The invention relates to a microetching and roughening liquid for a copper surface. The microetching and roughening liquid comprises the following components by mass concentration: 5-50 g/L bivalent copper ions from a copper ion source, 20-150 g/L organic acid, 3-105 g/L chloride ions from a chloride ion source, a 0.0005-2 g/L water-soluble polymer and a 0.001-10 g/L pyridine derivative; a solventis water; the organic acid is at least one of formic acid, acetic acid, malic acid, citric acid, tartaric acid, edetic acid, iminodisuccinic acid, monochloro acetic acid, dichloroacetic acid and trichloroacetic acid; and the water-soluble polymer is a polymer of which a molecular chain contains a Imidazole or ammonium salt structure. The microetching and roughening liquid can form uniform roughening on the copper surface, is not affected by the crystal structure of the copper surface, and in the follow-up processes, can effectively increase the adhesive force of a solder-resist coating with which the copper surface is coated.