The invention discloses a fabrication method of a multi-layer
printed circuit board (PCB) and the multi-layer PCB. The method comprises the following steps of: respectively
etching a first bonding pad and a second bonding pad on a first preset region on the PCB at the top layer and a second preset region, corresponding to the first preset region, on the PCB at the bottom layer for
welding jack component pins or
welding the jack component pins and connecting
signal wiring at the layer where the first bonding and the second bonding pad are located;
etching a third bonding pad for connecting
signal wiring of a conversion layer on a third preset region which is in correspondence to the first preset region and is on the conversion layer required for wiring on the PCB at the inner layer;
etching the conversion layer which is not required for wiring on the PCB at the inner layer and a
metal foil in a fourth preset region corresponding to the first preset region; and aligning the PCBs of all
layers and laminating, drilling in the first preset region, the second preset region, the third preset region and the fourth preset region to form metallic through holes for installing a jack component in an inserted way. By the method, the problem of difficulty in achieving the design of a high-density interconnected PCB is solved, the fabrication of the high-density interconnected PCB is promoted, and the fabrication cost is reduced.