000 rpm, the feeding speed is 0.3-1.0 m / min, and the retracting speed is greater than or equal to 5 m / min; when the hole diameter of the finished hole is 0.5-1.5 mm, the diameter of a drill bit is 0.45-1.4 mm, the rotating speed of the drill bit is 20000-50000 rpm, the feeding speed is 1-3 m / min, and the retracting speed is larger than or equal to 5 m / min; copper deposition pretreatment: degumming, coarsening, cleaning, activating and washing the base material; copper deposition: copper deposition liquid medicine comprises the following components: 5-10 g / L of copper sulfate, 2-5 g / L of a reducing agent, 20-40 g / L of a complexing agent and 0.1-0.5 g / L of a stabilizer, the pH value of the copper deposition liquid medicine is 9-9.5, the temperature is 30-35 DEG C, and the reducing agent is formaldehyde; in the initial stage, the current density is 1-2 A / dm < 2 >, and the electroplating time is 5-10 min; and in the subsequent stage, the current density is 2-3 A / dm < 2 >, and the electroplating liquid is uniformly stirred by adopting mechanical stirring in the electroplating process. According to the method for improving the copper-free condition of the circuit board hole, the drilling technology, the copper deposition pretreatment technology, the copper deposition liquid medicine and the electroplating technology are optimized, the phenomenon that copper does not exist in the hole is avoided, and the conductivity of a product is improved.

The application discloses a copper reduction method of a POFV process, and can reduce the thickness of copper and is not limited to the corner copper in the IPC specification, and solves the problem of difficult line etching caused by the copper thickness of the POFV process.

The present application relates to a kind of acidic etching waste liquid for FPC copper reduction method, copper reduction liquor and FPC manufacturing system, the method comprises: obtaining acidic etching overflow waste liquid in circuit etching process, the overflow waste liquid includes copper chloride, hydrochloric acid and chlorate;Citric acid is added to acidic overflow waste liquid, and is dissolved and uniformly formed copper reduction liquor, and the citric acid addition amount is 1-10g / L;The temperature of the copper reduction liquor is adjusted to 15-25 ℃;The flexible copper-clad plate is soaked or sprayed using the copper reduction liquor for a certain time;After the flexible copper-clad plate is rinsed and dried, it is placed for use.The copper reduction liquor is composed of acidic etching overflow waste liquid and citric acid.The FPC manufacturing system includes acidic etching device, copper reduction liquor preparation device, copper reduction device and post-processing device.The copper reduction method has the advantages of moderate rate, good controllability and uniform copper reduction.

The invention discloses a method for removing copper from PCB (printed circuit board) complex wastewater. The method comprises the following steps: (1) adding sulfuric acid to adjust the PCB complex wastewater to be acidic; (2) under an acidic condition, adding hydrogen peroxide and ferrous sulfate, breaking complex of copper ammonia complex ions by utilizing strong reducibility in the ferrous sulfate, and reducing high-valence copper into a free state; (3) carrying out oxidation coagulation, oxidizing by dissolved oxygen, hydrolyzing to generate colloid with strong adsorption capacity, capturing and dissociating, and forming precipitate; (4) adding sodium hydroxide to adjust the wastewater to be alkaline; and (5) adding aluminum polychlorid under an alkaline condition, and reacting the aluminum polychlorid with the free precipitate after hydrolysis. According to the scheme, ferrous sulfate and polyaluminum chloride are taken as cores, a double-step pH regulation process of'first acidification and second alkalinity 'is adopted, and the copper ions in the PCB complexing wastewater are efficiently and safely removed by cooperating with the effects of ferrous sulfate reduction complex breaking and polyaluminum chloride coagulating sedimentation.

The invention discloses an end point judgment method for a copper smelting reduction period of an anode furnace, and belongs to the field of metallurgy. The method comprises the following steps: continuously acquiring flame image information by using a camera, obtaining refined data by using a flame image, converting a preprocessed image into an HSV color space, respectively extracting chromaticity, saturation and brightness values of each pixel point, extracting image feature information, and training by using a generalized regression neural network, namely a GRNN neural network structure data set. And inputting the data into an intelligent control system. The PID control algorithm is used for monitoring and controlling parameter optimization, loop control is achieved, and forecasting and alarming are completed at the end point of the reduction period. The method can effectively improve the end point hit rate of the anode furnace in the copper smelting reduction period, so that the production efficiency is improved.

The application provides a processing method for improving the uniformity of copper reduction of a printed circuit board. The technical core is that a composite copper foil is added. In the copper reduction processing, the etching resist layer in the composite copper foil protects the base copper from being corroded by the copper reduction chemical solution. Then the etching resist layer is removed by a chemical method to expose the base copper, so that the uniformity of the copper thickness is ensured. The method comprises the following steps: covering an etching resist layer on the surface of the copper foil to form a composite copper foil; completing the processing of the inner layer pattern of an inner layer core board; stacking the composite copper foil, the copper foil, the adhesive sheet and the inner layer core board according to the order of the stacking structure, and putting them into a high-temperature and high-pressure press to press them into a multilayer circuit board; after the multilayer circuit board is subjected to processes such as drilling, hole metallization, whole board electroplating and resin hole plugging, the copper reduction is performed, then the etching resist layer is removed by a chemical method to expose the base copper, and then subsequent processing processes are performed.

The invention relates to a method for efficiently breaking complex and recycling metal copper in alkaline cyanide gold leaching barren liquor by an aluminum method and recycling the barren liquor. The barren liquor obtained by gold leaching by using cyanide reagents such as golden cicada, Zijie, Zhijin, northeast tiger, green gold and the like is treated through the steps of calcium removal, primary aluminum reduction, ferrous treatment, secondary aluminum reduction and the like. Complex copper in the cyanogen-like gold leaching barren liquor is reduced into elemental copper through elemental aluminum, separation is completed through filtering, and low-copper barren liquor and copper sludge are produced. According to the method, the problem of copper accumulation caused by repeated circulation of the barren solution in the cyanogen-like method metallurgy process is solved, the concentration of the cyanogen-like reagent in the barren solution is increased while copper in the barren solution is recycled, the addition of the cyanogen-like reagent during barren solution recycling is reduced, the comprehensive utilization rate of resources is increased, and economic benefits are increased. The method for efficiently breaking and recycling the metal copper in the alkaline cyanogen-like gold leaching barren liquor through the aluminum method and recycling the barren liquor has important significance and value on resource utilization, green production and environmental protection of the cyanogen-like gold leaching barren liquor.

The utility model discloses a novel pressurizing mechanism of a copper reduction furnace, which comprises a bottom frame provided with a first pipeline and a second pipeline. The buffer assembly comprises an air inlet buffer and an air outlet buffer, the air inlet buffer is communicated with the first pipeline, and the second pipeline is communicated with the air outlet buffer; the compression assembly comprises a compression main machine, and the two ends of the compression main machine communicate with the air inlet buffer and the air outlet buffer correspondingly; natural gas is adopted as a reducing medium to reduce copper liquid, during reduction, the natural gas sequentially enters a buffer assembly, a compression assembly and a cooling assembly, the gas is actively pressurized before being pumped into the copper liquid, the pressurized gas is pumped into the copper liquid, the gas can make full contact with the copper liquid, oxygen in the copper liquid can be rapidly reduced, and therefore the oxygen content in the copper liquid can be reduced. And the gas consumption is reduced, and meanwhile, the time required for reducing the oxygen element in the copper liquid can be shortened.

The application relates to a copper-reducing additive for HDI plates and a copper-reducing process, wherein the copper-reducing additive comprises sulfuric acid, hydrogen peroxide stabilizer, pinhole inhibitor, accelerator, antioxidant and water; the pinhole inhibitor comprises a halide salt; and the accelerator comprises an amine compound and / or an alcohol compound. The copper-reducing process comprises preparing an etching solution by using the copper-reducing additive, and then spraying and etching a filled hole plate by using the etching solution to obtain a copper-reduced filled hole plate. The copper-reducing additive provided by the application can maintain the stability of the etching rate in a wide range of chloride ion concentration and a high upper limit of copper ion concentration, and can inhibit the generation of pinholes at the blind hole and the copper surface after copper reduction.