A Compensation Method for PCB Copper Thickness

A technology of PCB board and compensation method, which is applied in electrical components, printed circuit manufacturing, printed circuit and other directions, can solve the problems of easy formation of defective products, poor control of operation process, damage of PCB board, etc., to reduce consumption and make up for copper reduction. Unevenness, reducing the effect of edge high and middle low

Active Publication Date: 2017-09-29
SHENZHEN XINGDA PCB
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing method for adjusting the thickness of the PCB board is physical grinding or single acid etching or micro-etching, such as a control method for the thickness of the insulating layer of the circuit board disclosed in the patent CN 102111967B. This method uses mechanical force for grinding. It is easy to cause physical damage to the PCB board, the operation process is not easy to control, and it is easy to form defective products during processing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0029] H used in the present invention 2 SO 4 - Hydrogen peroxide microetching solution is prepared by the following method: add 300 mL of 30% hydrogen peroxide to 600 mL of water, then add 40 mL of concentrated sulfuric acid dropwise while stirring, and add water to make up to 1000 mL after cooling.

[0030] In the present invention, the cleaned PCB board is dried at 85-90°C. If the drying temperature is low, the water vapor will volatilize slowly or the water vapor cannot be completely removed, and an oxide layer will easily form on the surface again.

[0031] In the copper reduction operation of the present invention, the PCB board is pickled successively for the first time, H 2 SO 4 - Hydrogen peroxide microetching solution and Na 2 S 2 o 8 After the copper reduction operation of the micro-etching liquid micro-etching, the PCB board is turned upside down, and then undergoes the same pickling, H 2 SO 4 - Hydrogen peroxide microetching solution microetching and Na 2 ...

Embodiment 1

[0040] 1) Pretreatment: the PCB board to be treated is polished to remove obvious impurities on the surface, and washed with 5% sulfuric acid aqueous solution; 2 SO 4 - Hydrogen peroxide microetching solution Microetch the PCB board to be treated at 25°C for 30s, wash with double distilled water after microetching, and dry at 85°C. After pre-treatment, the surface of the PCB board is finer, smoother and more delicate, which effectively reduces the occurrence of defects on the copper-plated surface.

[0041] 2) Replating: The forward and reverse pulse electroplating technology is used for replating. The ratio of the plating time of the forward current to the plating time of the reverse current is 1:1, the forward current density is 20asd, and the reverse current density is 5asd. Plating for 30 minutes, adding and subtracting copper thickness periodically and at the same time, drying at 85°C. Adopting the forward and reverse pulse electroplating technology of simultaneously in...

Embodiment 2

[0047] 1) Pre-treatment: the PCB board to be treated is polished to remove obvious impurities on the surface, and washed with 10% sulfuric acid aqueous solution; 2 SO 4 - Hydrogen peroxide microetching solution microetch the PCB board to be treated at 25°C for 20s, wash with ultrapure water after microetching, and dry at 90°C.

[0048] 2) Replating: Replating is carried out using forward and reverse pulse (PPR) electroplating technology. The ratio of the plating time of the forward current to the plating time of the reverse current is 1:1, the forward current density is 20asd, and the reverse current density is 4asd, re-plating for 20 minutes, adding and subtracting copper thickness periodically at the same time, drying at 90°C;

[0049] 3) Measuring copper thickness: use Oxford CMI700 type coating thickness gauge for copper thickness test, and re-plating if the copper thickness of PCB board is less than 30% out of tolerance;

[0050] 4) Copper reduction: PCB boards are wash...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a method for compensating the copper thickness of a PCB, which adopts forward and reverse pulse electroplating technology, and effectively reduces the phenomenon that the copper surface of the PCB is high at the edge and low at the middle. In the present invention, after the first copper reduction operation of the PCB board, the PCB board is turned upside down to perform a copper reduction operation, which effectively compensates for the uneven copper reduction caused by the time difference between the PCB board entering the acid etching solution or the micro etching solution. defect. The invention adopts a milder micro-etching liquid system, which is organically combined with the acid etching technology, and effectively improves the processing efficiency of the copper thickness of the PCB board.

Description

technical field [0001] The invention relates to a PCB board processing method, in particular to a method for compensating the copper thickness of the PCB board. Background technique [0002] PCB board is also called printed circuit board. If the actual thickness of the copper clad PCB board exceeds the thickness deviation range specified in the relevant standards, it is called thickness tolerance. GB4723-4725-92 stipulates the relevant test methods. In order to adapt to the structure of tiny components, it is necessary to compensate the thickness tolerance or defects of the PCB board to prepare a PCB board with a line width that meets the requirements. The existing method for adjusting the thickness of the PCB board is physical grinding or single acid etching or micro-etching, such as a control method for the thickness of the insulating layer of the circuit board disclosed in the patent CN 102111967B. This method uses mechanical force for grinding. It is easy to cause phys...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00C25D5/18C23F1/18
Inventor 惠小平郑平夏甜甜谢永德郭妙华叶洪发韩涛
Owner SHENZHEN XINGDA PCB
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap