37 results about "Direct writing" patented technology

The application provides a hot-melt direct-writing heating system and a metal-melting direct-writing forming method. The hot-melt direct-writing heating system comprises a barrel exhaust mechanism (1), a feeding heating system and a printing substrate heating system (2). The feeding heating system comprises a barrel heating mechanism (4) for heating a barrel (3) and a needle heating mechanism (5) for heating a direct-writing needle (6). The printing substrate heating system comprises a suction disc (21), a suction disc heating mechanism (22) and a cooling mechanism (23) for cooling the suction disc heating mechanism in sequence. The suction disc comprises a suction disc surface (211) and a high-temperature-resistant fixing ring (212) arranged along the circumference of the suction disc surface. The suction disc surface is uniformly provided with a plurality of micropores. The application independently designs two heating sources to heat the barrel and the direct-writing needle respectively, and the barrel exhaust mechanism exhausts all oxygen. The micropores arranged on the suction disc surface can uniformly distribute the vacuum on the suction disc surface, thereby improving the adsorption uniformity.

The present application relates to the technical field of additive manufacturing, and particularly relates to a self-compensation printing head and method, an extrusion direct writing device and a working method. The printing head comprises a shell, a barrel, a screw and a self-compensation assembly; the lower part of the shell has a cavity, the barrel is rotatably installed in the cavity, and the screw is installed in the barrel for extruding material; the self-compensation assembly comprises an outer magnetic pole, an inner magnetic pole and a potentiometer, the outer magnetic pole is arranged on the inner wall of the cavity of the shell, the inner magnetic pole is arranged on the outer wall of the barrel and is arranged in the same polarity opposite to the outer magnetic pole, and the potentiometer is also installed on the barrel; the magnetic force of the outer magnetic pole and the inner magnetic pole makes the barrel at an initial angle, and when the material shear force increases, the magnetic force is overcome to drive the barrel and the potentiometer to rotate. According to the present application, the screw rotating speed can be automatically adjusted in real time according to the change of the material shear force, the stable control of the extrusion amount of different materials is realized, and the precision, quality and efficiency of multi-material direct writing forming are improved.

This invention belongs to the field of cemented carbide additive manufacturing technology and discloses a method for preparing a high-solids WC-Co water-based slurry for direct-write forming. The invention uses cobalt-coated tungsten carbide powder as the solid phase, which is dispersed in an aqueous solution of ammonium citrate and polyethylene glycol composite additives to obtain a WC-Co water-based slurry with a solid content of 90wt%~93wt%. The slurry of this invention exhibits good shear-thinning properties and extrusion shape retention, with a total dispersant dosage of only 1~1.2wt%. After direct-write 3D printing and debinding sintering, a density ≥99% and a Vickers hardness >1900HV can be obtained. 30 The complex structure of WC-Co cemented carbide components is suitable for the low-cost preparation of high-performance cemented carbide in industrial applications.

The invention relates to an automated method and system for solar panel repair, wherein the method comprises: a) detecting, using at least one detection means, at least one defective cell in at least one solar panel; b) making at least one incision, using at least one cutting means, in the rear face of at the least one solar panel to expose the contacts of the at least one defective cell; c) printing on the rear face of the at least one solar panel, using at least one direct writing means with ink, at least one marking comprising at least one compound containing at least one metallic element with a load of at least 80%, following a random pattern to short-circuit the at least one defective cell; d) sintering the at least one marking, using at least one energy application means, thereby transforming the marking into at least one metallic circuit; and e) encapsulating the at least one printed circuit, using at least one encapsulating means, which applies at least one insulating element.

The application belongs to the field of additive manufacturing, and specifically discloses a 3D printing and mechanical processing composite manufacturing system and a workpiece manufacturing method. The composite manufacturing system comprises a servo turntable, a first mechanical arm, an additive manufacturing module integrated at the tail end of the first mechanical arm for forming a solid member on the servo turntable, the additive manufacturing module comprising a direct writing forming nozzle and at least one fused deposition forming nozzle, a second mechanical arm, a subtractive and detection module integrated at the tail end of the second mechanical arm for 3D scanning and milling processing of the solid member, the subtractive and detection module comprising a 3D scanning device and a mechanical milling device, and a control module electrically connected with the servo turntable, the first mechanical arm, the additive manufacturing module, the second mechanical arm and the subtractive and detection module. The application can solve the technical problem that heat-sensitive non-metallic members are difficult to balance between efficient forming and high-precision processing, effectively improves the functional integration level of the equipment, and simplifies the manufacturing process of multifunctional members.

The application provides a three-dimensional special-shaped light waveguide laser direct writing method and system, and relates to the technical field of laser.The method comprises the following steps: based on an initial topography control vector, cooperative calculation and optimization are performed through a preset process model, the process model is integrated with a material response database, a slit transfer function model and a scanning superposition model, so that a cooperative control instruction set for each path point is generated, and the instruction set accurately specifies the states that need to be synchronously reached by a polarization control unit, an electric slit mechanism and a laser power module when laser reaches each path point; a three-dimensional displacement platform is driven to scan along a path point sequence, and a topography cooperative controller performs interpolation calculation on the instructions of adjacent path points in the cooperative control instruction set according to real-time position feedback of the platform.The application can actively design the waveguide cross section geometry topography and accurately realize it in three-dimensional space.

This invention discloses a circuit system and exposure method for electron beam direct writing exposure. The circuit system includes a pattern generator, a workpiece stage control system, a beam current detection module, a deflection control module, a beam gate control module, and a dynamic astigmatism correction module. The pattern generator fills the pattern to be exposed into the exposure path and sends the exposure path and / or control commands to each module. The workpiece stage control system drives the workpiece stage to move. The beam current detection module detects the beam current value of the electron beam. The deflection control module controls the deflection of the electron beam. The beam gate control module controls the opening and closing of the electron beam according to the control commands from the pattern generator. The dynamic astigmatism correction module adjusts the astigmatism and focus of the electron beam according to the control commands sent by the pattern generator. This invention significantly improves exposure efficiency while ensuring the accuracy and quality of the pattern, thus increasing the writing rate and exposure efficiency.

The present application provides a method for improving throughput of lithography at lower resolutions in substrate fabrication. The disclosure utilizes combining photolithography with direct writing lithography in substrate fabrication. The method comprises of, exposing with photolithography equipment circuit patterns on a substrate of at least one-micron resolution and larger in a photoresist, wherein the field size is at least 50 mm by 50 mm; and exposing with direct writing lithography equipment on the substrate circuit patterns less than at least one-micron resolution and smaller.

This invention relates to the fields of 3D printing technology and additive manufacturing technology for electronic circuits, specifically to a method for printing circuits by direct writing circuitry using molten solder on inverted surface mount components. The method includes: Step S1, printing a contoured positioning groove with the opening facing downwards and the bottom of the groove facing upwards, featuring elastic clips, and a through-hole extending upwards from the bottom of the contoured positioning groove; the surface mount component is inverted and embedded into the contoured positioning groove, secured without adhesive by the elastic clips, with the surface mount component contacts facing upwards and aligned with the lower end of the through-hole; Step S2, printing an insulating base surface with a stress-relieving structure, the insulating base surface having a through-hole penetrating the through-hole, and the through-hole being provided with an insulating perimeter; Step S3, forming gravity-bonded molten solder pillars and directly writing the circuitry; Step S4, non-contact insulating encapsulation; Step S5, post-processing after thermal collapse. This invention solves the problems of existing desktop circuit prototyping technologies, such as inability to adapt to surface mount components, inability to stack multiple layers, need for manual intervention, low reliability, and high cost.

This invention relates to the field of additive manufacturing technology, and particularly to an integrated multi-channel pneumatically driven ink-to-ink 3D printing head and its printing equipment. It includes multiple material storage chambers, each with a pressure inlet and a return port on its top cover, and a servo motor fixedly mounted thereon. The output shaft of the servo motor rotatably passes through the top cover and is fixedly connected to a screw located inside the material storage chamber. A movable plate is threadedly connected to the screw and slidably disposed within the material storage chamber, with multiple ventilation holes on the movable plate. Below the movable plate, a pneumatic plate is sleeved on the screw and slidably disposed within the material storage chamber. Nozzles at the bottom of the multiple material storage chambers are fixedly connected to a manifold. This invention innovatively integrates a dual-drive structure of pneumatic extrusion and mechanical screw extrusion, achieving multi-channel collaborative feeding printing, effectively solving industry pain points such as low forming efficiency, poor ink compatibility, easy clogging, weak output stability, and cumbersome material switching in existing direct-write printing equipment.

The application discloses a multi-material direct writing multifunctional integrated working system, which comprises a motion platform module, a direct writing module, a grinding and cutting assembly module and a control module. The motion platform module is provided with a visual monitoring assembly. The visual monitoring assembly is used for acquiring image information of an object to be processed and sending the image information to the control module. The control module generates a processing path according to the image information and controls the motion platform module, the direct writing module and the grinding and cutting assembly module to work cooperatively, so as to realize integrated processing of three-dimensional reconstruction, direct writing processing and grinding processing of the object to be processed. The direct writing module is matched with a push rod raw material supply group through a material mixer. After at least two raw materials are mixed, the raw materials are delivered to a direct writing head. The application can reduce repeated positioning errors caused by the transfer of the object to be processed between different devices, improve the trajectory adaptation capability of complex curved surfaces or individual difference objects, and is suitable for nail repair, printing of metal, resin, ceramic and other multi-material direct writing processing scenes.

This invention discloses a method for direct writing micropillar structures using near-field electrospun beaded fibers. In this method, magnetic domain-dependent metal particles are added to the spinning solution to form a uniform beaded structure. The micropillar structure can be prepared in one step by utilizing the electrostatic repulsion and jet attraction between the beads. During the electrostatic jet process, the charge is carried by the beaded fibers, and the liquid droplets carrying the same charge repel each other. After the beaded fibers are deposited on the receiving plate, they are polarized under the action of a high-voltage electric field, carrying a positive charge and attracting liquid droplets carrying the opposite charge from the air jet. Upon contact, the liquid droplets fuse together under the action of surface tension, and then continue to attract the jet deposition to form the micropillar structure. This method solves the problems of high cost, expensive equipment, and complex preparation processes associated with traditional micropillar processing methods. Furthermore, this method can be widely used for various electrojet direct writing materials.

The application provides a GLV multi-beam direct writing path planning method and system for holographic anti-counterfeiting, and the method comprises the following steps: acquiring model analysis depth information and discretizing the model analysis depth information into an initial feature matrix; evaluating a thermal diffusion cumulative amount to establish a physical threshold model, performing truncation and energy compensation on a dense area exceeding the threshold to generate a thermal equilibrium distribution matrix; extracting residual energy features of a splicing overlap area, constructing a semi-variance function to generate a spatial variation convolution kernel for smoothing operation to generate a reference exposure control sequence; establishing and solving a compensation model related to power, speed and depth to generate a control sequence snapshot; and collecting an instantaneous mechanical speed matching snapshot in real time to drive direct writing. The application effectively improves the machining precision and restoration degree of the holographic anti-counterfeiting topography.

This invention discloses a bimetallic matrix composite material with a three-dimensional interpenetrating structure and its preparation method, belonging to the technical field of metal matrix composites. It addresses the technical problems of traditional processes' inability to precisely control the spatial configuration of the reinforcement and the insufficient comprehensive mechanical properties of composite materials. The preparation of the bimetallic matrix composite material includes the following steps: mixing skeleton metal powder, dispersant, and solvent to obtain a metal molding slurry; extruding and printing the metal molding slurry according to a preset three-dimensional mesh model using ink direct writing technology, layer by layer to obtain a metal skeleton preform; freeze-drying the metal skeleton preform, followed by sintering to obtain a porous metal skeleton; placing a filler metal on top of the porous skeleton metal, and obtaining the bimetallic matrix composite material using a melt infiltration method. In this invention, molten Mg reacts in situ with Ni and Cu elements within the skeleton during the infiltration process, generating a hard Mg-Ni-Cu intermetallic compound. The resulting composite material has extremely low porosity, exhibiting excellent compressive strength (up to 289 MPa), flexural strength, and fracture toughness, achieving a synergistic gain of lightweight and high strength and toughness.

The application discloses a kind of optical computing chip development board, the optical computing chip development board is directly acted on phase change material using laser direct writing technology to realize reconfigurable optical waveguide network and custom direct writing device, and can realize laser accurate erasing, to more flexible, accurate realization of the line adjustment between different tunable application-specific integrated optical path module and custom direct writing device, or reconfiguration to custom direct writing device, to facilitate the required linear domain operation and nonlinear domain operation of collaborative execution.

The present application provides a method for improving throughput of lithography at lower resolutions in substrate fabrication. The disclosure utilizes combining photolithography with direct writing lithography in substrate fabrication. The method comprises of, exposing with photolithography equipment circuit patterns on a substrate of at least one-micron resolution and larger in a photoresist, wherein the field size is at least 50 mm by 50 mm; and exposing with direct writing lithography equipment on the substrate circuit patterns less than at least one-micron resolution and smaller.

This invention discloses a method for improving the density of flexible copper circuits through laser direct writing, belonging to the field of flexible electronics manufacturing technology. The method includes: preparing a precursor layer on the surface of a cleaned and fixed target substrate using a precursor, wherein the precursor includes a reducing copper ion solution; irradiating the precursor layer with a focused laser to perform laser direct writing, forming a monolayer copper microstructure; repeating the above steps until the copper microstructure is stacked layer by layer to a preset thickness; cleaning the sample surface to remove unreacted residual precursor, obtaining a high-density copper microstructure. This invention, under limited laser energy input, matches the optical penetration depth with the precursor thickness, avoiding thermal damage to the substrate while obtaining a monolayer copper microstructure; employing a layer-by-layer stacking direct writing strategy, the newly added precursor penetrates into the previously formed copper microstructure, forming new nano-copper particles to fill the pores under the action of the laser again, effectively improving the final structure density.

The application discloses a kind of complex surface-oriented mechanical arm conformal direct writing trajectory planning method, belong to the cross field of additive manufacturing and industrial robot motion control.The method first obtains the two-dimensional target pattern to be printed and the three-dimensional curved surface substrate of printing the two-dimensional target pattern, generates conformal path;Then based on conformal path, the pose point set of the end effector of mechanical arm is obtained, and then the parametric pose fitting equation is generated;Finally, based on parametric pose fitting equation and preset attitude weight coefficient, the generalized arc length model corresponding to the running track of the end effector of mechanical arm is constructed;Again based on generalized arc length model, the total interpolation point number required for the end effector to complete two-dimensional target pattern printing is obtained, and finally based on total interpolation point number, generalized arc length model and parametric pose fitting equation, the running track sequence of the end effector of mechanical arm is obtained.The present application significantly improves the forming precision of conformal manufacturing.

1. The name of the design product: direct writing exposure machine. 2. The use of the design product: mainly used for wafer production and processing. 3. The design points of the design product: the combination of shape and pattern. 4. The picture or photo that best indicates the design points: perspective drawing.

The application relates to the field of micro-nano processing technology and discloses a high-order gray exposure control method and device for a direct writing type photoetching machine, which comprises the following steps: obtaining N-bit gray data to be exposed, wherein N is greater than or equal to 10; illuminating the DMD through an illumination light path unit, wherein the illumination light path unit comprises an illumination adjusting element, the illumination adjusting element is configured to generate a non-uniform light intensity distribution on the DMD, so that different regions of the DMD have different light intensities; generating multiple frames of control data for controlling a micromirror array of the DMD according to the N-bit gray data; loading the multiple frames of control data to the DMD, so that data of different weight bits in the N-bit gray data is distributed to different regions of the DMD for exposure display in a scanning exposure process; wherein data of higher weight bits is distributed to regions with lower light intensity on the DMD for exposure display. The direct writing type photoetching machine can stably realize high-quality exposure of 1024 gray scales and above.

The present application relates to a kind of shell sand mold fine structure low-temperature direct writing in-situ solidification additive manufacturing method and device, the device includes shell, gas tank, electromagnetic valve, air inlet pump, refrigeration air conditioner, exhaust pump, z-axis servo motor, water cooling pipeline, screw, print head, print head support, x-axis servo motor, printing platform, semiconductor refrigerator, printing bottom plate, y-axis servo motor.The present application is based on direct writing additive manufacturing method, according to the digital model of casting, design the shell model attached to the surface of casting, according to the designed shell model, in low temperature, dry environment, through print head, sand, water mixture is deposited to forming position, wherein water is quickly solidified into shape under low temperature, after layer printing, finally form the designed shell.The present application is high in forming precision, flexible in manufacturing, low in equipment cost, and the shell sand mold manufactured is green and environmentally friendly.

This invention provides a method for the flexible fabrication of multi-morphological three-dimensional metal microcone structures induced by femtosecond lasers, comprising the following steps: Step 1: fabricating a metal film layer; Step 2: setting the single-pulse energy of the femtosecond laser beam according to the morphology and size of the target multi-morphological three-dimensional microcone structure, and pre-setting the target spot morphology and spatial energy distribution of the focused processing beam; Step 3: activating the femtosecond laser source, the femtosecond laser beam being shaped by a beam modulation and focusing module, and focusing on irradiating the upper surface of the metal film layer to induce the generation of the target multi-morphological three-dimensional microcone structure; wherein, the laser single-pulse energy density is lower than the metal film layer ablation threshold. This invention uses single-pulse energy and spot morphology as control means, the single-pulse energy determines the height and overall size of the microcone, and the spot energy distribution determines the shape of the microcone. It achieves customized and controllable fabrication of various multi-morphological three-dimensional microcone structures on the metal film surface through direct writing, with high freedom of morphology control, adapting to the structural requirements of different functional devices.

This invention discloses a 3D printing method and apparatus for the integrated molding of heterogeneous multi-component components, specifically relating to the fields of advanced manufacturing and intelligent microsystems technology. This invention overcomes the limitations of traditional multi-material 3D printing, which can only integrate electronic components and cannot embed drivers. It employs a dual-mode embedding method combining vacuum adsorption and pneumatic gripping, achieving integrated manufacturing of micro-drivers, electronic components, high-precision conductive lines, and structural substrates. By preparing wires through mask scraping, it solves the problems of low precision and difficulty in adapting to micro-circuits in direct writing, improving interconnect reliability and miniaturization level. The direct embedding of mature drivers avoids the polarization process and performance degradation issues required for direct printing of piezoelectric materials, ensuring stable and reliable driving performance. Through in-situ wire fabrication and a closed-loop printing process, it eliminates the risk of post-assembly errors and interconnect failures.

The invention discloses a laser and micro-pen direct writing combined three-dimensional machining system, and belongs to the technical field of flexible electronic manufacturing and multi-process combined machining. In order to solve the problems of process separation and positioning error accumulation in manufacturing of a micro curved surface circuit and a three-dimensional microstructure, the system integrates an ultraviolet laser, a micro-pen direct writing head and a mechanical arm, and a platform integrating laser surface treatment, micro-pen direct writing and curing is constructed. The ultraviolet laser is provided with a CCD camera and a field lens, moves along the Z axis to realize micron-scale positioning and control and is used for surface modification; the micro-pen direct writing head is mounted on the side of the laser and is driven by an independent motor to extrude conductive slurry to realize pattern direct writing; the mechanical arm serves as a workpiece clamping platform, supports posture adjustment of a complex workpiece, and cooperatively completes seamless switching between the laser processing procedure and the direct writing procedure. In the working process, the CCD camera completes positioning of the surface of a workpiece and then is switched to micro-pen direct-writing forming, and finally the laser is reused for curing, so that whole-process closed-loop machining is formed. The device is suitable for metal, plastic, ceramic and other base materials, the manufacturing requirements of micro-curved-surface circuits and surface microstructures are met, and the machining precision and efficiency of complex curved-surface microstructures are improved through multi-axis linkage and multi-process fusion.

This invention discloses a direct printing method for flexible circuits based on a solid-liquid two-phase binary metal system. The method first selects two metals according to a binary metal phase diagram and prepares a binary metal alloy that exhibits a solid-liquid coexistence at the operating temperature. Then, it is physically dispersed with a polymer matrix, a conductivity promoter, and additives to form a composite conductive paste with shear-thinning properties. Finally, the paste is directly deposited onto a flexible substrate via screen printing, direct writing, or inkjet printing, and cured at low temperature or dried at room temperature to obtain a flexible circuit. This invention utilizes the rheological tunability and self-healing properties of solid-liquid two-phase metals, combined with the flexibility and adhesion of the polymer matrix, to solve the problems of easy leakage and patterning difficulties in traditional liquid metals, as well as the high interfacial resistance and poor flexibility of solid metal fillers. It achieves low-temperature, efficient, and low-cost printing fabrication of flexible circuits, with broad application prospects in wearable devices, flexible sensing, smart wearables, and smart packaging.

The application belongs to the technical field of photocuring printing, and particularly relates to a ceramic powder modification method, ceramic slurry and application. The application improves the refractive index of the powder by surface functionalization modification of the ceramic powder, further improves the solidification depth of the slurry, and can meet the solidification of the wall thickness of the ceramic wedge blank when the photocuring auxiliary direct writing printing forms the ceramic wedge blank. The ceramic slurry prepared by using the functionally modified ceramic powder can reduce the surface roughness of the ceramic wedge, so that the surface roughness Ra of the extrusion formed ceramic wedge is reduced to below 0.15 microns (at present, the fluctuation range of the surface of the ceramic blank prepared by using photocuring 3D printing is about 5 microns), the surface of the ceramic blank is uniform and smooth, the problem that the surface precision of the direct writing formed ceramic wedge is difficult to improve is solved, so that the surface roughness value of the ceramic wedge is too large to cause the contamination of the welding nozzle surface, the service life of the wedge is prolonged, and the wear of the metal welding wire is reduced.

This invention belongs to the field of laser direct writing technology and discloses a method for preparing laser-induced graphene and a method based on ultraviolet and infrared dual-laser direct writing. The method includes: patterning a polymer film substrate using an ultraviolet laser, causing the areas of the polymer film substrate irradiated by the ultraviolet laser to absorb laser energy and undergo incomplete reactions, resulting in the decomposition or rearrangement of polymer carbon chains to form a mixture containing amorphous carbon, thus obtaining a film substrate with patterned carbonized products; and globally scanning the film substrate with patterned carbonized products using an infrared laser, causing the patterned carbonized products to absorb infrared laser energy and undergo secondary transformation, resulting in the carbon chain breakage and rearrangement of amorphous carbon into graphene, ultimately yielding LIG products. This method has a simple process flow and efficiently prepares laser-induced graphene with large thickness and excellent conductivity, which can fully meet the application requirements of flexible electronics, energy storage devices, sensors, and other fields.

The application discloses a kind of three-dimensional optical waveguide laser direct writing system and method, the system includes laser, beam expander, rotating motor, slit, focusing lens, motion platform and control system successively arranged along optical path;The light beam incident end of slit is installed with dove prism, rotating motor drives dove prism and slit without relative motion Synchronous rotation;Laser beam is refracted after dove prism with 2ω angular velocity rotation, then penetrates the slit of synchronous rotation and forms high-speed rotating elliptical light spot, forms time average, space isotropic equivalent spherical focus in sample after focusing lens focusing.This application converts dynamic elliptical light spot into equivalent spherical focus by the synchronous linkage of dove prism and rotating slit, eliminates the dependence of traditional direct writing technology on scanning direction, realizes the direct writing processing of high roundness three-dimensional optical waveguide in any scanning direction, and can further improve light field quality and processing precision by adding 4f imaging system.

This invention discloses a self-cleaning high-emissivity blackbody with micro / nano structures and its preparation method, belonging to the field of laser micro / nano processing technology. The method includes: firstly, cleaning the stainless steel sample to be processed; then, using picosecond laser direct writing technology to prepare a micro / nano composite structure on the stainless steel surface; and finally, imparting superhydrophobic properties to the surface through fluorosilane chemical treatment. This invention utilizes the ultrashort pulses and extremely high peak power of picosecond lasers to ablate and remove materials, combined with the high-speed scanning method of a three-dimensional galvanometer processing system. This allows for the simple and rapid preparation of micro / nano composite structures with broad-spectrum high emissivity in an atmospheric environment. Simultaneously, the superhydrophobic properties are achieved through fluorosilane treatment. The prepared surface structure exhibits stability not found in coating methods, and does not decompose over time, showing broad application prospects in fields such as thermal management and spacecraft temperature control.