Electrochemical processing method for micro-structure of P type silicon surface

Abstract

The invention provides an electro-chemical processing method of a P-typed silicon surface micro-structure, relating to the processing of silicon surface. The invention provides a novel electro-chemical processing method which has low cost and simple processing steps, does not have complex processes such as mask lithography, etc., and with micro-structure etched and is processed on the surface of the P-typed silicon in one-step. The electro-chemical processing method comprises the steps that: the micro-structure on an original mother blank is transferred onto a gelose surface and then dipped in electrolyte, so as to gain the gelose gel template with the stored electrolyte; the gelose gel template is then arranged in an electrolytic cell, the micro-structure part of which is exposed on the liquid surface; a Pt layer is splashed on the back surface by the P-typed silicon through a front disposal to form an ohm contact; a polished surface is then arranged on the surface of the gelose gel template; the P-typed silicon sheet is taken as a working electrode and the electro-chemical polishing micro-processing is carried out to the P-typed silicon sheet; the micro-structure on the gelose gel template is transferred on the surface of the P-typed silicon by the electro-chemical polishing micro-processing to gain the P-typed silicon sheet with the micro-structure and the P-typed silicon sheet with the micro-structure is separated from the gelose.

Description

technical field [0001] The present invention relates to the processing of a silicon surface, in particular to an agarose gel template which can store electrolyte and have a microstructure combined with electrochemical polishing technology, and obtain a large-area microstructure on the p-type silicon surface by one-time replication processing A novel electrochemical machining method and its device. Background technique [0002] Silicon has become the most important basic material in microelectronics and microsystem technology because of its excellent electronic properties, mechanical and chemical properties, and it is also the most profoundly understood material so far. At present, silicon has been widely used in the microelectronics industry, and is playing an increasingly important role in the development of microsystem technology (Wang Chunhai, Yu Jie, et al. Translated. Microsystem Technology. Beijing: Chemical Industry Press, 2003). [0003] Silicon surface micromachini...

AI Technical Summary

Problems solved by technology

This method is a maskless high-resolution etching method that can be used for the replication processing of three-dimensional microstructures, but its main disadvantage is that the processing rate is very slow, only 2nm / h, which determines that this technology is difficult be widely applied

[0010] In summary, so far, there is no low-cost, simple process, and suitable for the preparation of three-dimensional microstructures on silicon surfaces.

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