The invention discloses a
semiconductor lead frame multi-point eccentric locking type
laser precision
welding device, which belongs to the field of
lead frame welding, and comprises a
machine table, an axial motion platform fixed at the upper end of the
machine table, and a
laser welding part fixedly connected to the moving end of the axial motion platform, the two sliding tables are symmetrically connected to the upper end of the
machine table in a sliding mode, and the eccentric locking parts are connected to the upper ends of the two sliding tables correspondingly;
inert gas with constant static pressure is conveyed to the back surface of the
lead frame through the exhaust port to form
air cushion support; upward supporting force generated by static pressure can accurately counteract gravity of
molten metal and downward spraying force generated by a
laser key hole, and the situation that
liquid copper liquid falls to form weld beading due to low
viscosity and fast heat conduction is prevented; non-contact physical constraint is generated on a
molten pool through fluid dynamics, so that on the premise that a workpiece pre-plating layer is not damaged, the morphology
consistency problem of the high-heat-conduction thin material in laser welding is solved, and interference of excess
weld metal and weld beading on the subsequent precision process is eliminated.