PCB (Polychlorinated Biphenyl) acidic etching solution
An acid etching solution and etching technology, applied in the field of PCB acid etching solution, can solve the problems of low etched circuit pattern accuracy, high HCl dosage, insufficient uniformity, etc., and achieve the benefits of production efficiency, simple preparation method, and reduced usage. Effect
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Embodiment 1
[0017] PCB acidic etching solution components and the content of each component are: etching mother liquid copper (copper chloride) 140g / L, hydrochloric acid (HCl content is 31%) 160g / L, NaClO 3 200g / L, sodium chloride 150g / L, urea 0.5g / L, potassium chloride 5g / L, sodium hydroxide 0.1g / L, and the rest is water.
[0018] This NaClO 3 The following reactions occurred during the acidic etching solution of the / HCl system:
[0019] 1. Copper corrosion reaction: Copper can exist in three oxidation states, metal copper CuO on the board surface, blue ion Cu in the etching bath 2+ , and the less common cuprous ion Cu + . Metallic copper CuO can be removed by Cu in the etching bath 2+ Oxidation and dissolution, see the following reaction formula (1)
[0020] 3Cu+3CuCl 2 →6CuCl-------------(1)
[0021] 2. Regeneration reaction: Metal copper CuO is etched by Cu in the bath solution 2+ Oxidation and dissolution, the resulting 2Cu + The oxidizing agent NaClO added to the etching b...
Embodiment 2
[0028] PCB acidic etching solution components and the content of each component are: etching mother liquid copper (copper chloride) 150g / L, hydrochloric acid (HCl content is 36%) 140g / L, NaClO 3 200g / L, urea 1.0g / L, thiourea 1g / L, sodium chloride 200g / L, potassium chloride 25g / L, sodium hydroxide 0.2g / L, and the rest is water.
[0029] All the other are with embodiment 1.
[0030] The PCB acidic etchant used in this embodiment can control the acid value of hydrochloric acid at 1.8N, which is much lower than the 2.5N of the prior art; the etching uniformity can reach 92%; the etching factor is 3.8. The stability of the etchant and the accuracy of the etched circuit pattern are effectively guaranteed, the speed of the etched circuit pattern is effectively improved, and the usage of HCl is effectively reduced.
Embodiment 3
[0032] PCB acidic etching solution components and the content of each component are: etching mother liquid copper (copper chloride) 160g / L, hydrochloric acid (HCl content is 31%) 200g / L, NaClO 3 250g / L, sodium chloride 150g / L, thiourea 0.5g / L, potassium chloride 15g / L, urea 0.5g / L and the rest is water.
[0033] Reaction process is with embodiment 1.
[0034] The PCB acidic etchant used in this embodiment can control the acid value of hydrochloric acid at 2.0N, much lower than the 2.5N of the prior art; the etching uniformity can reach 90%; the etching factor is 3.5. The stability of the etchant and the accuracy of the etched circuit pattern are effectively guaranteed, the speed of the etched circuit pattern is effectively improved, and the usage of HCl is effectively reduced.
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