The invention relates to a preparation method of a nanoscale densified
tungsten-
copper alloy, which comprises the following steps: performing
chromium ion implantation on
tungsten powder, and then spraying a
copper-
titanium composite layer to obtain modified
tungsten powder; a certain
mass of modified tungsten
powder and
copper powder are mixed through an ultrasonic-assisted double-
planet mixer, and mixed powder is obtained; forming the mixed powder into a blank; and
sintering the
green body in vacuum to obtain the copper-
tungsten alloy. The modified tungsten powder is subjected to
chromium ion implantation to form a tungsten-
chromium solid solution, so that the surface activity and diffusivity of tungsten are improved, the problem of poor intersolubility of tungsten and copper is solved, and metallurgical reaction active sites are provided; ti-W and Ti-Cu phases are formed by
titanium in the copper-
titanium composite layer, an interface
transition layer is constructed, mechanical
occlusion is converted into metallurgical bonding, the interface strength is enhanced, the wettability is improved, and
liquid copper is assisted to fill gaps. The ultrasonic-assisted double-
planet mixer breaks nano powder agglomeration and enhances powder contact through vibration, revolution and autorotation to realize uniform mixing, and is matched with a copper-titanium composite layer to reduce copper-tungsten interface energy and ensure uniform components.