The invention discloses a deviation rectification and alignment method and device applied to a direct-writing photoetching
machine, a medium and a photoetching
machine.The deviation rectification and alignment method applied to the direct-writing photoetching
machine comprises the steps that when a medium layer has deviation rectification requirements, partition
rigid transformation parameters of
chip theoretical patterns in the medium layer corresponding to chips in a
chip layer are obtained; the partition
rigid transformation parameter comprises displacement; obtaining the iteration displacement step length based on the displacement of the
chip theoretical pattern in the
dielectric layer corresponding to each chip; the position of the chip theoretical pattern in the
dielectric layer corresponding to each chip is corrected based on the iteration displacement step length until the
dielectric layer and the chip layer meet a first condition, the chip theoretical pattern in the
dielectric layer moves in the vector direction of the displacement during correction, and the
dielectric layer and the chip layer meet a second condition; the vector direction is the direction from the center coordinate of the theoretical pattern of the chip on the
dielectric layer to the center coordinate of the chip corresponding to the chip layer. According to the method provided by the invention, the alignment precision in a multi-chip packaging process is improved, and the condition of inaccurate pattern alignment caused by patch errors is corrected.