Device for regenerating waste microetching liquid and recovering copper

A recovery device and a technology for micro-etching liquid, which are applied in the field of regeneration and circulation of waste micro-etching liquid, can solve the problems such as failure to regenerate waste micro-etching liquid and copper recovery, unqualified workpiece quality, and inability of micro-etching effect to meet process requirements.

Inactive Publication Date: 2011-02-16
罗忠凯
View PDF2 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] To solve the regeneration cycle problem of the waste microetching solution, the concentration of copper ions in the regenerated microetching solution must be controlled at less than 5g/L. /L; if the concentration of each ion in the microetching solution is too high or too low, the microetching effect cannot

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for regenerating waste microetching liquid and recovering copper
  • Device for regenerating waste microetching liquid and recovering copper
  • Device for regenerating waste microetching liquid and recovering copper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] According to attached figure 1 As shown, a waste micro-etching solution regeneration and copper recovery device includes an overflow pipeline connected to the waste liquid storage tank 2 on the upper part of the side wall of the micro-etching tank 1, and the pipeline at the lower part of the side wall of the waste liquid storage tank 2 passes through the valve I3 and infusion pump I4 are connected to the hydrogen peroxide decomposition circulation tank 6, and the pipeline at the lower part of the side wall of the hydrogen peroxide decomposition circulation tank 6 is respectively connected to the hydrogen peroxide decomposer 22 and the electrowinning circulation tank 8 through the valve I3 and the infusion pump II7. The outlet pipeline of the hydrogen peroxide decomposer 22 is connected to the hydrogen peroxide decomposition circulation tank 6; the pipeline at the lower part of the side wall of the electrowinning circulation tank 8 is respectively connected to the electro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a device for regenerating waste microetching liquid and recovering copper. A processed workpiece is formed in a microetching groove by a workpiece to be processed of a circuit board; hydrogen peroxide and sulfuric acid solution are taken as microetching liquid in the process; copper oxide and minute quantity of metallic copper on the surface of the workpiece are removed to lead the concentration of microetching liquid copper ion to be increased into the waste microetching liquid; the remnant hydrogen peroxide in the waste microetching liquid is removed; the copper ion is electrodeposited as the metal copper; and the lost components in the microetching liquid are replenished to qualified microetching liquid which is returned to the regenerating cycle process of the microetching groove. The device overcomes the defects that the waste microetching liquid in the circuit board microetching process of the existing circuit board enterprises is only simply processed to be discharged immediately, the processing procedure has large wastes, and serious resource loss; and the device is suitable for the regenerating cycle of copper-containing waste microetching liquid of the circuit board and the copper recovering in the various circuit board production enterprises.

Description

technical field [0001] The invention relates to a regeneration cycle of waste micro-etching solution produced in the micro-etching process of a circuit board enterprise, in particular to a waste micro-etching solution regeneration and copper recovery device for a new process of energy saving and emission reduction and new technology application. Background technique [0002] For more than 20 years, especially in the past 10 years, the production capacity of my country's circuit board industry has grown at a rate of more than 20% every year. In 2009, it ranked first in the world, and its production capacity has reached 150 million m 2 . However, the pollutants in the circuit board industry are also increasing, and the waste of resources is gradually increasing. With the promulgation of the country's "Promotion of Production Law" and "Circular Economy Promotion Law", the requirements for the circuit board industry are getting higher and higher. Saving resources and reducing ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C25C1/12C23F1/46
CPCY02P10/20
Inventor 罗忠凯谢羽
Owner 罗忠凯
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products