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Fabrication method of multi-layer printed circuit board (PCB) and multi-layer PCB

A manufacturing method and inner layer technology, which are applied in the directions of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of high-density interconnection PCB design of difficult-to-socket components, and achieve convenient high-density interconnection PCB, The effect of reducing manufacturing cost and increasing wiring area

Active Publication Date: 2015-11-25
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a multilayer PCB manufacturing method and multilayer PCB, to solve the problem that it is difficult to realize the high-density interconnection PCB design of jack components, increase the wiring area, and facilitate the manufacture of high-density interconnection of jack components. Connect PCB to reduce production cost

Method used

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  • Fabrication method of multi-layer printed circuit board (PCB) and multi-layer PCB
  • Fabrication method of multi-layer printed circuit board (PCB) and multi-layer PCB
  • Fabrication method of multi-layer printed circuit board (PCB) and multi-layer PCB

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Experimental program
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Embodiment 1

[0026] figure 2 It is a schematic flowchart of the manufacturing method of the multi-layer PCB provided by Embodiment 1 of the present invention. This method is suitable for making four-layer, six-layer and eight-layer multi-layer single-sided or double-sided PCBs, such as figure 1 As shown, the method includes:

[0027] Step 110 , respectively etching a first pad and a second pad on the first predetermined area on the top layer PCB and on the second predetermined area on the bottom PCB corresponding to the position of the first predetermined area.

[0028] Exemplarily, a plurality of PCBs with metal foils of a preset size are provided according to the customer's requirements, the graphics required by the customer are transferred to the PCB, the graphics include circuit graphics and pad graphics, and non-graphic parts are etched away. Specifically, on the first predetermined area on the top PCB and on the second predetermined area corresponding to the position of the first ...

Embodiment 2

[0045] image 3 It is a schematic diagram of the three-dimensional structure of the multilayer PCB provided by Embodiment 2 of the present invention. This embodiment takes a four-layer PCB as an example for illustration, as image 3 As shown, the multilayer PCB includes a top layer PCB20, an inner layer PCB22 and a bottom layer PCB21;

[0046] Wherein, the first preset area on the top layer PCB20 and the second preset area corresponding to the position of the first preset area on the bottom layer PCB21 are respectively etched with a first pad 23 and a second pad 24, the first pad 23 and the second pad 24 are used for soldering the pins of the jack element, or for soldering the pins of the jack element and the signal trace 25 connecting the layer where the first pad 23 and the second pad 24 are located, the first A first insulating gap 26 and a second insulating gap 27 are respectively formed around the pad 23 and the second pad 24;

[0047] Located on the inner layer PCB22,...

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Abstract

The invention discloses a fabrication method of a multi-layer printed circuit board (PCB) and the multi-layer PCB. The method comprises the following steps of: respectively etching a first bonding pad and a second bonding pad on a first preset region on the PCB at the top layer and a second preset region, corresponding to the first preset region, on the PCB at the bottom layer for welding jack component pins or welding the jack component pins and connecting signal wiring at the layer where the first bonding and the second bonding pad are located; etching a third bonding pad for connecting signal wiring of a conversion layer on a third preset region which is in correspondence to the first preset region and is on the conversion layer required for wiring on the PCB at the inner layer; etching the conversion layer which is not required for wiring on the PCB at the inner layer and a metal foil in a fourth preset region corresponding to the first preset region; and aligning the PCBs of all layers and laminating, drilling in the first preset region, the second preset region, the third preset region and the fourth preset region to form metallic through holes for installing a jack component in an inserted way. By the method, the problem of difficulty in achieving the design of a high-density interconnected PCB is solved, the fabrication of the high-density interconnected PCB is promoted, and the fabrication cost is reduced.

Description

technical field [0001] The invention relates to a multilayer PCB manufacturing technology, in particular to a multilayer PCB manufacturing method and a multilayer PCB. Background technique [0002] With the rapid development of smart electronic products and the rapid development trend of thinner and high-density structural layout design, the design of printed circuit boards (Printed Circuit Board, PCB) in products is also gradually developing towards the direction of high-density interconnection. High-density interconnect PCB layout design, especially multi-layer PCB design, needs to make full use of the effective area of ​​each corner on the PCB to meet the needs of multi-layer PCB tending to high-density design. [0003] At present, when the PCB of the jack component is produced, the pads on the top layer, the inner layer, and the bottom layer are all the same size, so when designing a multi-layer PCB, the pads on the inner layer will occupy the space of the PCB, especiall...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/40H05K1/11
CPCH05K1/111H05K3/40H05K3/4602H05K2201/09454H05K2201/095
Inventor 黄占肯
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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