257 results about "Direct writing" patented technology

The invention belongs to the technical field of polymer additive manufacturing, and relates to a melt electrostatic direct writing preparation method of a polymer fiber scaffold with a continuous gradual change structure, which comprises the following steps of: designing a basic homogeneous pattern according to the transition interface characteristics of a to-be-repaired tissue, and discretizing the basic homogeneous pattern into a dense ordered point array; designing nonlinear transformation functions f and g according to structural change characteristics at a transition interface, mapping points one by one by using the nonlinear transformation functions f and g so as to obtain a point column, performing equidistant sampling on the point column to obtain an expected printing path, and finally performing melt electrostatic direct writing based on the expected printing path so as to obtain the melt electrostatic direct writing. And preparing the polymer fiber scaffold with the continuous gradually-changed structure. According to the method, a curve printing process is adopted to simulate a smooth transition interface between tissues, so that the structure and mechanical bionic degree of the polymer fiber scaffold are improved.

The invention discloses direct writing forming equipment and method for a continuous fiber reinforced ceramic matrix composite, the direct writing forming equipment comprises an XYZ-axis motion platform, an extrusion nozzle, an ultrasonic transducer, a screw propeller, a wire feeder, a forming table and a curing mechanism, the extrusion nozzle is mounted on the XYZ-axis motion platform, and an outlet is formed in the bottom of the extrusion nozzle; the screw propeller comprises a motor and a screw, the motor is mounted on the extrusion nozzle and connected with the screw to drive the screw to rotate, so that the screw shears ceramic slurry in the extrusion nozzle and extrudes the ceramic slurry from an outlet of the extrusion nozzle, and a through hole is formed in the screw. Continuous fibers sent out by the wire feeder penetrate through the screw rod and then are discharged from an outlet of the extrusion nozzle; and the curing mechanism is used for curing the ceramic slurry on the forming table. The viscosity of the ceramic slurry is reduced through the shearing effect of the screw rod, blockage is prevented, and the extrusion nozzle can disperse nano-particle aggregates in the ceramic slurry through the vibration effect of ultrasonic waves.

The invention discloses a bismuth telluride nanopore maskless direct writing preparation method based on electron beam irradiation, and belongs to the technical field of nanometer manufacturing. The method comprises the following steps: firstly, constructing an initial nanopore in a two-dimensional bismuth telluride material by utilizing a converged electron beam; and then the aperture size of the nanopore is accurately regulated and controlled by adjusting the beam density of the electron beam. The method effectively solves the key technical bottlenecks of interface chemical residue pollution caused by a traditional photoresist mask process, intrinsic defect formation caused by high-energy particle bombardment and the like, and breaks through the limitation of an existing etching technology in the aspect of sub-nanoscale structure precision control; precise control of the aperture of the nanopore can be achieved by adjusting the irradiation intensity of the electron beam, and the method has the advantages of being easy and convenient to operate, low in cost, environmentally friendly and the like and can be widely applied to the fields of nanometer electronic devices, sensors and the like.

The invention discloses a method for improving optical storage capacity based on ultraviolet femtosecond laser multi-cycle low-temperature direct writing, and belongs to the technical field of laser processing. Leveling the sample table; designing a random data structure and calculating parameters; preparing a random data structure; reading and characterizing a random data structure; according to the method, firstly, ultraviolet femtosecond laser with the wavelength of 343 nm is used for replacing infrared / visible band laser used in traditional five-dimensional optical storage, secondly, a multi-cycle scanning mode is used for replacing an existing scanning mode, and birefringence modification with the smaller size is induced in quartz glass at low temperature; the tiny birefringence modification is used for realizing data writing and reading of the optical memory with higher storage density; according to the multi-cycle scanning mode, heat accumulation in the machining process is affected by changing single-point one-way acting time, so that the dot spacing is shortened, and the storage capacity is increased.

The invention provides a cache-based asynchronous direct writing method and an artificial intelligence chip, and relates to the technical field of artificial intelligence chips, the method comprises the following steps: detecting respective status bits of a plurality of cache groups in a cache; when the status bit of the cache group indicates that a cache line meeting a preset condition exists in the cache group, the link state between the cache and the main memory is detected, and the preset condition is that refreshing prompt information is contained and the state is marked as a dirty state; and when the link state is an idle state and the data request of the processing core is not received, the cache lines meeting a preset condition in the cache group are evicted to the main memory. When the link between the cache and the main memory is idle, the cache line which contains the refresh prompt information and is marked as a dirty state is timely evicted into the main memory, so that the interconnection bus bandwidth between the cache and the main memory is in a dynamic balance state, the interconnection bus bandwidth between the cache and the main memory is fully utilized, and the interconnection bus bandwidth between the cache and the main memory is not influenced. And meanwhile, the excessive pressure of the interconnection bus bandwidth between the cache and the main memory is avoided.

The invention discloses a scanning type exposure method and system adopting a parallel digital micromirror array, and relates to the technical field of photoetching exposure and maskless direct writing of mask.The scanning type exposure method comprises the steps that parallel digital micromirror initial mapping is established through a reference target exposure detection registration method; generating a block distortion field parameter table according to the initial mapping of the parallel digital micromirror, determining a micro-mark insertion position based on the block distortion field parameter table, and generating an expected coordinate; performing micro-mark exposure on the expected coordinate position, acquiring imaging data of the inserted micro-mark position, extracting an actual measurement coordinate from the imaging data of the micro-mark position, calculating a residual error by taking the expected coordinate and the actual measurement coordinate as an input difference, and writing the residual error into a residual error set; incremental fitting is carried out according to the residual set, the block distortion field parameter table is updated, and the exposure controller controls the parallel digital micromirror array to remap the pattern according to the updated block distortion field parameter table and triggers exposure. The method provided by the invention has better effects in coordinate mapping consistency and block parameter manageability.

The invention discloses a multi-focus translation staggered close connection type parallel laser direct writing rapid processing method which comprises the steps that a multi-focus module and a laser direct writing scanning device are built, the multi-focus module generates multi-beam arrays which are arranged in parallel, and after the multi-beam arrays are focused by the laser direct writing scanning device, multi-focus laser arrays which are arranged in parallel at equal intervals are formed at a focal plane; a multi-focus translation staggered scanning strategy is designed, and in the scanning strategy, direct-writing machining areas of all focuses are interspersed and staggered, so that a close-connection direct-writing machining area is formed; the multi-focus laser arrays arranged in parallel at equal intervals perform scanning through a scanning strategy, in the scanning process, each focus is controlled through an independent laser switch of the focus, the multi-focus laser arrays interact with a photoetching material, and rapid laser direct writing of any pattern to be processed is achieved in a close connection direct writing processing area. According to the invention, one-mirror-to-bottom type seamless laser direct-writing scanning can be realized, and the multi-focus laser direct-writing processing efficiency and quality can be effectively improved.

The invention relates to high-solid-content water-based silicon nitride slurry for direct writing forming and a preparation method of the high-solid-content water-based silicon nitride slurry. The high-solid-content water-based silicon nitride slurry for direct writing molding comprises 60-76 wt% of silicon nitride powder, 0.2-1 wt% of a dispersing agent, 0.1-3 wt% of a thickening agent, a sintering aid and water, the sintering aid powder accounts for 0-12wt% of the total mass of the silicon nitride powder and the sintering aid.

The utility model discloses a 3D printer combining photocuring with ink direct writing, which comprises a printing platform, an injector and a laser, and a printing groove for accommodating ceramic slurry is formed in the printing platform; the injector is arranged above the printing platform and connected with a driving mechanism erected on the printing platform, and a conveying channel communicating with the metal slurry conveying pipe, a negative pressure cavity communicating with the outlet end of the conveying channel, a waterproof breathable film arranged between the negative pressure cavity and the conveying channel and a material extruding piece are arranged in the injector. The driving end of the material extruding part is arranged in the conveying channel so as to extrude and convey the metal slurry to an outlet of the conveying channel; the laser is connected with the injector; according to the device, residual bubbles in the metal slurry can be effectively removed, so that the situation of discharging interruption of a printing spray head is avoided, and the forming quality of a printed finished product is guaranteed.

The invention belongs to the technical field of biomedical engineering and tissue engineering, and particularly relates to an acellular matrix modified bionic micro-fluidic organ chip constructed by 3D printing composite near-field direct writing as well as a preparation method and application of the bionic micro-fluidic organ chip. According to the bionic micro-fluidic organ chip prepared by the invention, the microstructure and physiological similarity of a model are remarkably improved, the problems of insufficient bionic property, single cell and the like at present are solved, and the preparation method is simple, is suitable for batch production and solves the problem of high production cost. The invention provides a new technical direction for the construction of the bionic organ model.

The present application discloses a method for direct-writing printing of curved surface conformal sensors based on a five-axis motion platform, which relates to the field of direct-writing printing technology. The method performs grid discretization processing on the printed curved surface in a three-dimensional digital model of a three-dimensional structural part and then designs a target printing trajectory, thereby simplifying the process of complex curved surface trajectory design and avoiding trajectory distortion caused by existing two-dimensional to three-dimensional projection methods; then, a two-axis rotation mechanism is used in a direct-writing printing system based on a five-axis motion platform to perform posture adjustment, and a three-axis motion mechanism is used to perform position adjustment and printing. Direct manufacturing on a three-dimensional structural part can be performed when the printing nozzle extrudes ink vertically downward along the normal direction of the contact surface, thereby improving the manufacturing efficiency of curved surface conformal sensors, avoiding pattern distortion caused by transfer, and improving the accuracy and conformality of the manufactured curved surface conformal sensors. The method is suitable for promotion and application in the preparation of curved surface electronics.

The invention discloses a nonlinear path planning method for a melt electrostatic direct writing stent guided by micropore characteristics, and relates to the technical field of additive manufacturing. Comprising the following steps: according to design requirements, defining binary functions L (x, y) and W (x, y), and respectively controlling spatial distribution of pore length and width of micropores; an XY plane is divided into orthogonal reference line grids through two groups of equidistant reference lines parallel to an X axis and a Y axis, namely an X (y) line and a Y (x) line, and each reference line can determine an upright plane, namely an X (y) plane and a Y (x) plane; and then determining geometric intersection points of the L / 2 (x, y) and W / 2 (x, y) function curves and an X (y) plane and a Y (x) plane determined by the reference line as path intersection points by using zigzag broken lines, after all the intersection points are obtained, sequentially connecting the intersection points to obtain a designed nonlinear path, and carrying out feasibility verification on the generated nonlinear path. The method provides a parameterized solution for micro-structure bionic design of the MEW stent, and is suitable for stent manufacturing with complex tissue regeneration requirements.

The present disclosure provides a high-temperature resistant nano-copper produced by laser direct writing, a preparation method and an application thereof. The high-temperature resistant nano-copper exhibits excellent oxidation resistance, thermal stability and superior conductivity. In this disclosure, the preparation is simple, and the nano-copper oxide ink can be stored for extended periods without being affected by oxidation. It is suitable for various manufacturing processes including printing, coating, and other similar methods. Moreover, based on laser direct writing, the processing efficiency is high, enabling the one-step integration of multi-performance of the high-temperature resistant nano-copper. The high-temperature resistant nano-copper described in the present disclosure can be used as an interconnection circuit in an integrated sensor system based on all-laser in-situ direct writing, and can be widely applied in fields of aerospace, automobile, electronics, etc.

The invention discloses a laser-assisted direct writing printing perception monitoring and intelligent prediction method and system, and the system comprises an optical dynamic focusing module, a liquid supply module, a temperature / modulus feedback module, a real-time morphology observation module, a printing platform motion module, a performance prediction and parameter reverse optimization module, and a programming controller cooperating with the modules. Further, through the steps of data acquisition, prediction model construction, modeling partition, parameter optimization and automatic process and intelligent printing, a multi-parameter coupling prediction model among temperature field parameters, printing size parameters and structural modulus parameters is constructed through a performance prediction and parameter reverse optimization module; according to the in-situ monitoring system, high-resolution in-situ multi-parameter detection and printing performance prediction feedback control in the printing process can be met at the same time, key performance indexes can be dynamically perceived and predicted in the printing process, and parameter self-adaptive regulation and control are achieved.

The invention relates to a device and a method for manufacturing a wave absorber through direct writing of photo-thermal auxiliary in-situ cured ink. The device comprises an ink direct writing assembly, a Delta mechanical arm assembly, an ultraviolet light assembly and a heating assembly, and is used for preparing the wave absorber with a complex structure and multiple loss mechanisms. According to the method, composite light-cured resin slurry containing a wave-absorbing agent is extruded through an ink direct-writing spray head, and in-situ light curing and heat curing of the printed composite light-cured resin slurry are achieved through an annular ultraviolet light LED lamp installed below an ink direct-writing printing head and a heating assembly arranged in a printing platform. And the formability and the printing precision of the ink direct-writing additive manufacturing wave absorber are improved.

The invention discloses a deviation rectification and alignment method and device applied to a direct-writing photoetching machine, a medium and a photoetching machine.The deviation rectification and alignment method applied to the direct-writing photoetching machine comprises the steps that when a medium layer has deviation rectification requirements, partition rigid transformation parameters of chip theoretical patterns in the medium layer corresponding to chips in a chip layer are obtained; the partition rigid transformation parameter comprises displacement; obtaining the iteration displacement step length based on the displacement of the chip theoretical pattern in the dielectric layer corresponding to each chip; the position of the chip theoretical pattern in the dielectric layer corresponding to each chip is corrected based on the iteration displacement step length until the dielectric layer and the chip layer meet a first condition, the chip theoretical pattern in the dielectric layer moves in the vector direction of the displacement during correction, and the dielectric layer and the chip layer meet a second condition; the vector direction is the direction from the center coordinate of the theoretical pattern of the chip on the dielectric layer to the center coordinate of the chip corresponding to the chip layer. According to the method provided by the invention, the alignment precision in a multi-chip packaging process is improved, and the condition of inaccurate pattern alignment caused by patch errors is corrected.

The invention relates to a method for preparing grain-oriented silicon nitride ceramic through direct-writing 3D printing. The method for preparing the grain-oriented silicon nitride ceramic through direct-writing molding 3D printing comprises the following steps: (1) mixing silicon nitride powder, a sintering aid, a dispersing agent and deionized water to obtain homogeneous direct-writing molding slurry; adding beta-Si3N4 whiskers into the slurry, carrying out primary high-speed stirring, then adding a thickening agent into the slurry, and carrying out secondary high-speed stirring, so as to obtain silicon nitride ceramic slurry of which the rheological property meets the printing requirement; (2) carrying out layer-by-layer printing on the silicon nitride ceramic slurry by adopting a 3D printing direct writing molding technology, and inducing Si3N4 whiskers to be directionally arranged along the printing direction by utilizing extrusion shearing force to obtain a 3D printed silicon nitride blank; and (3) drying, degreasing and sintering the obtained 3D printed silicon nitride green body to obtain the grain-oriented silicon nitride ceramic.

The utility model discloses an English writing corrector with an adjustable angle, which relates to the technical field of writing correctors and comprises a straight rule body, a vernier component and a wavy sub-rule, the straight rule body is slidably connected with the vernier component, a groove is arranged on the straight rule body, the wavy sub-rule is detachably connected with the groove, and the straight rule body is provided with a groove. The vernier assembly comprises a sliding head base, a rotating sliding head and a locking screw, and the rotating sliding head is rotationally connected with the sliding head base through the locking screw. When the straight rule is used, the vernier assembly slides on the straight rule body, a user can conveniently and rapidly draw a plurality of basically equidistant lines on blank paper, the slotted hole in the rotating sliding head can help a learner to rapidly draw four-line three-grids of different styles, grid drawing efficiency is effectively improved, and practicability is good. Meanwhile, the design of the child-mother ruler jigsaw puzzle increases practicability, the small ruler can have the function of drawing straight lines and wave lines at the same time, direct writing can be conducted in the ruler through the groove, and the bad writing habit is corrected.

The present invention discloses an integrated method for fabricating a frequency selective surface (FSS) for a complex curved cavity structure. This method utilizes multi-process composite 3D printing as a technical approach, employing FDM technology to fabricate a water-soluble substrate. 3D direct writing technology is then used to create an inner FSS pattern on the substrate surface. The cavity structure itself is then printed on top of the substrate, and an outer FSS pattern is then created on the surface of the cavity structure. The water-soluble substrate is then dissolved, ultimately resulting in a complex curved cavity FSS structure with frequency selective patterns on both the inner and outer surfaces. Furthermore, through the practice of this invention, surface treatment measures are required for the 3D printed structure before fabricating the FSS pattern, improving the quality and precision of the FSS metallization pattern and ensuring the integrated fabrication of the complex curved cavity structure and the inner and outer FSS patterns.

The invention discloses SiBCN ceramic slurry for direct-writing type 3D printing as well as a preparation method and a printing method of the SiBCN ceramic slurry, and belongs to the field of ceramic additive manufacturing. The invention aims to solve the problem of non-uniform selection and dispersion of SiBCN precursor filler in existing direct writing printing. And the slurry is prepared from cured polyborosilazane (PBSZ) powder, an inorganic rheological additive, a rheological synergist and a polyborosilazane (PBSZ) liquid. The preparation method comprises the following steps: 1, curing polyborosilazane (PBSZ); 2, ball-milling and crushing; (3) weighing; and 4, preparing slurry. The printing method comprises the steps of 1, printing a primary blank; and 2, curing and sintering. The SiBCN ceramic slurry for direct-writing type 3D printing and the preparation and printing thereof are provided by the invention.

The present invention discloses a system and method for fabricating a double-ring structure in one step based on laser direct writing. The system includes a continuous laser, a beam expansion system, an attenuation plate, a half-wave plate, an optical shutter, a spectrometer, an oil-immersion objective lens, and a positive-negative adjustable photoresist sample arranged along an optical path; further includes a three-dimensional high-precision nanopositioning translation stage, a lens, a CCD camera, and a computer; the spectrometer focuses an incident continuous-wave laser beam onto the surface of the positive-negative adjustable photoresist sample via the oil-immersion objective lens, and a portion of the laser beam incident on the sample surface is reflected back onto the spectrometer and then irradiated onto a third lens; the oil-immersion objective lens focuses the laser beam onto the sample, thereby fabricating the double-ring structure in one step. The present invention can obtain the double-ring structure in one step through a single process at a lower cost, rather than through two or more cumbersome steps; and the inner and outer diameters of the desired double-ring structure can be flexibly changed by changing the power density and the direct writing time.

The present invention provides an electron beam direct writing device, comprising a control module and at least one electron beam source output module. The control module is used for generating i types of control signals; i is an integer greater than or equal to 2; any one of the electron beam source output module is enabled when receiving the i types of control signals at the same time, and then emits a corresponding electron beam; each electron beam source output module comprises a receiving unit, a beam current intensity regulation and control unit and an output unit; the beam current intensity regulation and control unit is used for providing an intensity regulation and control signal; when i control ends of each receiving unit receive the i types of control signals at the same time, the receiving unit generates an enable signal; each output unit emits a corresponding electron beam on the basis of a received enable signal and the intensity regulation and control signal and regulates and controls the beam current intensity of the electron beam by means of the intensity regulation and control signal. The present invention effectively solves the problems of inconsistent direct writing times, inconsistent uniformity, and the like caused by inconsistent beam current intensities of electron beam sources in an electron beam source array.

The invention discloses a geometric phase metasurface high-flux laser direct writing system and method, and the system comprises a femtosecond laser, a beam expander, a angular dispersion compensation module, a digital micromirror array, a second 4F system, a spatial light modulator, a fifth lens and an objective lens according to the light advancing direction. Wherein the spatial light modulator is used for performing phase modulation on each unit light spot from the digital micromirror array based on a loaded holographic phase diagram to form a rod-shaped light spot array, and the rod-shaped light spot array forms parallel light transmitted at different angles through the fifth lens and converges at an entrance pupil of the objective lens together. And finally, a parallel direct-writing light spot array is formed in the two-photon photoresist, and geometric phase metasurface unit structure array printing is completed. According to the system, high-flux and high-flexibility direct-writing manufacturing of the geometric phase type metasurface is finally realized.

The present invention provides a preparation method for a surface of a flexible recessed microstructure based on direct writing printing, which relates to the technical field of direct writing printing and includes: coating a polymer on a support material and pre-curing to form a viscoelastic substrate; using a sacrificial ink to perform direct writing printing on the viscoelastic substrate to obtain a flexible material with recessed microstructures on the surface. The present invention uses a pre-cured viscoelastic material as the printing substrate, and a solution that is immiscible with the viscoelastic substrate, has shear thinning characteristics, and meets the conditions of direct writing printing as the direct writing printing ink, and cooperates with the direct writing printing technology to prepare a patterned microstructure, improve the printing accuracy, ensure the quality of the microstructure finished product, obtain a patterned surface with controllable microstructures, has the characteristics of being simple and convenient, fast, efficient, low-cost, green and environmentally friendly, can also avoid the pollution generated during processes such as mask and exposure etching, and can control the size of the extruded ink by adjusting the inner diameter of the nozzle and the extrusion pressure, with simple and flexible operation and strong controllability.

The present invention relates to the field of 3D printing technology, and discloses a quality monitoring method, system, equipment and medium for direct writing molding circuits. The method comprises: determining a captured image of a discharge area according to a needle position; performing binarization processing and connected domain analysis on the captured image and a preset template image, respectively, to determine the discharge area of ​​the captured image and the discharge area of ​​the preset template image; performing a difference image subtraction between the captured binary image and the template binary image, and performing connected domain analysis on the difference image to obtain a difference analysis result; calculating the discharge area ratio of the captured image and the preset template image, and monitoring the quality of the direct writing molding circuit according to the discharge area ratio difference analysis result. The present invention analyzes the image of the discharge area, makes the judgment of material breakage more accurate, and can also perform material breakage detection on materials in various states. By calculating the discharge area, an early warning can be given before the material is completely exhausted, thereby ensuring the effect of direct writing molding.

The application provides a hot-melt direct-writing heating system and a metal-melting direct-writing forming method. The hot-melt direct-writing heating system comprises a barrel exhaust mechanism (1), a feeding heating system and a printing substrate heating system (2). The feeding heating system comprises a barrel heating mechanism (4) for heating a barrel (3) and a needle heating mechanism (5) for heating a direct-writing needle (6). The printing substrate heating system comprises a suction disc (21), a suction disc heating mechanism (22) and a cooling mechanism (23) for cooling the suction disc heating mechanism in sequence. The suction disc comprises a suction disc surface (211) and a high-temperature-resistant fixing ring (212) arranged along the circumference of the suction disc surface. The suction disc surface is uniformly provided with a plurality of micropores. The application independently designs two heating sources to heat the barrel and the direct-writing needle respectively, and the barrel exhaust mechanism exhausts all oxygen. The micropores arranged on the suction disc surface can uniformly distribute the vacuum on the suction disc surface, thereby improving the adsorption uniformity.

The present application relates to the technical field of additive manufacturing, and particularly relates to a self-compensation printing head and method, an extrusion direct writing device and a working method. The printing head comprises a shell, a barrel, a screw and a self-compensation assembly; the lower part of the shell has a cavity, the barrel is rotatably installed in the cavity, and the screw is installed in the barrel for extruding material; the self-compensation assembly comprises an outer magnetic pole, an inner magnetic pole and a potentiometer, the outer magnetic pole is arranged on the inner wall of the cavity of the shell, the inner magnetic pole is arranged on the outer wall of the barrel and is arranged in the same polarity opposite to the outer magnetic pole, and the potentiometer is also installed on the barrel; the magnetic force of the outer magnetic pole and the inner magnetic pole makes the barrel at an initial angle, and when the material shear force increases, the magnetic force is overcome to drive the barrel and the potentiometer to rotate. According to the present application, the screw rotating speed can be automatically adjusted in real time according to the change of the material shear force, the stable control of the extrusion amount of different materials is realized, and the precision, quality and efficiency of multi-material direct writing forming are improved.

The invention relates to the technical field of electron beam direct writing, in particular to an electron beam direct writing system and a chip production system, and the electron beam direct writing system comprises a positioning module which is used for determining an alignment point position of a to-be-processed surface; the first multiple electron beam direct writing module and the at least one second multiple electron beam direct writing module are located in the target cavity, and the first multiple electron beam direct writing module is used for generating a first multiple electron beam and writing a preset pattern into the to-be-processed surface through the first multiple electron beam based on the alignment point position; and the second multiple electron beam direct writing module is used for generating a second multiple electron beam after the first multiple electron beam direct writing module writes the preset pattern into the to-be-processed surface or in the process of writing the preset pattern into the to-be-processed surface, and repeatedly writing the preset pattern into the to-be-processed surface through the second multiple electron beam based on the alignment point location so as to complete the direct writing operation of the to-be-processed surface. Therefore, according to the system, the writing speed is increased through application of multiple electron beams, and meanwhile the direct writing quality is improved through repeated writing.

The application belongs to the technical field of electrode materials, and specifically discloses an electrode material based on ink direct writing 3D printing and a preparation method thereof. By controlling the rheological property of silver / silver chloride ink in ink direct writing, silver / silver chloride filaments of different sizes are printed. The silver / silver chloride ink in filament form is used to print silver / silver chloride rods or sheets with high surface area in a hollow shape. After degreasing and sintering at different temperatures, a silver / silver chloride reference electrode with high specific surface area and high mechanical strength is obtained. The reference electrode has higher specific surface area and mechanical strength, stronger impact and vibration resistance, lower polarization resistance, better long-term stability, higher polarization resistance of the electrode body with the same mass, minimum potential deviation under the same current, and minimum open circuit potential drift in natural seawater with certain temperature and salinity.

The application belongs to the technical field of ceramic materials, and discloses a carbon fiber reinforced silicon carbide ceramic composite material and a direct writing forming method.The direct writing forming method comprises the following steps: mixing carbon fibers and silicon carbide powder to obtain mixed powder, mixing a solvent and an additive to obtain a mixed solution, then mixing the mixed powder and the mixed solution, stirring and defoaming to obtain carbon fiber reinforced ceramic slurry; printing and forming the carbon fiber reinforced ceramic slurry by using a direct writing forming technology to obtain a green body; curing and drying the green body to remove free water of the green body; and performing debinding and sintering on the green body from which the free water is removed.The application can realize one-time forming of a product with a complex structure by using the direct writing forming method, and does not need to use a mold and perform complex densification treatment, so that the preparation cost is low; and the prepared product has no warping and cracking problems, and has good bending strength and fracture toughness.