Ceramic heating body and manufacturing method thereof

Abstract

The invention relates to a ceramic heating body and a manufacturing method thereof. The ceramic heating body comprises a ceramic core rod and a multi-layer composite structure laminated and wound on the ceramic core rod, wherein the multi-layer composite structure and the ceramic core rod are sintered and molded together, the multi-layer composite structure at least comprises a heating circuit layer and a temperature measurement circuit layer, the heating circuit layer comprises a first ceramic chip and a heating circuit formed on the first ceramic chip, the temperature measurement circuit layer comprises a second ceramic chip and a temperature measurement circuit formed on the second ceramic chip, and the heating circuit layer and the temperature measurement circuit layer are respectivelyprovided with a through hole so as to lead out a wire from the corresponding circuit layer. According to the LED patch nixie tube, the probability of short circuit of different circuits on the ceramic heating body is greatly reduced, the wiring area is greatly increased, the design range is widened, the circuit distribution mode is diversified, the overall horizontal area is reduced, the number of turns of winding is reduced, and difficulty of the winding process is greatly reduced.

Description

technical field [0001] The invention relates to a ceramic heating body, in particular to a ceramic heating body and a manufacturing method thereof. Background technique [0002] With the rapid development of low-temperature baking electronic cigarettes, the ceramic heating body, as the core component of electronic cigarettes, determines the overall performance level of electronic cigarettes. [0003] At present, the heating circuit and the temperature measuring circuit of the heating body are generally located on the same sheet, and the heating circuit and the temperature measuring circuit are mutually restricted in wiring, and the line width or routing method cannot be changed at will, which has certain restrictions on product resistance design. And because the heating circuit and the temperature measuring circuit are located on the same layer, short circuit is prone to occur, resulting in a short circuit between the two circuits. At the same time, due to the requirements ...

AI Technical Summary

Problems solved by technology

In order to ensure the smooth progress of injection molding, more viscose, plasticizer, etc. will be added to the porcelain clay, and the addition of these ingredients will cause the injected mandrel to have greater shrinkage than the wound sheet during sintering rate, it is very easy to cause cracks, voids and other defects inside the product after sintering

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