This invention relates to a method, equipment, apparatus,
system, and
production line for
processing blind vias in multilayer glass substrates. The method includes: controlling a first
laser focusing spot to enter and focus inside the glass layer from a predetermined position on the upper surface of the glass layer, thereby modifying or micro-exploding the glass layer to form loose blind vias; chemically
etching the multilayer glass substrate with the loose blind vias to form second blind vias; and controlling a second
laser cleaning spot to
laser-process the insulating layer at the bottom of the second blind vias to form third blind vias. This invention uses a first laser focusing spot to process loose blind vias on the glass layer, making the glass in this area porous, increasing the contact area with the chemical
etching solution, and thus accelerating the
etching speed. Simultaneously, the first laser focusing spot modifies or micro-explodes the glass layer, and the glass within the loose blind vias is annealed by heat, further improving the etching efficiency.