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Method for fabricating smei-cylindrical groove by shadow evaporation and wet etching

A semi-cylindrical, wet etching technology, which is applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of high cost and processing area of ​​only micron level, and reduce the production cost , the effect of efficient processing pathways

Inactive Publication Date: 2011-08-03
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although direct writing equipment such as electron beams and ion beams can produce patterns of this size, they are expensive and the processing area is only on the order of microns, which is difficult to meet the needs of practical applications

Method used

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  • Method for fabricating smei-cylindrical groove by shadow evaporation and wet etching
  • Method for fabricating smei-cylindrical groove by shadow evaporation and wet etching
  • Method for fabricating smei-cylindrical groove by shadow evaporation and wet etching

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Embodiment 1, making 5000 semi-cylindrical grooves with a diameter of 1 micron and a length of 20 mm, the specific manufacturing process is as follows:

[0044] (1) A quartz plate with a thickness of 365 microns is selected as the substrate; a 50nm thick chromium masking film is deposited on the substrate surface by magnetron sputtering technology, and a photoresist with a thickness of 100nm is coated on the chromium film.

[0045] (2) By exposing and developing, prepare such as on the photoresist image 3 The straight line structure shown; the straight line structure contains 5000 parallel straight lines with a width of 2 microns, a pitch of 1 micron, and a period, that is, the sum of the width and the pitch of 3 microns, and the length of the straight lines is 20 mm.

[0046](3) Gold is vapor-deposited obliquely at an angle of 45 degrees relative to the substrate plane. The thickness of the evaporated gold is 50 nm, and the edge of each photoresist line will form a re...

Embodiment 2

[0049] Embodiment 2, making 20,000 semi-cylindrical grooves with a diameter of 100 nm and a length of 5 mm, the specific manufacturing process is as follows:

[0050] (1) Select a K9 glass sheet with a thickness of 500 microns as the substrate; use magnetron sputtering technology to deposit a 20nm thick silicon masking film layer on the substrate surface, and coat a photoresist with a thickness of 50nm on the silicon film .

[0051] (2) By exposing and developing, prepare such as on the photoresist Figure 9 In the line structure shown, the period of the line structure is 500 nm, and the length of the line is 5 mm.

[0052] (3) Evaporate chromium at an angle of 20 degrees relative to the substrate plane, the thickness of the evaporated chromium is 30nm, and the edge of each photoresist line will form a region with a width of 20nm where no chromium is deposited as an evaporation material.

[0053] (4) Then dry-etch the silicon masking film layer with the vapor-deposition mate...

Embodiment 3

[0055] Embodiment 3, making 2 semi-cylindrical grooves with a diameter of 10 microns and a length of 500 microns, the specific manufacturing process is as follows:

[0056] (1) A quartz plate with a thickness of 1000 microns is selected as the substrate; a 400nm thick silicon masking film is deposited on the surface of the substrate by magnetron sputtering technology, and a photoresist with a thickness of 1000nm is coated on the silicon film.

[0057] (2) By exposing and developing, prepare such as on the photoresist Figure 15 The line structure shown; the line structure contains two photoresist lines with a width of 15 microns and a length of 500 microns. The distance between the two photoresist lines is 5 microns, and the rest of the substrate is removed. Engraving.

[0058] (3) Chromium is evaporated at an angle of 30 degrees relative to the substrate plane, the thickness of the evaporated chromium is 100nm, and a 500nm wide area without chromium deposited on the edge of ...

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Abstract

The invention relates to a method for fabricating a smei-cylindrical groove by shadow evaporation coating and wet etching, comprising the following steps: using the conventional technology to deposit a mask membrane layer on a substrate, coating photoresist on the mask membrane layer; preparing line structures on the photoresist by the photoetching technology; carrying out oblique evaporation at a certain angle; forming a bar of shadow region which is of a certain width and free from deposit evaporation material outside the edge of each photoresist line; then using evaporation material as a protection layer to carry out dry etching on the mask membrane layer, wherein the mask membrane layer at the shadow region is corroded in the absence of the protection of the evaporation material, so that a mask membrane layer slit corresponding to the shadow region is obtained; carrying out isotropic etching on the substrate by dilute hydrofluoric acid solution through the mask membrane layer slitand then obtaining the smei-cylindrical groove at the surface of the substrate. In the method of the invention, the mask membrane layer slit with a width ranging from 20 nanometers to 20 micrometers can be fabricated in large areas without expensive devices such as electron beam device and ion beam device and the like; and on the basis, the smei-cylindrical groove with a diameter ranging from 100nanometers to 10 micrometers can be obtained.

Description

technical field [0001] The invention relates to a method for preparing a semi-cylindrical groove, in particular to a method for preparing a semi-cylindrical groove by using shadow evaporation and wet etching. technical background [0002] Micro / nano components, especially micro / nano optical components, have great application potential in scientific research, military, civil and other fields. The fabrication of micron and submicron semi-cylindrical grooves is a difficult research point. Semi-cylindrical grooves are the basis for preparing some micro / nano optical elements with complex structures. Semi-cylindrical grooves have broad application prospects, for example, in super-resolution imaging, SPP nanolithography, and so on. [0003] The preparation method of semi-cylindrical grooves is gray-scale exposure etching, which utilizes the different exposure doses of photoresists in different areas to make the structural pattern in the exposed area reach the required shape, and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/04C23C14/24C23C14/16C23C14/18C23F1/02
Inventor 罗先刚刘凯鹏王长涛潘丽刘玲刘尧邢卉
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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