Treating agent and treating system for micro-etching surfaces of recyclable copper and copper alloys

A recycling and processing system technology, applied in the field of recyclable copper and copper alloy surface micro-etching treatment agents and processing systems, can solve the problems of limited comprehensive benefits, unsatisfactory, low support for technical upgrades, etc., to achieve increased Uniform roughness, good economic benefits, and the effect of recovering microetching ability

Inactive Publication Date: 2011-09-14
GUANGDONG SKYCHEM TECH LTD
View PDF4 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its shortcomings, one is partial recycling, the efficiency is not high, and the overall benefit is limited; the other is that it cannot meet the advanced surface treatment of copper and copper alloys required by the technological development of the semiconductor / chip / circuit board industry (the so-called ultra-roughening process ), low support for technology upgrades in the industry, and unattractive to high-end customers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Treating agent and treating system for micro-etching surfaces of recyclable copper and copper alloys
  • Treating agent and treating system for micro-etching surfaces of recyclable copper and copper alloys
  • Treating agent and treating system for micro-etching surfaces of recyclable copper and copper alloys

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] The copper surface treatment process is carried out on a circuit board, and the micro-etching treatment process system of the present invention is adopted. The workpiece to be processed is placed in the micro-etching work tank 10, that is, the recyclable copper and copper alloy micro-etching agent of the present invention is processed, and the micro-etching agent used is calculated by weight percentage and contains the following components :

[0057] Sulfuric acid 5%

[0058] Iron Sulfate 15%

[0059] Anionic fluorocarbon surfactant ( 1033D, Fluorinated Surfactant) 0.2%

[0060] Formic acid or acetic acid 0.2-2%

[0061] KI, NaBr or NaCl addition range can be 20-100ppm

[0062] Additives (sodium polydithiodipropane sulfonate, sodium 3-mercaptopropane sulfonate, sodium N, N-dimethyldithiocarbonylpropane sulfonate, inner salt of isothiourea propane sulfonate, 3-(benzothiazole -2-mercapto)-sodium propanesulfonate) or a mixture of two or more, the addition range can ...

Embodiment 2

[0075] The copper surface treatment process is carried out on a circuit board, and the micro-etching treatment process system of the present invention is adopted. The workpiece to be processed is placed in the micro-etching work tank 10, that is, the recyclable copper and copper alloy micro-etching agent of the present invention is processed, and the micro-etching agent used is calculated by weight percentage and includes the following groups: Minute:

[0076] Nitric acid 7%

[0077] Iron Nitrate 20%

[0078] Anionic fluorocarbon surfactant ( 1033D, Fluorinated Surfactant) 0.1%

[0079] Formic acid or acetic acid, the addition range can be 0.2-2%

[0080] KI, NaBr or NaCl, the addition range can be 20-100ppm

[0081] Additives (sodium polydithiodipropane sulfonate, sodium 3-mercaptopropane sulfonate, sodium N, N-dimethyldithiocarbonylpropane sulfonate, inner salt of isothiourea propane sulfonate, 3-(benzothiazole -2-mercapto)-sodium propanesulfonate) or a mixture of two...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a treating agent and treating system for micro-etching surfaces of recyclable copper and copper alloys. The treating agent comprises the following components by weight: 1-20% of sulfuric acid or/and nitric acid, 1.5-35% of ferric sulfate or/and ferric nitrate, 0.005-0.2% of anionic fluorinated surfactant, 0.005-5% of additive and the balance of deionized water. Besides, the treating system comprises a micro-etching working tank, an electrolytic drug regeneration and copper recovery system and an automatic control system for connecting the micro-etching working tank with the electrolytic recovery and regeneration tank and realizing automatic stable control. The circuit board micro-etching regenerative cycle process and equipment have the beneficial effects of reducing the production cost of the micro-etching process, improving the level of the process for micro-etching the surfaces of the copper and copper alloys and achieving the aims of cleaner production and zero emission.

Description

technical field [0001] The invention relates to a circuit board micro-etching recycling process, in particular to a recyclable copper and copper alloy surface micro-etching treatment agent and a treatment system. Background technique [0002] At present, China's electronics industry has entered a stage of rapid development, especially the semiconductor / chip / PCB industry. Due to the advantages in labor costs, industrial foundation, supporting industries and other related factors, the semiconductor / chip / PCB industry has rapidly transferred to the mainland. , this trend will become more pronounced in the next five to ten years. [0003] The entire semiconductor / chip / PCB circuit board production process includes dozens to hundreds of so-called dry and wet processes, which produce a large amount of waste liquid, waste gas and other pollutants. big negative impact. Especially in the process of semiconductor / chip / circuit board production, the surface treatment of line copper and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F1/08C23F1/46
Inventor 章晓冬刘江波
Owner GUANGDONG SKYCHEM TECH LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap