38 results about "Microetching" patented technology

The utility model discloses a copper sulfate recovery machine, include: stirring device, including vertical jar, be located in the stirring paddle of vertical jar, drive the motor of stirring paddle agitates, the vertical jar inside holds microetching solution, the stirring paddle is used for stirring the microetching solution in the vertical jar, crystallization device, including annular board, set up in the cooling pipe of annular board inside, the radial outer surface of annular board with the radial inner surface of vertical jar is matched, the cooling pipe is along the circumferential spiral of annular board and extends, scrape out device, including annular scraper, drive the first power part of annular scraper and lift, the inboard of annular scraper with annular board is matched, the inboard of annular scraper holds the stirring paddle, the inboard of annular scraper moves downward to scrape out the crystalline body of annular board inboard. The utility model can solve the problem that the jar wall crystal of traditional equipment is difficult to fall off, and the continuous production efficiency is improved significantly.

The invention discloses a dry and wet film compounding process, and relates to the technical field of patterning etching processes, and the process comprises the following steps: carrying out chemical micro-etching treatment on the surface of a base material to form a nano-scale pore structure; laser is adopted to assist in slitting the dry film material to form narrow dry film sections, and plasma passivation treatment is carried out on the slitting edge; the method comprises the following steps of: preparing a narrow dry film section with a preset width, and subsequently or concurrently, uniformly coating a photosensitive oil film on the surface of a base material through a coating process so as to form a continuous wet film layer on the surface of the base material; the narrow dry film sections obtained by slitting are respectively attached to the opposite side parts of the wet film layer; and in the exposure process, accurate alignment of an exposure pattern and a predetermined etching area on the material is realized by identifying an alignment Mark point mark on the dry film. The method has the effect of conveniently and clearly displaying the Mark points on the wet film so as to realize accurate positioning.

The utility model discloses a galvanic effect test board for OSP micro-etching liquid. The galvanic effect test board comprises a test board body, 168 modules are arranged on the test board body; the module internally comprises a pattern A, a pattern B and a pattern C with different gold-copper ratios, each of the pattern A, the pattern B and the pattern C comprises a gold circle at the upper part and a copper circle A at the lower part, and the gold circles and the copper circles A are connected through copper wires; two independent copper circles B are arranged on two sides of each copper circle A; the area between the gold circle and the copper circle A is covered with an ink layer, and the copper wire is located below the ink layer.

Provided are: a conductive silver particle layer which does not undergo deterioration in conductivity due to damage in a micro-etching step, has high adhesion between a substrate and a circuit pattern, has little undercut, and has excellent design reproducibility; a method for manufacturing a laminate electrically connected to a circuit pattern capable of forming a wiring having a satisfactory rectangular cross-sectional shape as both surfaces or an inner layer of a circuit wiring, a method for manufacturing a circuit board, a printed wiring board, a package substrate, an interposer, and an electromagnetic wave shielding film. A method for producing a laminate in which a resin layer (B), a conductive plating base layer (C) containing a conductive substance (c2) and a dispersant (c1), and a copper layer (D) are laminated in this order on at least one surface of a support (A), the method having a step for selectively removing the copper layer (D) using an etching solution.

The application relates to the technical field of electrode foil manufacturing, in particular to a high-capacity carbon-titanium composite electrode foil and a manufacturing method thereof. The manufacturing method comprises the following steps: S1, pretreatment: after the aluminum foil is immersed in a mixed solution of 10% sulfuric acid and 0.5% hydrofluoric acid for 30s, the pretreatment step is completed; S2, micro-etching: the etching solution is heated to 45-55 DEG C, and the micro-etching is carried out under ultrasonic waves by using the etching solution, so that micropores with a pore diameter of 0.5-2 mu m are formed on the aluminum foil; after the etching is completed, the deionized water is used for washing, and the aluminum foil is dried at 80 DEG C, thereby obtaining the micro-etched aluminum foil; and S3, carbon-titanium active layer construction. The application provides a high-capacity carbon-titanium composite electrode foil and a manufacturing method thereof, so as to solve the problems that the thermal expansion coefficient difference between titanium and carbon material is large in the related art, the interface stress is easily concentrated, and the porous structure formed by micro-etching is easily cracked under the cyclic stress.

The present invention relates to a reactor comprising a vessel (1) for containing: ⋅a mass to be treated, and ⋅at least one lighting device (2a, 2b) intended to promote the treatment of said mass, characterized in that each lighting device (2a, 2b) comprises a light diffuser including at least one micro-etched plate (211) which is transparent to light radiation.

The invention discloses a pattern transfer and partition electroplating method for a PCB thick copper process and a product, and belongs to the field of PCB thick copper manufacturing, and the method comprises the following steps: S1, carrying out composite pretreatment on a PCB substrate, sequentially carrying out laser micro roughening, degreasing agent and activating solution treatment, and finally washing to be neutral; s2, depositing a transition layer on the surface of the pretreated substrate, and then forming an initial copper layer; s3, manufacturing an anti-corrosion pattern on the surface of the initial copper layer; s4, the substrate is put into the electroplating liquid, corresponding current densities are applied according to different pattern areas, and partition gradient thick copper electroplating is completed; s5, demolding, etching the initial copper layer and micro-etching the edge of the thick copper layer in sequence; and S6, performing surface cleaning after the stress of the heat-treated substrate is released. According to the method, ultraviolet laser micro coarsening and the nickel-phosphorus transition layer are synergistically and strongly combined to prevent delamination, the quality of the copper layer is improved through partition gradient electroplating and pulse crystal grain optimization, step-by-step exposure and current buffer strip design are adopted to control precision and reduce loss, and the qualified rate is improved through whole-process monitoring.

The application discloses a kind of tin sinking processes for chip packaging, it is related to surface treatment technical field, it includes the following steps: the copper surface of base material is carried out oil removal-water washing-microetching-water washing procedure, base material is placed in tin sinking solution and is carried out pre-soaking treatment, continue to soak and carry out chemical tin sinking treatment, place in the concentration of 40-60% tin sinking solution and carry out post tin sinking treatment, wash multiple times, obtain tin sinking plate after drying.Tin sinking solution includes: tin main salt 15-25g / L, sodium thiosulfate 80-120g / L, organic acid 8-15g / L, sulfuric acid 20-35ml / L, organic phosphonic acid 10-17g / L, cucumber extract 15-22ml / L, hydrophilic modified silica sol 2-5ml / L, gelatin 0.2-0.4g / L, surfactant 0.05-0.1g / L.The tin sinking process of the application is green and environmental protection, can improve coating quality and bath service life.

The application relates to the technical field of electroplating, and discloses a chromium electroplating process for improving the hardness of a connector terminal, which comprises the following steps: performing surface pretreatment on the connector terminal, removing surface impurities through ultrasonic cleaning and micro-etching treatment; performing heating treatment on the connector terminal; performing electroplating treatment on the connector terminal by using an electroplating solution comprising trivalent chromium salt, boron nitride nanoparticles, ferroferric oxide nanoparticles, nickel ions, sodium dichromate and chromium alloy additives, so as to form a chromium plating layer; performing passivation treatment on the plating layer; performing low-temperature treatment on the plating layer; and spraying a protective layer on the chromium plating layer. Through the trivalent chromium salt and the sodium dichromate, the trivalent chromium salt is used to reduce hexavalent chromium ions into trivalent chromium, the toxicity of the hexavalent chromium is reduced, the sodium dichromate is used to provide a stable chromium source, the deposition of chromium elements in the electroplating process is ensured, the pollution of hexavalent chromium to the environment and the harm of hexavalent chromium to the health of operators are solved, and the environmental protection and safety of the electroplating process are improved.

The invention discloses a substrate pretreatment process applied to an integrated electrode material, and belongs to the technical field of electrode material preparation. The process sequentially comprises the steps of substrate pretreatment, micro-etching, rough nickel deposition and embroidered ball array skeleton electrodeposition, and a micron-sized rough structure is constructed on the surface of a nickel-based porous substrate through micro-etching so as to provide more nucleation sites; on the basis that rough nickel is deposited on the rough surface of a base body, a compact amorphous metal nickel transition layer is formed, strong mechanical interlocking with the base body is achieved, and high corrosion resistance and high conductivity are achieved; and finally, growing a vertically-oriented nanowire array framework on the metal nickel transition layer by utilizing electro-deposition. Through the synergistic effect of micro-etching, rough nickel deposition and electro-deposition, a complete, stable and efficient three-dimensional conductive carrier from a macroscopic matrix to a microcosmic active skeleton is finally constructed, and the binding force between the integrated electrode material and the matrix, the interface stability and the mass transfer capacity are fundamentally improved.

The application discloses a kind of photovoltaic welding band and preparation method thereof, belong to photovoltaic material technical field.The method includes: in-situ chemical reduction preparation silver coating five silver nanometer reinforcing agent, silver nanoparticle uniform load forms core-shell structure;Ultrasonic-assisted smelting Sn-Bi-Ag-Cu quaternary solder master alloy;Copper band microetching forms Ra0.35-0.55 μm porous structure;Silane bridging hot-dip plating, control solder layer thickness 18-22 μm, staged cooling.Compared with prior art, the welding band tensile strength of the application is improved, the solder joint shear force is improved, the wet heat aging retention rate is in high position, the interface hole rate is reduced, the reliability and welding performance are significantly improved, and is suitable for high-efficiency photovoltaic module.

The invention relates to a method for improving hardness by evaporation coating, which is characterized in that immersion treatment is added between traditional continuous coating of an AR film and an AF film, the binding force and hardness are greatly improved, certain micro-etching treatment is carried out on the surface of glass, and a silicon dioxide auxiliary layer is plated to improve the adhesive force and light transmittance of subsequent coating.

The utility model discloses a PCB (printed circuit board) etching microetchant feeding device, which relates to the technical field of PCBs and comprises a supporting assembly, the supporting assembly comprises supporting plates, a top plate is fixedly connected between the tops of the left supporting plate and the right supporting plate, a working table and a supporting plate are fixedly connected between the inner walls of the left supporting plate and the right supporting plate, the working table is positioned below the supporting plate, and the supporting plate is positioned below the working table. According to the PCB etching microetchant feeding device, a controller is used for controlling opening and closing of a first electric valve, a second electric valve, a third electric valve, a fourth electric valve and a fifth electric valve, so that discharging and accumulation of solutions or reagents in the reaction barrel and the cleaning barrel are controlled; the micro-etching agent solution in the reaction barrel is blended through the cooperation of the liquid concentration detector and the medicine liquid concentration detection probe, so that timing replacement of the micro-etching agent solution in the reaction barrel and pure water in the cleaning barrel is realized.

This utility model discloses an etching device for photomask fabrication, belonging to the field of micro-etching equipment technology. It includes a mounting frame and a conveyor belt. Multiple sets of horizontal plates are symmetrically arranged above the mounting frame, and a drive roller is rotatably mounted between the two ends of each set of horizontal plates. The conveyor belt is rotatably sleeved onto the outside of the multiple drive rollers. Multiple support rods are symmetrically fixedly mounted on the inner wall of the mounting frame, and the ends of the support rods are respectively fixedly mounted to corresponding horizontal plates. Connecting rods are cross-mounted between the multiple horizontal plates. Multiple connecting plates are fixedly mounted on the outer wall of the conveyor belt. Connecting rods are fixedly mounted on the top surface of the connecting plates, and fixing plates are fixedly mounted on the ends of the multiple connecting rods. Two vertical plates are symmetrically fixedly mounted on the top surface of the fixing plates, and each of the two vertical plates has a slot on its opposite side. Compared with the prior art, this device can improve the etching efficiency of semiconductor circuit boards and further improve the etching effect of semiconductor circuit boards.

The application discloses a kind of RDL copper surface microstructure detailed processing method and system, for the problems such as grain coarsening, high surface roughness, poor process stability of traditional electroplating copper process, the method is realized optimization by four-step core process: first by micro-current cathode electrolytic cleaning, complex acid-based microetching and in-situ reduction complete synergistic pretreatment;Then controlled multi-pulse electroplating is carried out using a specific formula plating solution and "nucleation pulse-relaxation-growth pulse" multi-stage waveform, cooperate with flow field optimization;Subsequently implement in-situ infrared transient thermal annealing;Finally, the process parameters are dynamically adjusted by multi-module online monitoring and AI closed-loop feedback.The application can obtain equiaxed grain structure with an average grain size of <300 nm, the surface roughness of copper layer Ra≤10nm, significantly improve the electrical performance and process robustness (Cpk>1.67), while eliminating the post-polishing / long-time annealing step, optimizing the production cycle and cost, suitable for mass production.

The utility model belongs to the technical field of office teaching aids, discloses a back-coated white board with a matte anti-reflection function, and aims to solve the problems that a traditional white board is strong in reflection, easy to scratch, inconvenient to install and the like. The white board comprises a base material layer, a matte film layer and a wear-resistant protective layer are sequentially arranged on the front face of the base material layer in a stacked mode, a back glue layer is arranged on the back face of the base material layer, a release paper layer is compounded at the bottom end of the back glue layer, the matte film layer is formed by blending polyurethane modified acrylic resin and silicon dioxide particles, and the surface of the matte film layer is subjected to micro-etching treatment to form a diffuse reflection structure. The base material layer is of a honeycomb aluminum plate structure, the edge of the base material layer is coated with an ABS plastic frame, and magnetic strips are embedded in the base material layer. Through the design of the composite layer, low reflection, high wear resistance, light weight and convenience in installation are realized, and the composite layer is suitable for various scenes such as education, office and the like.

The invention belongs to the technical field of ultrathin planar transformers, and particularly relates to a method for manufacturing a thick copper PCB (printed circuit board) of an ultrathin planar transformer coil, which comprises the following steps of: pretreating a base material, selecting an epoxy resin PP (polypropylene) filled copper-clad plate as the base material, performing inner-layer pattern and micro-etching treatment on the surface of the base material, removing an oxide layer and forming a rough surface; the edge of the base material is polished, burrs are removed, and the flatness of the base material is optimized; and steel mesh printing: printing areas except the coil copper layer pattern on the surface of the pretreated base material by adopting a nano steel mesh vacuum printing process. The 2N-layer PCB is divided into two N-layer units for manufacturing, the flatness of the base material is improved in cooperation with ceramic polishing, the alignment error between layers is reduced, and the manufacturing difficulty is lowered; and interlayer bubbles are reduced by a vacuum glue filling process, and the multi-layer thick copper PCB can realize a more ultrathin design on the premise of not influencing the performance, so that the requirement of customers on the ultrathin thick copper of special products is met.

The invention relates to the technical field of coal machine hydraulic oil cylinder electroplating machining, and particularly discloses a pretreatment process for improving the binding force and corrosion resistance of a coating of a coal machine hydraulic oil cylinder. According to the method, the micro-etching procedure is embedded into the traditional pretreatment process of the coal machine hydraulic oil cylinder, the optimal procedure sequence of treatment is defined, a micro-etching liquid component and a parameter system matched with the coal machine hydraulic oil cylinder are obtained through optimization, accurate matching of the roughness variation and the coating performance is achieved, the application limitation of an existing micro-etching process on large parts is broken through, and the application range of the micro-etching process on the large parts is widened. The technical problem of microstructure reconstruction of the large hydraulic component is solved. And compared with a traditional process, on the premise that the equipment investment and the production complexity are not increased, the salt mist resistance time of the plating layer is greatly prolonged, and the plating layer binding force is greatly improved.

The utility model relates to the technical field of treatment equipment, in particular to micro-etching liquid treatment equipment convenient for copper recovery, which comprises an electrolytic tank, the side surface of the electrolytic tank is fixedly connected with an extension frame, and the front side and the rear side of the electrolytic tank are fixedly provided with electric guide rails through bolts. The device has the advantages that the power supply equipment is started to supply power to the anode bar and the cathode plate, at the moment, reduction reaction can occur on the outer surface of the copper frame, copper can be separated out on the copper frame, and after more metal copper is accumulated on the copper frame, the air cylinder is started to drive the lifting plate to move upwards until the copper frame ascends to a proper height; the support is conveyed to the position above the extension frame through the electric guide rail, at the moment, the collecting box can collect micro-etching liquid dripping on the copper frame, bolts for locking the copper frame are detached, the copper frame can be recycled, the copper frame and separated copper can be recycled, manual cleaning through physical means is not needed, and the cost is reduced. And the copper recovery rate can be improved.

The utility model discloses a novel straight -welding sampling assembly, include: FDC flexible circuit board, the FDC flexible circuit board is by the polyimide base material layer of thickness 25 50um, the copper foil conductive layer of thickness 12 35um and the polyester cover film of thickness 10 25um are constituteed, the conductive layer forms the circuit pattern through die -cut process, and the circuit width is 0.2 0.5mm in signal transmission area, is 1.0 3.0mm in power loop area, metal sampling branch, the metal sampling branch is made of copper material or aluminum material of purity >=99.9%, and the thickness is 0.3 1.0mm, and the connecting surface is formed roughness Ra = 1.0 2.0um's activated surface through chemical microetching treatment, laser fusion structure relates to the sampling application technical field of power battery and energy storage battery, through FDC as the transmission main body, through the design structure and laser type of copper branch and FDCLayout are changed, make copper branch and FDC through laser energy directly fuse in specific position, form the passage, this scheme does not have the tinning paste technology, reduced production cost, reduced quality risk.

A touch sensor includes first sensing electrode units formed in a first direction on a substrate, and second sensing electrode units formed in a second direction intersecting the first direction on the substrate. A plurality of micro-etching patterns are formed on boundaries of unit transparent electrodes constituting the first sensing electrode units and the second sensing electrode units. The unit transparent electrodes have shapes in which a portion of a curve connecting vertices of a polygon is removed, and adjacent unit transparent electrodes are electrically connected to each other. The touch sensor includes a segmentation pattern that divides the first sensing electrode units or the second sensing electrode units into two or more regions.

The invention discloses a cyclic regeneration process for extracting copper from sodium persulfate micro-etching waste liquid and a regeneration system thereof. The regeneration process comprises the following steps: collecting the micro-etching waste liquid: pumping the micro-etching waste liquid after micro-etching in a micro-etching production line into a micro-etching waste liquid collecting tank; the micro-etching waste liquid in the micro-etching waste liquid collecting tank is pumped into copper extraction electrolysis equipment for copper extraction electrolysis, copper metal is extracted, and low-copper waste liquid is obtained; the low-copper waste liquid is pumped into regenerative electrolysis equipment for regenerative electrolysis, so that the concentration of sodium persulfate is increased, and regenerative micro-etching liquid is obtained; and recycling the micro-etching liquid: adding the regenerated micro-etching liquid into a micro-etching production line for continuous use. The process provided by the invention can realize cyclic regeneration of the waste micro-etching liquid under a sulfuric acid-sodium persulfate system, achieves resource reutilization and clean production, has high etching rate, and can still maintain good operation and etching rate in a low-acid environment.

The invention discloses a printed circuit board chemical treatment device and method without an upper pressing roller, and relates to the field of printed circuit board production.The method comprises the following steps that S1, after a circuit board is fed, the circuit board is moved to a first-stage washing area through a lower conveying roller, and after the circuit board is moved to the first-stage washing area, the circuit board is conveyed to a second-stage washing area through a lower conveying roller; an upper spraying pipe, a lower spraying pipe, a front water blocking spraying pipe and a rear water blocking spraying pipe of the first-stage washing area spray water flow to clean the surface of the circuit board; and S2, moving the circuit board to a micro-etching area along with the lower conveying roller, performing micro-etching on the circuit board through chemical liquid medicine, and after micro-etching is completed. According to the invention, a water retaining roller is not needed for water retaining, so that residual objects on the water retaining roller are prevented from being adhered to fine lines or small through holes of the circuit board, adverse effects caused by open circuit and hole blockage are avoided, the yield of the circuit board is effectively improved on the premise that the circuit board is not damaged, and the use of the device is facilitated.

This invention discloses a low-etching copper surface roughening micro-etching solution and its application, belonging to the field of printed circuit board surface treatment technology. The roughening micro-etching solution comprises the following components at the following mass concentrations: divalent copper ions 5-24 g / L, chloride ions 35-70 g / L, inorganic acid 30-50 g / L, benzothiophene-pyridazinone metal roughening agent 0.05-0.07 g / L, sulfonated bipyridine carboxylic acid surfactant 0.8-1.2 g / L, oxidant 4-6 g / L, with the balance being water. This invention solves the problem of incompatibility between high etching rate and high morphology controllability and high signal integrity in existing technologies, and is particularly suitable for high-end precision PCB manufacturing such as IC substrates that require multiple roughening processes.

The utility model relates to a micro-etching waste liquid and copper sulfate waste liquid treatment device, which belongs to the technical field of waste liquid treatment devices and comprises a mounting box, a titanium anode and a titanium cathode are mounted in the mounting box, a placement box for placing dilute sulphuric acid is arranged on the upper surface of the mounting box, and a conductive rod is arranged at the upper end of the titanium cathode. A motor used for driving the titanium cathode is arranged at the bottom of the installation box, a mixing assembly is arranged on the conductive rod, an adjustable cleaning assembly used for cleaning the titanium cathode is arranged on the installation box, and a pump body is arranged on the surface of the installation box. Acid liquor spraying and scraper cleaning operation can be achieved, scales or sediments on the surface of the titanium cathode are effectively removed, cathode activity is maintained, the service life is prolonged, dilute sulfuric acid is stirred through the mixing assembly and the stirring blades, full contact of the acid liquor and the surface of the titanium cathode is promoted, the uniformity and efficiency of electrolytic reaction are enhanced, and the situation that the reaction effect is affected by local uneven concentration is avoided.

The invention discloses a photovoltaic solder strip and a preparation method thereof, and belongs to the technical field of photovoltaic materials. The method comprises the following steps: preparing a silver coating tantalum pentoxide nano reinforcing agent through in-situ chemical reduction, and uniformly loading silver nanoparticles to form a core-shell structure; the Sn-Bi-Ag-Cu quaternary solder master alloy is smelted under the assistance of ultrasonic waves; carrying out micro-etching on the copper strip to form a porous structure with Ra0.35-0.55 mu m; and carrying out silane bridging hot dipping, controlling the thickness of a welding layer to be 18-22 microns, and carrying out graded cooling. Compared with the prior art, the tensile strength of the solder strip is improved, the shearing force of a welding spot is improved, the damp-heat aging resistance retention rate is high, the interface void ratio is reduced, the reliability and the welding performance are remarkably improved, and the solder strip is suitable for efficient photovoltaic modules.

This application discloses a novel high-speed server FFC cable and its preparation method, relating to the field of flexible flat cable technology. The cable includes a pre-treated ultrathin conductor, a microporous dielectric layer, and a hot melt adhesive layer. The hot melt adhesive layer comprises 35-50 parts polyester resin, 10-18 parts polyolefin elastomer, 8-12 parts tackifying resin, 5-8 parts nano-silica, 2-4 parts boron nitride, 3-5 parts isocyanate curing agent, 0.05-0.1 parts catalyst, and 40-60 parts solvent. The microporous dielectric layer comprises 45-60 parts modified polyphenylene ether resin, 12-20 parts liquid crystal polymer, 8-15 parts hollow glass microspheres, 5-10 parts nano-silica, 3-6 parts compatibilizer, 0.8-2 parts foaming agent, 0.2-0.5 parts nucleating agent, 10-15 parts high-efficiency flame retardant, and 0.3-0.6 parts antioxidant. The pre-treated ultrathin conductor is obtained by surface micro-etching of copper foil followed by modified graphene treatment. The FFC line provided in this application features high-speed signal transmission, low loss, and high reliability.

The embodiment of the invention provides a modified polylactic acid non-woven fabric as well as a preparation method and application thereof. The method for preparing the modified polylactic acid non-woven fabric comprises the following steps: S1, mixing choline chloride and oxalic acid to obtain a eutectic solvent; s2, performing micro-etching on the polylactic acid non-woven fabric in a deep eutectic solvent to obtain a micro-etched polylactic acid non-woven fabric; s3, the micro-etched polylactic acid non-woven fabric makes contact with a chitosan quaternary ammonium salt aqueous solution, and the modified polylactic acid non-woven fabric is obtained. According to the preparation method, the hydrophilicity and the antibacterial property of the polylactic acid non-woven fabric are both improved, the hydrophilicity of the polylactic acid non-woven fabric is improved through the micro-etching effect of the eutectic solvent, and the polylactic acid non-woven fabric is endowed with the excellent antibacterial property through modification of the chitosan quaternary ammonium salt.

A glove including a wrist region; a palm region extending outwardly from the wrist region; a plurality of digit regions extending outwardly from the palm region, wherein each digit region of the plurality of digit regions has a longitudinal axis extending along the digit region from the tip of the digit region to the palm region; an interior cavity bounded and defined by the wrist region, the palm region, and the plurality of digit regions, wherein the interior cavity is accessible via an opening defined by the wrist region. A crotch area is provided between adjacent digit regions. At least one gripping zone is provided on at least one digit region. The gripping zone is oriented substantially parallel to the longitudinal axis of the at least one digit region. An exterior surface of at least one crotch area and at least one gripping zone is textured, particularly by micro-etching.

A surface functionalizing method for use in high-throughput in situ synthesis of nucleic acids by 3D inkjet printing. The method includes subjecting a surface of a substrate to hydroxyl enrichment treatment; adding hydrophobic molecules to the surface of the substrate, the hydrophobic molecules being not reactive with phosphoramidite monomers; spraying, by a multi-channel piezoelectric inkjet head assembly, an etching ink to a predetermined area on the surface of the substrate for micro-etching, the etching ink being prepared with a fluoride compound reactive with the hydrophobic molecules; and adding hydrophilic molecules to the surface of the substrate. By using the method, a functionalized surface with given areas being patterned can be formed on the surface of the substrate, and then a same multi-channel piezoelectric inkjet head assembly can be directly used for subsequent high-resolution printing of phosphoramidite monomers and synthesis of nucleic acids.