High-speed reduction copper liquid for PCB and preparation method

Abstract

The invention discloses high-speed reduction copper liquid for a PCB and a preparation method. The high-speed reduction copper liquid is applied to copper reduction etching treatment. Etching medicineliquid comprises an accelerant, a surfactant, a PH modifier, a H2O2 stabilizing agent and a solvent; in per liter of the medicine liquid, the content of the accelerant is 30-36 g, the content of thesurfactant is 12-18 g, the PH modifier is 100-140 ml 50% sulfuric acid solution, the solvent is 700-740 ml water, the H2O2 stabilizing agent comprises three components, wherein the first component is35-45 ml, the second component is 15-21 ml, and the third component is 50-54 g. The H2O2 stabilizing agent is used for reducing the decomposition rate of H2O2, and improving the copper ion tolerance of the high-speed reduction copper liquid.

Description

technical field [0001] The invention relates to the field of chemical liquids, in particular to a high-speed thinning copper liquid for PCB and a preparation method thereof. Background technique [0002] With the high frequency and refinement of electronic products, the proportion of high-frequency circuit boards and HDI (High Density Interconnector, high-density interconnection) circuit boards in the PCB (Printed Circuit Board, printed circuit board) industry has increased year by year. The fine lines on high-frequency boards and HDI boards need to use a fast etching process to ensure line accuracy. In the sulfuric acid hydrogen peroxide system micro-etching solution commonly used in the industry, due to the high copper ion environment in which the etching process is located, the main etching effect is H 2 o 2 Homogeneous and heterogeneous catalysis is produced in a high-concentration copper ion environment, which accelerates the H 2 o 2 Decomposition speed, which in tur...

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Problems solved by technology

[0002] With the high frequency and refinement of electronic products, the proportion of high-frequency circuit boards and HDI (High Density Interconnector, high-density interconnection) circuit boards in the PCB (Printed Circuit Board, printed circuit board) industry has increased year by year. The fine lines on high-frequency boards and HDI boards need to use a fast etching process to ensure line accuracy. In the sulfuric acid hydrogen peroxide system micro-etching solution commonly used in the industry, due to the high copper ion environment in which the etching process is located, the main etching effect is H 2 o 2 Homogeneous and heterogeneous catalysis is produced in a high-concentration copper ion environment, which accelerates the H 2 o 2 Decomposition speed, which leads to the reduction of etching rate, does not meet the fast etching process required by fine lines

[0003] In order to solve the above problems, the industry usually adopts the method of increasing the water supply in the rapid etching process to passively control the concentration of copper ions in the etching solution to slow down the H 2 o 2 However, due to the continuous accumulation of copper ions in the etching process, a large amount of water needs to be wasted to control the concentration of copper ions within an ideal range, and at the same time, the discharge of etching sewage increases, which is extremely unfriendly to the environment.

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