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Method for compensating copper thickness of PCB (printed circuit board)

A kind of PCB board and compensation method technology, applied in electrical components, printed circuit manufacturing, printed circuit and other directions, can solve the problems of poor control of operation process, PCB board damage, easy formation of defective products, etc., to make up for uneven copper reduction, The effect of reducing the edge height and middle low and reducing the amount of use

Active Publication Date: 2015-05-20
SHENZHEN XINGDA PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing method for adjusting the thickness of the PCB board is physical grinding or single acid etching or micro-etching, such as a control method for the thickness of the insulating layer of the circuit board disclosed in the patent CN 102111967B. This method uses mechanical force for grinding. It is easy to cause physical damage to the PCB board, the operation process is not easy to control, and it is easy to form defective products during processing

Method used

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preparation example Construction

[0029] H used in the present invention 2 SO 4 - Hydrogen peroxide micro-etching solution is prepared by the following method: add 300 mL of 30% hydrogen peroxide to 600 mL of water, add 40 mL of concentrated sulfuric acid dropwise while stirring, and add water to make up to 1000 mL after cooling.

[0030] In the present invention, the cleaned PCB board is dried at 85-90 DEG C. If the drying temperature is low, the vapour volatilization is slow or the water vapor cannot be completely removed, and an oxide layer is easily formed on the surface again.

[0031] In the copper reduction operation of the present invention, the PCB board is sequentially subjected to pickling, H 2 SO 4 - Hydrogen peroxide micro-etching solution and Na 2 S 2 O 8 After the copper reduction operation of the micro-etching solution, the PCB board is turned upside down, and then subjected to the same pickling, H 2 SO 4 - Hydrogen peroxide micro-etch liquid and Na 2 S 2 O 8 The micro-etching operati...

Embodiment 1

[0040] 1) Pretreatment: Polish the PCB board to be treated to remove obvious impurities on the surface, and wash it with 5% sulfuric acid aqueous solution; 2 SO 4 - Hydrogen peroxide micro-etching solution to micro-etch the PCB board at 25°C for 30s, wash with double-distilled water after micro-etching, and dry at 85°C. The surface of the PCB board after pre-treatment is more fine, smooth and delicate, which effectively reduces the occurrence of copper plating surface defects.

[0041] 2) Replenishing plating: The forward and reverse pulse electroplating technology is used for repairing plating. The ratio of the plating time of the forward current to the plating time of the reverse current is 1:1, the forward current density is 20asd, and the reverse current density is 5asd. Plating for 30min, adding and subtracting copper thickness periodically and simultaneously, drying at 85 ℃. The forward and reverse pulse electroplating technology using this kind of copper-increasing an...

Embodiment 2

[0047] 1) Pre-treatment: Polish the PCB board to be treated to remove obvious impurities on the surface, and wash it with 10% sulfuric acid aqueous solution; 2 SO 4 - Hydrogen peroxide micro-etching solution to micro-etch the PCB board at 25°C for 20s, wash with ultrapure water after micro-etching, and dry at 90°C.

[0048] 2) Replenishing plating: Use forward and reverse pulse (PPR) electroplating technology for replenishment plating. The ratio of the plating time of the forward current to the plating time of the reverse current is 1:1, the forward current density is 20asd, and the reverse current density is 4asd, re-plating for 20min, adding and subtracting copper thickness periodically and simultaneously, drying at 90℃;

[0049] 3) Measure copper thickness: use Oxford CMI700 coating thickness gauge to test copper thickness, if the copper thickness of PCB board exceeds tolerance by less than 30%, re-plating;

[0050] 4) Copper reduction: The PCB board is sequentially clean...

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Abstract

The invention provides a method for compensating copper thickness of a PCB (printed circuit board). Forward and reverse pulse plating technology is adopted, so that the phenomenon that the edge of a copper surface of the PCB is high and the middle of the copper surface is low is effectively reduced. After copper reduction operation on the PCB for the first time, the PCB is turned upside down to be subjected to copper reduction, the defect of uneven copper reduction caused by time difference when the PCB enters acid etching liquid or micro etching liquid is effectively overcome. A milder micro etching liquid system is adopted and is organically combined with the acid etching technology, so that the processing efficiency on the copper thickness of the PCB is effectively improved.

Description

technical field [0001] The invention relates to a PCB board processing method, in particular to a method for compensating the copper thickness of the PCB board. Background technique [0002] PCB board is also called printed circuit board. If the actual thickness of the copper cladding of the PCB board exceeds the thickness deviation range specified by the relevant standards, it is called the thickness tolerance. GB4723-4725-92 specifies the relevant test methods. In order to adapt to the structure of tiny components, it is necessary to compensate for the thickness or defects of the PCB board, so as to prepare a PCB board with a line width that meets the requirements. The existing method for adjusting the thickness of the PCB board is physical grinding or single acid etching or micro-etching, such as a method for controlling the thickness of the circuit board insulation layer disclosed in the patent CN 102111967B, which uses mechanical force for grinding, It is easy to caus...

Claims

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Application Information

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IPC IPC(8): H05K3/00C25D5/18C23F1/18
Inventor 惠小平郑平夏甜甜谢永德郭妙华叶洪发韩涛
Owner SHENZHEN XINGDA PCB
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