Provided is an information processingsystem including a plurality of nodes 3 and a plurality of storages 4 coupled subordinately to each of the nodes 3, each of the nodes 3 functioning as a virtual file system that provides a client 2 with storage regions of each of the storages 4 as a single namespace. This information processingsystem is further provided with a backup node 10 and a backup storage 11 coupled subordinately to the backup node 10. The backup node 10 synchronizes and holds location information (file management table 33) held by each of the nodes 3. Then, the backup node 10 creates a backup file, and stores the backup file in the backup storage 11 by accessing a location identified by the location information (file management table 43) synchronized and held by the backup node 10 itself to acquire a file.
A serial advanced technology attachment (SATA) storage device supports an SATA protocol that provides for high data transfer speed. The storage device is for connecting to an SATA cable, and includes at least one non-volatile semiconductor memory device for storing data therein; an SATA adapter, connected to the SATA cable, for transferring / receiving data signals to / from the SATA cable; a memory controller for controlling the non-volatile semiconductor memory device in response to data signals transferred from the SATA adapter; and an SATA device controller, connected between the SATA adapter and the memory controller, for interfacing transmitted / received data signals between the SATA adapter and the memory controller.
A method for creating a single virtual LAN including a source (S) attached to a first Token ring LAN (N1), a target (T) within a subnet attached to a different Token ring LAN (N2), and an interconnecting router (R). The source (S) encapsulates the first packet with a Token ring header including the routerMAC address (RMAC), SMAC as source MAC address as layer 2 information, and IP address of T (TIP) as layer 3 data and sends this packet over N1 toward the router. When receiving the first packet, R reads its IP table for best match with TIP address to identify the subnet including T. The net handler runs an ARP protocol to identify TMAC address, substitutes the MAC header with said TMAC address into said first packet destination MAC address field and forwards said first packet over N2. R then sends a conventional ICMP message over N1 limited broadcast and reconfigures itself in proxy ARP for the defined subnet. For the second packet, S runs an ARP and R answers with RMAC address and the RIF data to be used for next packets.
An electronic circuit includes a first semiconductor device (4) and a second semiconductor device (3) on a mounting substrate. The mounting substrate includes a plurality of mounting substrate lines (201 to 204) which are connected in common with external terminals of a plurality of bits of the first semiconductor device and external terminals of a plurality of bits of the second semiconductor device for every bit. The mounting substrate lines have lengths thereof from the external terminals of the first semiconductor device to the external terminals of the second semiconductor device made unequal for respective bits. Assembling lines (361 to 364) which reach connecting electrodes of a semiconductor chip from the external terminals of the second semiconductor device have made lengths thereof unequal for respective bits. Here, the unequal lengths of the mounting substrate lines have a relationship which offsets the unequal lengths of the assembling lines. According to such a constitution, it is unnecessary to set lengths between the external terminals of the second semiconductor device and the connecting electrodes of the semiconductor chip equal.
A stacked semiconductorpackage comprises two semiconductor chips (11, 12) each of which has a mounting surface provided with a plurality of chip pins arranged in a predetermined pattern. The semiconductor chips are mounted on opposite surfaces of a substrate (13) so that the mounting surfaces are faced to each other through the substrate. The substrate is provided with a plurality of package pins formed in an area other than a chip mounting area and arranged in a pattern identical to the predetermined pattern. A pair of the corresponding chip pins of the semiconductor chips are connected to a via formed at an intermediate position therebetween by the use of branch wires equal in length to each other. The via is connected by a common wire to the package pin corresponding to the chip pins connected to the via.
A color image forming apparatus produces a latent image on a photosensitive body based on a signal output from a scanning light detecting part in response to detection of scanning light; a semiconductorlaser modulation signal generating part includes a clock generating part and a clock modulation part; a semiconductorlaser and a semiconductorlaser driving part are provided for each color of yellow, magenta, cyan and black; and further, a plurality of the semiconductor lasers are provided for at least one color of yellow, magenta, cyan and black.
A method of manufacturing a through electrode. While using at least a first conductive film for a gate electrode as a mask, an inner trench and a peripheral trench is formed. The Inner trench is provided for an inner through electrode having a columnar semiconductor. The peripheral trench is provided for a peripheral through electrode around an annular semiconductor surrounding the inner trench. The inner trench and the peripheral trench are filled with a through electrode insulation film and a through electrode conductive film, respectively, to form an inner through electrode and a peripheral through electrode.
A through-electrode that penetrates a semiconductor substrate and that is insulatively separated from the semiconductor substrate includes an inner through-electrode, a quadrangular ring-shaped semiconductor, and an outer peripheral through-electrode. The quadrangular ring-shaped semiconductor is formed around the inner through-electrode, and the outer peripheral through-electrode is formed around the quadrangular ring-shaped semiconductor.
A new data transmission method and system that can enhance the speed of data transfer between base stations are provided. Unsent data stored at a base station is transmitted through a plurality of routes. The base station stores unsent packets destined for a mobile station or a gateway. The base station transmits some of the unsent packets to the mobile station or the gateway and transfers the other remaining packets to a handover-target base station. The handover-target base station transmits the received other packets to the mobile station or the gateway.
A communication protocol, and a method and system of communication exchange between systems over a communication network includes establishing a connection between a first system and a second system. Data is formatted by the first system into an IP datagram with an IP header and one of a TCP and a UDP header. A connectionless TCP / IP header is constructed to add to the formatted data. The connectionless TCP / IP header includes a pre-defined identifying value in a designated field, and a checksum to validate that a connectionless TCP / IP header has been identified. The formatted data having the connectionless TCP / IP header is transmitted from the first system to the second system, and the pre-defined identifying value in the designated field is verified to identify the connectionless TCP / IP header. The connectionless TCP / IP header is then removed from the IP datagram, and the IP datagram is processed.
A method of providing a push service to an AT and a push server apparatus using the same to facilitate a data receiving service comprising reception of paging messages at the AT in a mobile communication system for high-speed data transmission are provided. The mobile communication system comprises at least one DLR for allocating a UATI to the AT when a communication is connected to the AT, a home DLR for storing the ID of the AT with respect to the identification information of the DLR, a PDSN for establishing a PPP session with the AT, a DNS, and a push server for buffering push data for the AT received from a CN and requesting paging of the AT for push data transmission to the AT from which the PPP session has been terminated.
An interrupt request cannot be transmitted while a data read command or a data write command transmitted from a host device to a slave device is being processed in a half-duplex mode. Disclosed are a host device and a slave device that are set to a full-duplex mode by temporarily switching the communication direction of a first transmission channel or a second transmission channel after completing transmission and reception of a predetermined number of data packets in the half-duplex mode. The host device or the slave device can thus transmit an interrupt request, such as a request associated with a wait status or a busy status, to its communication target using the temporary full-duplex mode. This enables the host device or the slave device to process such an interrupt request during high-speed data transfer performed in the half-duplex mode.
A first conductor member includes an amplifier-side first conductor, a head-side first conductor, and first and second interleaved conductors. A second conductor member includes an amplifier-side second conductor, a head-side second conductor, and third and fourth interleave conductors. The second interleaved conductor is connected to the amplifier-side first conductor through a first jumper conductor. The fourth interleave conductor is connected to the head-side second conductor through a second jumper conductor. The jumper conductors are formed by partially etching a metal base. The jumper conductors are individually inclined at angles of 45° or less to an axis which extends in a wiring direction of each of the interleaved conductors.
A method of configuring a frame for fast wireless communication and an apparatus for fast wireless communication are provided. The apparatus for fast wireless communication includes: a frame configuration unit configuring a frame including transmission data; a demultiplexing unit demultiplexing the transmission data included in the frame into N number of parallel streams (N: positive number greater than 2); N number of coding and modulation units connected in parallel to perform error correction coding and orthogonal frequency division multiplexing (OFDM) with respect to each of the N number of parallel streams; and a multiplexing unit multiplexing outputs of the N number of coding and modulation units into serial streams.
A method of manufacturing a through electrode. While using at least a first conductive film for a gate electrode as a mask, an inner trench and a peripheral trench is formed. The Inner trench is provided for an inner through electrode having a columnar semiconductor. The peripheral trench is provided for a peripheral through electrode around an annular semiconductor surrounding the inner trench. The inner trench and the peripheral trench are filled with a through electrode insulation film and a through electrode conductive film, respectively, to form an inner through electrode and a peripheral through electrode.
A communication protocol, and a method and system of communication exchange between systems over a communication network includes establishing a connection between a first system and a second system. Data is formatted by the first system into an IP datagram with an IP header and one of a TCP and a UDP header. A connectionless TCP / IP header is constructed to add to the formatted data. The connectionless TCP / IP header includes a pre-defined identifying value in a designated field, and a checksum to validate that a connectionless TCP / IP header has been identified. The formatted data having the connectionless TCP / IP header is transmitted from the first system to the second system, and the pre-defined identifying value in the designated field is verified to identify the connectionless TCP / IP header. The connectionless TCP / IP header is then removed from the IP datagram, and the IP datagram is processed.
A technique that improves both processor performance and associated data bandwidth through user-defined interfaces that can be added to a configurable and extensible microprocessor core. These interfaces can be used to communicate status or control information and to achieve synchronization between the processor and any external device including other processors. These interfaces can also be used to achieve data transfer at the rate of one data element per interface in every clock cycle. This technique makes it possible to design multiprocessor SOC systems with high-speed data transfer between processors without using the memory subsystem. Such a system and design methodology offers a complete shift from the standard bus-based architecture and allows designers to treat processors more like true computational units, so that designers can more effectively utilize programmable solutions rather than design dedicated hardware. This can have dramatic effects not only in the performance and bandwidth achieved by designs, but also in the time to market and reuse of such designs.
A flexure with conductors is provided with a flexure tail portion. The flexure tail portion includes a metal base, an electrically insulating layer, and a conductive member. The metal base is formed with a plurality of apertures. A damper is attached to the flexure tail portion. The damper includes a viscoelastic member and a metallic constrained plate. The viscoelastic member has first and second surfaces. The first surface of the viscoelastic member is secured to the flexure tail portion. The constrained plate is secured to the second surface of the viscoelastic member. The constrained plate extends longitudinally relative to the metal base along the conductive member. The conductive member and the constrained plate face each other with the viscoelastic member therebetween.
The invention discloses an FPGA (field programmable gate array) based USB3.0 interface module, and relates to a USB3.0 interface module in order to realize compatibility with a USB2.0 high-speed interface as well as high-speed data transmission between a computer and an FPGA. According to the interface module, the FPGA is adopted to realize logic control, and the high-speed data transmission is realized through data read-write operation of synchronous slave equipment FIFO (first input first output) in a chip FX3; the interface module control logic comprises a USB3.0 transmitting module, a USB3.0 receiving module, an FIFO transmitting module for clock domain crossing operation and an FIFO receiving module for the clock domain crossing operation. The FPGA based USB3.0 ultrahigh-speed interface is compatible with the USB2.0 high-speed interface, and the high-speed data transmission between the computer and the FPGA is realized.
Not only pilot channel symbols but also control channel symbols can be flexibly decreased in a radio communication system, which includes a transmission side apparatus transmitting a data frame where a plurality of continuous or discontinuous frequency areas are assigned to one transfer time block and a frame is formed of a predetermined number of transfer time blocks; and a reception side apparatus receiving a data frame from the transmission side apparatus, The transmission side apparatus transmits to the reception side apparatus a data frame which has a common pilot channel and a control channel in the beginning of the frame, the reception side apparatus measures a received quality of the data frame, decides a frame type based on the measured received quality and notifies the decided frame type to the transmission side apparatus. The transmission side apparatus sends subsequent frame data to the reception side apparatus in use of a frame format corresponding to the notified frame type.
A semiconductor device includes a first controlled chip and a control chip stacked therewith. The first controlled chip includes a first circuit outputting a data signal in response to a synchronization signal, an input / output circuit outputting the data signal to a data terminal in synchronization with a delayed synchronization signal, and a replica circuit replicating an output circuit and outputting a replica signal to a first replica terminal in synchronization with the delayed synchronization signal. The control chip includes a first control circuit outputting a synchronization signal and receiving a data signal, a delay adjustment circuit delaying the synchronization signal and outputting the same as a delayed synchronization signal, a phase comparator circuit comparing the phases of the replica signal and the synchronization signal, and a delaycontrol circuit controlling the delay amount of the delay adjustment circuit based on a comparison result of the phase comparator circuit.
The invention relates to a field programmable gate array (FPGA)-based joint test action group (JTAG) test method. In the method, an FPGA is connected with a circuit board to be tested by a JTAG interface and a probe; when a test is performed through the JTAG interface, the probe led out of the FPGA is connected with a monitoring point of the circuit board to be tested so as to read the data change of each point during the test; and finally, the FPGA sends the data change to a personal computer (PC) or a microprocessor for data analysis and judgment through an asynchronous series-port circuit. By the FPGA-based JTAG test method, a welding defect of a ball grid array (BGA) chip and the welding condition of the circuit around the chip can be precisely judged.
This invention relates to wireless transparent D2D system transmission method based on the public mobile data communication net and the current operator provided 2.5 G mobile data communication package transmission exchange platform of GPRS / CDMA2000 1X. The invention comprises wireless D2D terminals and gates working at the common wireless network and central Ethernet linkage layer to realize the remote transparent wireless data transmission and exchanging function.